New environmentally friendly low-temperature dipping system for UHMWPE fibers: Improving interface adhesion between fiber and rubber

To enhance the interfacial adhesion between ultra-high molecular weight polyethylene (UHMWPE) fibers and rubber, a novel environmentally friendly low-temperature dipping system was developed. This system involves reacting polyethylene glycol, butanone oxime-capped hexamethylene diisocyanate, and a cross-linking agent to form a network structure, which is then blended with latex to create a polypolyol-isocyanate-latex (PIL) dipping solution. Initially, the UHMWPE fiber surface was activated using continuous plasma treatment, serving as an alternative to traditional activation solution. Subsequently, the fibers were dipped by the PIL solution. The H pull-out force between the modified UHMWPE fibers and rubber increased by 114 % to 137.6 N, outperforming the conventional resorcinol–formaldehyde-latex (RFL) system. In addition, the PIL system avoids the use of toxic resorcinol and formaldehyde and can cure at lower temperatures, making it more suitable for UHMWPE fibers with low melting points. The modified UHMWPE fiber/rubber composites also exhibited good aging and fatigue stability. This method is characterized by its simplicity, minimal damage to the fibers, and advantages in continuity and scalability, offering new guidance for the interface design of UHMWPE fiber/rubber composites.