Materials Today, volume 67, pages 299-319
Trends in photoresist materials for extreme ultraviolet lithography: A review
Publication type: Journal Article
Publication date: 2023-07-01
Condensed Matter Physics
General Materials Science
Mechanical Engineering
Mechanics of Materials
Abstract
With the development of microelectronics, the demand for continuously miniaturized feature sizes has driven continuous progress in lithography technology. Extreme ultraviolet (EUV) lithography can directly pattern sub-20-nm half-pitch resolution, and it has emerged as the most promising nanoscale fabrication technology. However, the restricted brightness of the EUV light source and the limited reflectivity of multilayer mirrors impose new requirements for the sensitivity of photoresists. Furthermore, the high-resolution patterning characteristics of the EUV require resistive materials featuring smaller component sizes and higher etch resistance. Thus, the development of photoresists with new attributes of EUV remains a challenge. This review covers the evolution of EUV photoresists, including chemically amplified resists, non-chemically amplified polymer resists, molecular glass resists, and metal-containing resists, including the future development trends of EUV-sensitive materials.
Top-30
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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1 publication, 2.63%
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Citations by publishers
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Elsevier
9 publications, 23.68%
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American Chemical Society (ACS)
8 publications, 21.05%
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Multidisciplinary Digital Publishing Institute (MDPI)
5 publications, 13.16%
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Royal Society of Chemistry (RSC)
4 publications, 10.53%
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Springer Nature
3 publications, 7.89%
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Wiley
2 publications, 5.26%
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IOP Publishing
2 publications, 5.26%
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Thieme
1 publication, 2.63%
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Optical Society of America
1 publication, 2.63%
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Chinese Laser Press
1 publication, 2.63%
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SPIE
1 publication, 2.63%
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American Vacuum Society
1 publication, 2.63%
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- We do not take into account publications without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
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Wang X. et al. Trends in photoresist materials for extreme ultraviolet lithography: A review // Materials Today. 2023. Vol. 67. pp. 299-319.
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Wang X., Tao P., Wang Q., Shao Z., Liu T., Hu Y., Hu Z., Wang Y., Wang J., Tang Y., Xu H., He X. Trends in photoresist materials for extreme ultraviolet lithography: A review // Materials Today. 2023. Vol. 67. pp. 299-319.
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TY - JOUR
DO - 10.1016/j.mattod.2023.05.027
UR - https://doi.org/10.1016/j.mattod.2023.05.027
TI - Trends in photoresist materials for extreme ultraviolet lithography: A review
T2 - Materials Today
AU - Wang, Xiaolin
AU - Tao, Peipei
AU - Wang, Qianqian
AU - Shao, Zhenzhou
AU - Liu, Tianqi
AU - Hu, Yang
AU - Hu, Ziyu
AU - Wang, Yimeng
AU - Wang, Jianlong
AU - Tang, Yuzhou
AU - Xu, Hong
AU - He, Xiangming
PY - 2023
DA - 2023/07/01
PB - Elsevier
SP - 299-319
VL - 67
SN - 1369-7021
ER -
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@article{2023_Wang,
author = {Xiaolin Wang and Peipei Tao and Qianqian Wang and Zhenzhou Shao and Tianqi Liu and Yang Hu and Ziyu Hu and Yimeng Wang and Jianlong Wang and Yuzhou Tang and Hong Xu and Xiangming He},
title = {Trends in photoresist materials for extreme ultraviolet lithography: A review},
journal = {Materials Today},
year = {2023},
volume = {67},
publisher = {Elsevier},
month = {jul},
url = {https://doi.org/10.1016/j.mattod.2023.05.027},
pages = {299--319},
doi = {10.1016/j.mattod.2023.05.027}
}
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