Open Access
In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives
Amirali Amirsoleimani
1
,
Fabien Alibart
2, 3, 4
,
Victor Yon
2, 3
,
Jianxiong Xu
1
,
M Reza Pazhouhandeh
1
,
Serge Ecoffey
2, 3
,
Y. Beilliard
2, 3
,
Roman Genov
1
,
D Drouin
2, 3
3
Laboratoire Nanotechnologies Nanosystemes (LN2) CNRS UMI-3463 3IT Sherbrooke Quebec J1K 0A5 Canada
|
Publication type: Journal Article
Publication date: 2020-08-23
scimago Q1
wos Q1
SJR: 1.140
CiteScore: 4.7
Impact factor: 6.1
ISSN: 26404567
Abstract
The low communication bandwidth between memory and processing units in conventional von Neumann machines does not support the requirements of emerging applications that rely extensively on large sets of data. More recent computing paradigms, such as high parallelization and near‐memory computing, help alleviate the data communication bottleneck to some extent, but paradigm‐shifting concepts are required. In‐memory computing has emerged as a prime candidate to eliminate this bottleneck by colocating memory and processing. In this context, resistive switching (RS) memory devices is a key promising choice, due to their unique intrinsic device‐level properties, enabling both storing and computing with a small, massively‐parallel footprint at low power. Theoretically, this directly translates to a major boost in energy efficiency and computational throughput, but various practical challenges remain. A qualitative and quantitative analysis of several key existing challenges in implementing high‐capacity, high‐volume RS memories for accelerating the most computationally demanding computation in machine learning (ML) inference, that of vector‐matrix multiplication (VMM), is presented. The monolithic integration of RS memories with complementary metal–oxide–semiconductor (CMOS) integrated circuits is presented as the core underlying technology. The key existing design choices in terms of device‐level physical implementation, circuit‐level design, and system‐level considerations is reviewed and an outlook for future directions is provided.
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Total citations:
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Citations from 2024:
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(50.58%)
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Amirsoleimani A. et al. In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives // Advanced Intelligent Systems. 2020. Vol. 2. No. 11. p. 2000115.
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Amirsoleimani A., Alibart F., Yon V., Xu J., Pazhouhandeh M. R., Ecoffey S., Beilliard Y., Genov R., Drouin D. In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives // Advanced Intelligent Systems. 2020. Vol. 2. No. 11. p. 2000115.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1002/aisy.202000115
UR - https://doi.org/10.1002/aisy.202000115
TI - In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives
T2 - Advanced Intelligent Systems
AU - Amirsoleimani, Amirali
AU - Alibart, Fabien
AU - Yon, Victor
AU - Xu, Jianxiong
AU - Pazhouhandeh, M Reza
AU - Ecoffey, Serge
AU - Beilliard, Y.
AU - Genov, Roman
AU - Drouin, D
PY - 2020
DA - 2020/08/23
PB - Wiley
SP - 2000115
IS - 11
VL - 2
SN - 2640-4567
ER -
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@article{2020_Amirsoleimani,
author = {Amirali Amirsoleimani and Fabien Alibart and Victor Yon and Jianxiong Xu and M Reza Pazhouhandeh and Serge Ecoffey and Y. Beilliard and Roman Genov and D Drouin},
title = {In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives},
journal = {Advanced Intelligent Systems},
year = {2020},
volume = {2},
publisher = {Wiley},
month = {aug},
url = {https://doi.org/10.1002/aisy.202000115},
number = {11},
pages = {2000115},
doi = {10.1002/aisy.202000115}
}
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MLA
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Amirsoleimani, Amirali, et al. “In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives.” Advanced Intelligent Systems, vol. 2, no. 11, Aug. 2020, p. 2000115. https://doi.org/10.1002/aisy.202000115.