International Journal of Heat and Mass Transfer, volume 195, pages 123181
Cost-efficient copper-nickel alloy for active cooling applications
Shuai Li
1
,
KYLE SNYDER
,
Md Sabbir Akhanda
,
Richard Martukanitz
1, 2
,
Mandar Mitra
3
,
Joseph Poon
3
,
Mona Zebarjadi
1, 4
1
Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, 22904, United States
|
2
Commonwealth Center for Advanced Manufacturing, Prince George County, VA 23842, United States
|
3
Department of Physics, University of Virginia, Charlottesville, VA, 22904, United States
|
4
Department of Electrical and Computer Engineering
Publication type: Journal Article
Publication date: 2022-10-01
Quartile SCImago
Q1
Quartile WOS
Q1
Impact factor: 5.2
ISSN: 00179310
Condensed Matter Physics
Mechanical Engineering
Fluid Flow and Transfer Processes
Abstract
• Explored the possibility of utilizing Cu-Ni alloy for active cooling application. • Demonstrated that Cu-Ni samples prepared using the industrial-grade powders have performances comparable to those made with high purity powders. • Demonstrated the possibility of using additive manufacturing to fabricate high-performance Cu-Ni alloy samples for commercial applications It is recently proposed that active (Peltier) and passive (conductive) cooling could be combined to design highly-efficient thermal conductors as active heat sinks. We study the potential of low-cost copper-nickel alloys for active cooling applications. We show that for this application, copper-nickel alloys prepared using industrial-grade powders to lower the manufacturing cost, are as good as copper-nickel alloys made out of high purity metals. Furthermore, directed energy deposition, a type of additive manufacturing, can produce copper-nickel alloys which have about 10 percent lower thermoelectric power factor compared to mechanical-alloying methods but have larger thermal conductivity values, hence, possessing similar effective thermal conductivity values, reaching 403 W m − 1 K − 1 at 390K. Much larger values are expected at higher temperatures. The usage of additive manufacturing enables complex geometries and large-scale production.
Top-30
Citations by journals
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Applied Thermal Engineering
2 publications, 14.29%
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Journal of Materials Research and Technology
1 publication, 7.14%
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Journal of Manufacturing Processes
1 publication, 7.14%
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Materials Characterization
1 publication, 7.14%
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Surface and Coatings Technology
1 publication, 7.14%
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Science advances
1 publication, 7.14%
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Results in Physics
1 publication, 7.14%
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Archives of Computational Methods in Engineering
1 publication, 7.14%
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Entropy
1 publication, 7.14%
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Materials Today Communications
1 publication, 7.14%
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Applied Physics Letters
1 publication, 7.14%
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Journal of Manufacturing and Materials Processing
1 publication, 7.14%
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Journal of the Australian Ceramic Society
1 publication, 7.14%
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Citations by publishers
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Elsevier
8 publications, 57.14%
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Springer Nature
2 publications, 14.29%
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Multidisciplinary Digital Publishing Institute (MDPI)
2 publications, 14.29%
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American Association for the Advancement of Science (AAAS)
1 publication, 7.14%
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American Institute of Physics (AIP)
1 publication, 7.14%
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- We do not take into account publications without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
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Li S. et al. Cost-efficient copper-nickel alloy for active cooling applications // International Journal of Heat and Mass Transfer. 2022. Vol. 195. p. 123181.
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Li S., SNYDER K., Akhanda M. S., Martukanitz R., Mitra M., Poon J., Zebarjadi M. Cost-efficient copper-nickel alloy for active cooling applications // International Journal of Heat and Mass Transfer. 2022. Vol. 195. p. 123181.
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TY - JOUR
DO - 10.1016/j.ijheatmasstransfer.2022.123181
UR - https://doi.org/10.1016/j.ijheatmasstransfer.2022.123181
TI - Cost-efficient copper-nickel alloy for active cooling applications
T2 - International Journal of Heat and Mass Transfer
AU - Li, Shuai
AU - SNYDER, KYLE
AU - Akhanda, Md Sabbir
AU - Martukanitz, Richard
AU - Mitra, Mandar
AU - Poon, Joseph
AU - Zebarjadi, Mona
PY - 2022
DA - 2022/10/01 00:00:00
PB - Elsevier
SP - 123181
VL - 195
SN - 0017-9310
ER -
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@article{2022_Li,
author = {Shuai Li and KYLE SNYDER and Md Sabbir Akhanda and Richard Martukanitz and Mandar Mitra and Joseph Poon and Mona Zebarjadi},
title = {Cost-efficient copper-nickel alloy for active cooling applications},
journal = {International Journal of Heat and Mass Transfer},
year = {2022},
volume = {195},
publisher = {Elsevier},
month = {oct},
url = {https://doi.org/10.1016/j.ijheatmasstransfer.2022.123181},
pages = {123181},
doi = {10.1016/j.ijheatmasstransfer.2022.123181}
}