Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
Publication type: Journal Article
Publication date: 2019-05-23
scimago Q2
wos Q3
SJR: 0.496
CiteScore: 5.0
Impact factor: 2.1
ISSN: 09601317, 13616439
Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering
Mechanical Engineering
Mechanics of Materials
Abstract
Microchannels formed in non-conductive substrates like fused silica, glass and quartz, etc, have wide applications in the field of micro-fluidic and lab-on-chip applications due to their optical transparency, chemical inertness, and biocompatible nature. Electrochemical discharge machining (ECDM) has emerged as a potential low-cost fabrication method to fabricate microfeatures in these materials, compared to conventional laser etching techniques. In this paper, numerical simulation and experimental fabrication of microchannels in a glass substrate using the ECDM based micromilling technique is demonstrated. Stainless steel needle as tool electrode is used in alkaline electrolyte medium. The effects of process parameters viz. tool feed rate, pulse frequency and machining voltage on material removal rate (MRR) and surface roughness (SR) of the microchannels were analysed. The experimental results showed that the MRR and SR increases with an increase in machining voltage and tool feed rate but reduces with an increase in the pulse frequency. Simulations using FEM-based model showed similar trends in MRR with that of experiments. A comparison between the cross-section profiles obtained by the experimental work and predicted profile by the numerical simulation showed some deviation between them due to the Gaussian heat flux assumption in the numerical model. Optical images showed that KOH performance is comparatively better than NaOH with respect to thermal damage and width of cut. Further, multi-objective optimization was performed using utility theory coupled with Taguchi's method to optimize the process parameters. Moreover, the capability of the ECDM process was demonstrated in fabricating various other micro-features such as sinusoidal channel, letter engraving, etc in a glass substrate, which can be extended to other brittle materials like quartz, fused silica, ceramic, etc.
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Mishra D. K. et al. Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining // Journal of Micromechanics and Microengineering. 2019. Vol. 29. No. 7. p. 75004.
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Mishra D. K., Verma A. D., Arab J., Marla D., Dixit P. Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining // Journal of Micromechanics and Microengineering. 2019. Vol. 29. No. 7. p. 75004.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1088/1361-6439/ab1da7
UR - https://doi.org/10.1088/1361-6439/ab1da7
TI - Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
T2 - Journal of Micromechanics and Microengineering
AU - Mishra, Dileep Kumar
AU - Verma, Aman D.
AU - Arab, Julfekar
AU - Marla, Deepak
AU - Dixit, Pradeep
PY - 2019
DA - 2019/05/23
PB - IOP Publishing
SP - 75004
IS - 7
VL - 29
SN - 0960-1317
SN - 1361-6439
ER -
Cite this
BibTex (up to 50 authors)
Copy
@article{2019_Mishra,
author = {Dileep Kumar Mishra and Aman D. Verma and Julfekar Arab and Deepak Marla and Pradeep Dixit},
title = {Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining},
journal = {Journal of Micromechanics and Microengineering},
year = {2019},
volume = {29},
publisher = {IOP Publishing},
month = {may},
url = {https://doi.org/10.1088/1361-6439/ab1da7},
number = {7},
pages = {75004},
doi = {10.1088/1361-6439/ab1da7}
}
Cite this
MLA
Copy
Mishra, Dileep Kumar, et al. “Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining.” Journal of Micromechanics and Microengineering, vol. 29, no. 7, May. 2019, p. 75004. https://doi.org/10.1088/1361-6439/ab1da7.
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