Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement
3
Advanced Material Systems, E.I. du Pont de Nemours and Company, Newark, DE 19716-6108, U.S.A.
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Publication type: Journal Article
Publication date: 1996-06-01
scimago Q1
wos Q1
SJR: 1.299
CiteScore: 10.6
Impact factor: 5.8
ISSN: 00179310, 18792189
Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes
Abstract
The thermoplastic automated tow-placement process offers the potential for cost-effective fabrication of composite parts via consolidation in situ , thus avoiding the costly autoclave consolidation. The degree of interfacial bonding between tow layers and the void content in the composite laminate directly affect the mechanical properties and performance of the products. Theoretical models for the physical phenomena governing interfacial bonding and void dynamics (growth and consolidation) during the process are presented, which constitute the core of a numerical process simulator. Simulation-based parametric studies are reported for the case of an AS-4/PEEK composite to illustrate the effects of several process conditions and placement head configurations on the resulting degree of bonding and final void content. The analysis provides valuable insight towards optimal process and placement head design.
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Metrics
108
Total citations:
108
Citations from 2024:
14
(12.96%)
The most citing journal
Citations in journal:
18
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MLA
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GOST
Copy
Pitchumani R. et al. Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement // International Journal of Heat and Mass Transfer. 1996. Vol. 39. No. 9. pp. 1883-1897.
GOST all authors (up to 50)
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Pitchumani R., Ranganathan S., Don R. C., Gillespie J., Lamontia M. A. Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement // International Journal of Heat and Mass Transfer. 1996. Vol. 39. No. 9. pp. 1883-1897.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1016/0017-9310(95)00271-5
UR - https://doi.org/10.1016/0017-9310(95)00271-5
TI - Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement
T2 - International Journal of Heat and Mass Transfer
AU - Pitchumani, R.
AU - Ranganathan, S.
AU - Don, R C
AU - Gillespie, John
AU - Lamontia, M A
PY - 1996
DA - 1996/06/01
PB - Elsevier
SP - 1883-1897
IS - 9
VL - 39
SN - 0017-9310
SN - 1879-2189
ER -
Cite this
BibTex (up to 50 authors)
Copy
@article{1996_Pitchumani,
author = {R. Pitchumani and S. Ranganathan and R C Don and John Gillespie and M A Lamontia},
title = {Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement},
journal = {International Journal of Heat and Mass Transfer},
year = {1996},
volume = {39},
publisher = {Elsevier},
month = {jun},
url = {https://doi.org/10.1016/0017-9310(95)00271-5},
number = {9},
pages = {1883--1897},
doi = {10.1016/0017-9310(95)00271-5}
}
Cite this
MLA
Copy
Pitchumani, R., et al. “Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement.” International Journal of Heat and Mass Transfer, vol. 39, no. 9, Jun. 1996, pp. 1883-1897. https://doi.org/10.1016/0017-9310(95)00271-5.