Journal of Materials Science, volume 46, issue 5, pages 1424-1438
High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix
Publication type: Journal Article
Publication date: 2010-09-30
Journal:
Journal of Materials Science
Quartile SCImago
Q1
Quartile WOS
Q2
Impact factor: 4.5
ISSN: 00222461, 15734803
General Materials Science
Mechanical Engineering
Mechanics of Materials
Abstract
Tungsten coatings with thickness of 5–500 nm are applied onto plane-faced synthetic diamonds with particle sizes of about 430 and 180 μm. The composition and structure of the coatings are investigated using scanning electron microscopy, X-ray spectral analysis, X-ray diffraction, and atomic force microscopy. The composition of the coatings varies within the range W–W2C–WC. The average roughness, R a, of the coatings’ surfaces (20–100 nm) increases with the weight–average thickness of the coating. Composites with a thermal conductivity (TC) as high as 900 W m−1 K−1 are obtained by spontaneous infiltration, without the aid of pressure, using the coated diamond grains as a filler, and copper or silver as a binder. The optimal coating thickness for producing a composite with maximal TC is 100–250 nm. For this thickness the heat conductance of coatings as a filler/matrix interface is calculated as G = (2–10) × 107 W m−2 K−1. The effects of coating composition, thickness and roughness, as well as of impurities, on wettability during the metal impregnation process and on the TC of the composites are considered.
Citations by journals
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Elsevier
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Springer Nature
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Multidisciplinary Digital Publishing Institute (MDPI)
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Taylor & Francis
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Taylor & Francis
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Wiley
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Wiley
4 publications, 2.48%
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American Chemical Society (ACS)
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American Chemical Society (ACS)
3 publications, 1.86%
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Pleiades Publishing
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Pleiades Publishing
3 publications, 1.86%
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Trans Tech Publications
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3 publications, 1.86%
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Thomas Telford
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2 publications, 1.24%
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SAGE
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SAGE
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IOP Publishing
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IOP Publishing
2 publications, 1.24%
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Royal Society of Chemistry (RSC)
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Royal Society of Chemistry (RSC)
2 publications, 1.24%
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American Institute of Physics (AIP)
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American Institute of Physics (AIP)
1 publication, 0.62%
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World Scientific
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World Scientific
1 publication, 0.62%
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The Electrochemical Society
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The Electrochemical Society
1 publication, 0.62%
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University of Science and Technology Beijing
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University of Science and Technology Beijing, 1, 0.62%
University of Science and Technology Beijing
1 publication, 0.62%
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Japan Society of Applied Physics
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Japan Society of Applied Physics
1 publication, 0.62%
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SPIE
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SPIE
1 publication, 0.62%
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Hindawi Limited
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Hindawi Limited
1 publication, 0.62%
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Annual Reviews
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Annual Reviews
1 publication, 0.62%
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American Scientific Publishers
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American Scientific Publishers
1 publication, 0.62%
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- We do not take into account publications that without a DOI.
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Abyzov A. M., Kidalov S. V., Shakhov F. M. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix // Journal of Materials Science. 2010. Vol. 46. No. 5. pp. 1424-1438.
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Abyzov A. M., Kidalov S. V., Shakhov F. M. High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix // Journal of Materials Science. 2010. Vol. 46. No. 5. pp. 1424-1438.
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TY - JOUR
DO - 10.1007/s10853-010-4938-x
UR - https://doi.org/10.1007%2Fs10853-010-4938-x
TI - High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix
T2 - Journal of Materials Science
AU - Abyzov, Andrey M
AU - Kidalov, Sergey V
AU - Shakhov, Fedor M
PY - 2010
DA - 2010/09/30 00:00:00
PB - Springer Nature
SP - 1424-1438
IS - 5
VL - 46
SN - 0022-2461
SN - 1573-4803
ER -
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@article{2010_Abyzov,
author = {Andrey M Abyzov and Sergey V Kidalov and Fedor M Shakhov},
title = {High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix},
journal = {Journal of Materials Science},
year = {2010},
volume = {46},
publisher = {Springer Nature},
month = {sep},
url = {https://doi.org/10.1007%2Fs10853-010-4938-x},
number = {5},
pages = {1424--1438},
doi = {10.1007/s10853-010-4938-x}
}
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Abyzov, Andrey M., et al. “High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix.” Journal of Materials Science, vol. 46, no. 5, Sep. 2010, pp. 1424-1438. https://doi.org/10.1007%2Fs10853-010-4938-x.