volume 108 issue 1-2 pages 603-611

Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system

Publication typeJournal Article
Publication date2020-05-18
scimago Q1
wos Q2
SJR0.706
CiteScore5.9
Impact factor3.1
ISSN02683768, 14333015
Computer Science Applications
Mechanical Engineering
Industrial and Manufacturing Engineering
Software
Control and Systems Engineering
Abstract
Fused deposition modeling (FDM) is the most widespread 3D printing technology. The primary reasons for this are its simplicity in manufacturing and low cost. The common issue of FDM is an anisotropic property of the extruded layer. Therefore, the mechanical strength of traditional machining methods is significantly better than FDM-fabricated parts. Implementation of diode laser (450 nm) with 5 W power for localized heating of the pre-deposition layer is proposed to overcome this problem. The laser power is controlled during the printing process. Thereby, layer interface temperature reached for critical point, where the bonding diffusion process between layers increased for the maximum level. The effect of the pre-deposing heating method is presented at different laser power values and printing speed. Tensile test results on PLA (polylactic acid) plastic specimen indicate a 10.16% increase in ultimate tensile strength at 2.84 W power of the laser. However, crack and hole formations indicate a negative result of intensive laser heating employment.
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GOST Copy
Sabyrov N., Abilgaziyev A., Ali M. H. Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system // International Journal of Advanced Manufacturing Technology. 2020. Vol. 108. No. 1-2. pp. 603-611.
GOST all authors (up to 50) Copy
Sabyrov N., Abilgaziyev A., Ali M. H. Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system // International Journal of Advanced Manufacturing Technology. 2020. Vol. 108. No. 1-2. pp. 603-611.
RIS |
Cite this
RIS Copy
TY - JOUR
DO - 10.1007/s00170-020-05455-y
UR - https://doi.org/10.1007/s00170-020-05455-y
TI - Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system
T2 - International Journal of Advanced Manufacturing Technology
AU - Sabyrov, Nurbol
AU - Abilgaziyev, Anuar
AU - Ali, Md Hazrat
PY - 2020
DA - 2020/05/18
PB - Springer Nature
SP - 603-611
IS - 1-2
VL - 108
SN - 0268-3768
SN - 1433-3015
ER -
BibTex |
Cite this
BibTex (up to 50 authors) Copy
@article{2020_Sabyrov,
author = {Nurbol Sabyrov and Anuar Abilgaziyev and Md Hazrat Ali},
title = {Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system},
journal = {International Journal of Advanced Manufacturing Technology},
year = {2020},
volume = {108},
publisher = {Springer Nature},
month = {may},
url = {https://doi.org/10.1007/s00170-020-05455-y},
number = {1-2},
pages = {603--611},
doi = {10.1007/s00170-020-05455-y}
}
MLA
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MLA Copy
Sabyrov, Nurbol, et al. “Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system.” International Journal of Advanced Manufacturing Technology, vol. 108, no. 1-2, May. 2020, pp. 603-611. https://doi.org/10.1007/s00170-020-05455-y.