Materials Today, volume 67, pages 299-319

Trends in photoresist materials for extreme ultraviolet lithography: A review

Xiaolin Wang 1
Peipei Tao 1
Qianqian Wang 1
Zhenzhou Shao 1
Tianqi Liu 1
Yang Hu 1
Ziyu Hu 1
Yimeng Wang 1
Jianlong Wang 1
Yuzhou Tang 1
Hong Xu 1
Publication typeJournal Article
Publication date2023-07-01
Journal: Materials Today
Quartile SCImago
Q1
Quartile WOS
Q1
Impact factor24.2
ISSN13697021
Condensed Matter Physics
General Materials Science
Mechanical Engineering
Mechanics of Materials
Abstract
With the development of microelectronics, the demand for continuously miniaturized feature sizes has driven continuous progress in lithography technology. Extreme ultraviolet (EUV) lithography can directly pattern sub-20-nm half-pitch resolution, and it has emerged as the most promising nanoscale fabrication technology. However, the restricted brightness of the EUV light source and the limited reflectivity of multilayer mirrors impose new requirements for the sensitivity of photoresists. Furthermore, the high-resolution patterning characteristics of the EUV require resistive materials featuring smaller component sizes and higher etch resistance. Thus, the development of photoresists with new attributes of EUV remains a challenge. This review covers the evolution of EUV photoresists, including chemically amplified resists, non-chemically amplified polymer resists, molecular glass resists, and metal-containing resists, including the future development trends of EUV-sensitive materials.

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Wang X. et al. Trends in photoresist materials for extreme ultraviolet lithography: A review // Materials Today. 2023. Vol. 67. pp. 299-319.
GOST all authors (up to 50) Copy
Wang X., Tao P., Wang Q., Shao Z., Liu T., Hu Y., Hu Z., Wang Y., Wang J., Tang Y., Xu H., He X. Trends in photoresist materials for extreme ultraviolet lithography: A review // Materials Today. 2023. Vol. 67. pp. 299-319.
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RIS Copy
TY - JOUR
DO - 10.1016/j.mattod.2023.05.027
UR - https://doi.org/10.1016/j.mattod.2023.05.027
TI - Trends in photoresist materials for extreme ultraviolet lithography: A review
T2 - Materials Today
AU - Wang, Xiaolin
AU - Tao, Peipei
AU - Wang, Qianqian
AU - Shao, Zhenzhou
AU - Liu, Tianqi
AU - Hu, Yang
AU - Hu, Ziyu
AU - Wang, Yimeng
AU - Wang, Jianlong
AU - Tang, Yuzhou
AU - Xu, Hong
AU - He, Xiangming
PY - 2023
DA - 2023/07/01 00:00:00
PB - Elsevier
SP - 299-319
VL - 67
SN - 1369-7021
ER -
BibTex
Cite this
BibTex Copy
@article{2023_Wang,
author = {Xiaolin Wang and Peipei Tao and Qianqian Wang and Zhenzhou Shao and Tianqi Liu and Yang Hu and Ziyu Hu and Yimeng Wang and Jianlong Wang and Yuzhou Tang and Hong Xu and Xiangming He},
title = {Trends in photoresist materials for extreme ultraviolet lithography: A review},
journal = {Materials Today},
year = {2023},
volume = {67},
publisher = {Elsevier},
month = {jul},
url = {https://doi.org/10.1016/j.mattod.2023.05.027},
pages = {299--319},
doi = {10.1016/j.mattod.2023.05.027}
}
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