Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system
Publication type: Journal Article
Publication date: 2020-05-18
scimago Q1
wos Q2
SJR: 0.706
CiteScore: 5.9
Impact factor: 3.1
ISSN: 02683768, 14333015
Computer Science Applications
Mechanical Engineering
Industrial and Manufacturing Engineering
Software
Control and Systems Engineering
Abstract
Fused deposition modeling (FDM) is the most widespread 3D printing technology. The primary reasons for this are its simplicity in manufacturing and low cost. The common issue of FDM is an anisotropic property of the extruded layer. Therefore, the mechanical strength of traditional machining methods is significantly better than FDM-fabricated parts. Implementation of diode laser (450 nm) with 5 W power for localized heating of the pre-deposition layer is proposed to overcome this problem. The laser power is controlled during the printing process. Thereby, layer interface temperature reached for critical point, where the bonding diffusion process between layers increased for the maximum level. The effect of the pre-deposing heating method is presented at different laser power values and printing speed. Tensile test results on PLA (polylactic acid) plastic specimen indicate a 10.16% increase in ultimate tensile strength at 2.84 W power of the laser. However, crack and hole formations indicate a negative result of intensive laser heating employment.
Found
Nothing found, try to update filter.
Found
Nothing found, try to update filter.
Top-30
Journals
|
1
2
3
4
5
|
|
|
Additive Manufacturing
5 publications, 10%
|
|
|
International Journal of Advanced Manufacturing Technology
5 publications, 10%
|
|
|
Polymers
4 publications, 8%
|
|
|
Progress in Additive Manufacturing
3 publications, 6%
|
|
|
Journal of Manufacturing and Materials Processing
2 publications, 4%
|
|
|
Journal of Materials Engineering and Performance
2 publications, 4%
|
|
|
Polymer Composites
2 publications, 4%
|
|
|
Journal of Manufacturing Processes
2 publications, 4%
|
|
|
Journal of Nondestructive Evaluation Diagnostics and Prognostics of Engineering Systems
1 publication, 2%
|
|
|
Rapid Prototyping Journal
1 publication, 2%
|
|
|
Applied Sciences (Switzerland)
1 publication, 2%
|
|
|
Microsystems and Nanoengineering
1 publication, 2%
|
|
|
Composites Part C Open Access
1 publication, 2%
|
|
|
International Journal of Lightweight Materials and Manufacture
1 publication, 2%
|
|
|
Artificial Intelligence in Data and Big Data Processing
1 publication, 2%
|
|
|
Polymer Reviews
1 publication, 2%
|
|
|
Scientific Reports
1 publication, 2%
|
|
|
IEEE Access
1 publication, 2%
|
|
|
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering
1 publication, 2%
|
|
|
HardwareX
1 publication, 2%
|
|
|
AIP Conference Proceedings
1 publication, 2%
|
|
|
Composites Part B: Engineering
1 publication, 2%
|
|
|
Materials
1 publication, 2%
|
|
|
Russian Chemical Reviews
1 publication, 2%
|
|
|
Macromolecular Rapid Communications
1 publication, 2%
|
|
|
Journal of the Mechanical Behavior of Biomedical Materials
1 publication, 2%
|
|
|
ACS Sustainable Resource Management
1 publication, 2%
|
|
|
Virtual and Physical Prototyping
1 publication, 2%
|
|
|
Polymer
1 publication, 2%
|
|
|
1
2
3
4
5
|
Publishers
|
2
4
6
8
10
12
14
|
|
|
Elsevier
14 publications, 28%
|
|
|
Springer Nature
13 publications, 26%
|
|
|
MDPI
9 publications, 18%
|
|
|
Wiley
3 publications, 6%
|
|
|
Institute of Electrical and Electronics Engineers (IEEE)
2 publications, 4%
|
|
|
Taylor & Francis
2 publications, 4%
|
|
|
ASME International
1 publication, 2%
|
|
|
Emerald
1 publication, 2%
|
|
|
SAGE
1 publication, 2%
|
|
|
AIP Publishing
1 publication, 2%
|
|
|
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii
1 publication, 2%
|
|
|
American Chemical Society (ACS)
1 publication, 2%
|
|
|
2
4
6
8
10
12
14
|
- We do not take into account publications without a DOI.
- Statistics recalculated weekly.
Are you a researcher?
Create a profile to get free access to personal recommendations for colleagues and new articles.
Metrics
50
Total citations:
50
Citations from 2024:
31
(62%)
Cite this
GOST |
RIS |
BibTex |
MLA
Cite this
GOST
Copy
Sabyrov N., Abilgaziyev A., Ali M. H. Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system // International Journal of Advanced Manufacturing Technology. 2020. Vol. 108. No. 1-2. pp. 603-611.
GOST all authors (up to 50)
Copy
Sabyrov N., Abilgaziyev A., Ali M. H. Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system // International Journal of Advanced Manufacturing Technology. 2020. Vol. 108. No. 1-2. pp. 603-611.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1007/s00170-020-05455-y
UR - https://doi.org/10.1007/s00170-020-05455-y
TI - Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system
T2 - International Journal of Advanced Manufacturing Technology
AU - Sabyrov, Nurbol
AU - Abilgaziyev, Anuar
AU - Ali, Md Hazrat
PY - 2020
DA - 2020/05/18
PB - Springer Nature
SP - 603-611
IS - 1-2
VL - 108
SN - 0268-3768
SN - 1433-3015
ER -
Cite this
BibTex (up to 50 authors)
Copy
@article{2020_Sabyrov,
author = {Nurbol Sabyrov and Anuar Abilgaziyev and Md Hazrat Ali},
title = {Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system},
journal = {International Journal of Advanced Manufacturing Technology},
year = {2020},
volume = {108},
publisher = {Springer Nature},
month = {may},
url = {https://doi.org/10.1007/s00170-020-05455-y},
number = {1-2},
pages = {603--611},
doi = {10.1007/s00170-020-05455-y}
}
Cite this
MLA
Copy
Sabyrov, Nurbol, et al. “Enhancing interlayer bonding strength of FDM 3D printing technology by diode laser-assisted system.” International Journal of Advanced Manufacturing Technology, vol. 108, no. 1-2, May. 2020, pp. 603-611. https://doi.org/10.1007/s00170-020-05455-y.