Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process
Publication type: Journal Article
Publication date: 2016-03-08
scimago Q2
wos Q3
SJR: 0.549
CiteScore: 4.4
Impact factor: 2.0
ISSN: 10599495, 15441024
General Materials Science
Mechanical Engineering
Mechanics of Materials
Abstract
We have studied the dissolution process of Ni into liquid Al in Ni-Al multilayer nanofilms by means of molecular dynamics simulations. The elemental mechanisms underlying the dissolution process were described and found to be diffusion-limited. The subsequent evolution leading to intermetallic compound formation was analyzed and interpreted on the basis of classical nucleation theory. A better understanding of the microscopic behavior of Ni-Al reactive multilayer foils, which was essential for their use in joining applications, was obtained.
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BARAS F., Turlo V., Politano O. Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process // Journal of Materials Engineering and Performance. 2016. Vol. 25. No. 8. pp. 3270-3274.
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BARAS F., Turlo V., Politano O. Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process // Journal of Materials Engineering and Performance. 2016. Vol. 25. No. 8. pp. 3270-3274.
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TY - JOUR
DO - 10.1007/s11665-016-1989-4
UR - https://doi.org/10.1007/s11665-016-1989-4
TI - Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process
T2 - Journal of Materials Engineering and Performance
AU - BARAS, F.
AU - Turlo, V
AU - Politano, O
PY - 2016
DA - 2016/03/08
PB - Springer Nature
SP - 3270-3274
IS - 8
VL - 25
SN - 1059-9495
SN - 1544-1024
ER -
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BibTex (up to 50 authors)
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@article{2016_BARAS,
author = {F. BARAS and V Turlo and O Politano},
title = {Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process},
journal = {Journal of Materials Engineering and Performance},
year = {2016},
volume = {25},
publisher = {Springer Nature},
month = {mar},
url = {https://doi.org/10.1007/s11665-016-1989-4},
number = {8},
pages = {3270--3274},
doi = {10.1007/s11665-016-1989-4}
}
Cite this
MLA
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BARAS, F., et al. “Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process.” Journal of Materials Engineering and Performance, vol. 25, no. 8, Mar. 2016, pp. 3270-3274. https://doi.org/10.1007/s11665-016-1989-4.