volume 16 issue 2 pages 210-217

Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts

Xiaoxing Ke
Sara Bals
Daire Cott
Thomas Hantschel
Hugo Bender
Gustaaf Van Tendeloo
Publication typeJournal Article
Publication date2010-02-26
scimago Q2
wos Q1
SJR0.465
CiteScore1.3
Impact factor3.0
ISSN14319276, 14358115
Instrumentation
Abstract

The three-dimensional (3D) distribution of carbon nanotubes (CNTs) grown inside semiconductor contact holes is studied by electron tomography. The use of a specialized tomography holder results in an angular tilt range of ±90°, which means that the so-called “missing wedge” is absent. The transmission electron microscopy (TEM) sample for this purpose consists of a micropillar that is prepared by a dedicated procedure using the focused ion beam (FIB) but keeping the CNTs intact. The 3D results are combined with energy dispersive X-ray spectroscopy (EDS) to study the relation between the CNTs and the catalyst particles used during their growth. The reconstruction, based on the full range of tilt angles, is compared with a reconstruction where a missing wedge is present. This clearly illustates that the missing wedge will lead to an unreliable interpretation and will limit quantitative studies.

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GOST |
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GOST Copy
Ke X. et al. Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts // Microscopy and Microanalysis. 2010. Vol. 16. No. 2. pp. 210-217.
GOST all authors (up to 50) Copy
Ke X., Bals S., Cott D., Hantschel T., Bender H., Van Tendeloo G. Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts // Microscopy and Microanalysis. 2010. Vol. 16. No. 2. pp. 210-217.
RIS |
Cite this
RIS Copy
TY - JOUR
DO - 10.1017/S1431927609991371
UR - https://doi.org/10.1017/S1431927609991371
TI - Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts
T2 - Microscopy and Microanalysis
AU - Ke, Xiaoxing
AU - Bals, Sara
AU - Cott, Daire
AU - Hantschel, Thomas
AU - Bender, Hugo
AU - Van Tendeloo, Gustaaf
PY - 2010
DA - 2010/02/26
PB - Oxford University Press
SP - 210-217
IS - 2
VL - 16
PMID - 20187989
SN - 1431-9276
SN - 1435-8115
ER -
BibTex |
Cite this
BibTex (up to 50 authors) Copy
@article{2010_Ke,
author = {Xiaoxing Ke and Sara Bals and Daire Cott and Thomas Hantschel and Hugo Bender and Gustaaf Van Tendeloo},
title = {Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts},
journal = {Microscopy and Microanalysis},
year = {2010},
volume = {16},
publisher = {Oxford University Press},
month = {feb},
url = {https://doi.org/10.1017/S1431927609991371},
number = {2},
pages = {210--217},
doi = {10.1017/S1431927609991371}
}
MLA
Cite this
MLA Copy
Ke, Xiaoxing, et al. “Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts.” Microscopy and Microanalysis, vol. 16, no. 2, Feb. 2010, pp. 210-217. https://doi.org/10.1017/S1431927609991371.