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Journal of Materials Science, volume 56, issue 13, pages 7840-7848

Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys

Straumal Boris 1, 2, 3, 4
Kogtenkova Olga 2
Bulatov Marat 5
NEKRASOV ALEXEI 6
Baretzky Brigitte 1
Straumal Alexandr 2, 4
Publication typeJournal Article
Publication date2021-01-03
Quartile SCImago
Q1
Quartile WOS
Q2
Impact factor4.5
ISSN00222461, 15734803
General Materials Science
Mechanical Engineering
Mechanics of Materials
Abstract
The paper studies the wetting of grain boundary triple junctions (GB TJs) by the second solid phase (intermetallic) δ in the Cu–In alloys. In this system, the portion of grain boundaries in a copper-based solid solution (Cu), which are "wetted" by the second solid phase δ, changes non-monotonically with increasing temperature. At first, the portion of such completely wetted GBs increases from zero to almost 100% when the sample is heated, and then quickly falls back to zero. The condition of complete wetting for the GB TJs (σGB > 1.73 σSS) is less stringent than for the GBs (σGB > 2 σSS). Therefore, if the transition from incomplete to complete wetting occurs with an increase in temperature, then all GB TJs should become completely wetted at a temperature TWTJ, lower than the temperature TWGB, at which all GBs become completely wetted. In this work on the Cu–In system, it was found experimentally for the first time that the wetting of the GB TJs also behaves non-monotonously. The percentage of wetted GB TJs also increases to 100% at first and then falls with increasing temperature. In this case, the portion of wetted GB TJs exceeds the portion of wetted GBs not only when it increases with increasing temperature, but also then, with the subsequent disappearance of fully wetted GBs. Grain boundary triple junctions in (Cu-In) solid solution are “wetted” by the δ intermetallic in broader temperature interval than grain boundaries.

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Straumal B. et al. Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys // Journal of Materials Science. 2021. Vol. 56. No. 13. pp. 7840-7848.
GOST all authors (up to 50) Copy
Straumal B., Kogtenkova O., Bulatov M., NEKRASOV A., Baranchikov A., Baretzky B., Straumal A. Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys // Journal of Materials Science. 2021. Vol. 56. No. 13. pp. 7840-7848.
RIS |
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RIS Copy
TY - JOUR
DO - 10.1007/s10853-020-05674-4
UR - https://doi.org/10.1007%2Fs10853-020-05674-4
TI - Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys
T2 - Journal of Materials Science
AU - Straumal, Boris
AU - Kogtenkova, Olga
AU - Bulatov, Marat
AU - NEKRASOV, ALEXEI
AU - Baranchikov, Alexandr
AU - Baretzky, Brigitte
AU - Straumal, Alexandr
PY - 2021
DA - 2021/01/03 00:00:00
PB - Springer Nature
SP - 7840-7848
IS - 13
VL - 56
SN - 0022-2461
SN - 1573-4803
ER -
BibTex |
Cite this
BibTex Copy
@article{2021_Straumal
author = {Boris Straumal and Olga Kogtenkova and Marat Bulatov and ALEXEI NEKRASOV and Alexandr Baranchikov and Brigitte Baretzky and Alexandr Straumal},
title = {Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys},
journal = {Journal of Materials Science},
year = {2021},
volume = {56},
publisher = {Springer Nature},
month = {jan},
url = {https://doi.org/10.1007%2Fs10853-020-05674-4},
number = {13},
pages = {7840--7848},
doi = {10.1007/s10853-020-05674-4}
}
MLA
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MLA Copy
Straumal, Boris, et al. “Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys.” Journal of Materials Science, vol. 56, no. 13, Jan. 2021, pp. 7840-7848. https://doi.org/10.1007%2Fs10853-020-05674-4.
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