Ultrathin film deposition for nanoelectronic device manucturing
Publication type: Journal Article
Publication date: 2020-04-01
SJR: —
CiteScore: —
Impact factor: —
ISSN: 17578981, 1757899X
General Medicine
Abstract
Study results of thin film with thickness less than 50 nm deposition by means of electron beam evaporation on special vacuum coaters were represented. Calculation results of energy and mass carry magnitude for ITO, Ag and Al thin films deposition with preset of structure and composition homogeneity and roughness were shown.
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Panfilov Y. V. et al. Ultrathin film deposition for nanoelectronic device manucturing // IOP Conference Series: Materials Science and Engineering. 2020. Vol. 781. No. 1. p. 12021.
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Panfilov Y. V., Rodionov I. V., Ryzhikov I. A., Baburin A. S., Moskalev D. O., Lotkov E. S. Ultrathin film deposition for nanoelectronic device manucturing // IOP Conference Series: Materials Science and Engineering. 2020. Vol. 781. No. 1. p. 12021.
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TY - JOUR
DO - 10.1088/1757-899X/781/1/012021
UR - https://doi.org/10.1088/1757-899X/781/1/012021
TI - Ultrathin film deposition for nanoelectronic device manucturing
T2 - IOP Conference Series: Materials Science and Engineering
AU - Panfilov, Y V
AU - Rodionov, I. V.
AU - Ryzhikov, I. A.
AU - Baburin, A S
AU - Moskalev, D. O.
AU - Lotkov, E S
PY - 2020
DA - 2020/04/01
PB - IOP Publishing
SP - 12021
IS - 1
VL - 781
SN - 1757-8981
SN - 1757-899X
ER -
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@article{2020_Panfilov,
author = {Y V Panfilov and I. V. Rodionov and I. A. Ryzhikov and A S Baburin and D. O. Moskalev and E S Lotkov},
title = {Ultrathin film deposition for nanoelectronic device manucturing},
journal = {IOP Conference Series: Materials Science and Engineering},
year = {2020},
volume = {781},
publisher = {IOP Publishing},
month = {apr},
url = {https://doi.org/10.1088/1757-899X/781/1/012021},
number = {1},
pages = {12021},
doi = {10.1088/1757-899X/781/1/012021}
}
Cite this
MLA
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Panfilov, Y. V., et al. “Ultrathin film deposition for nanoelectronic device manucturing.” IOP Conference Series: Materials Science and Engineering, vol. 781, no. 1, Apr. 2020, p. 12021. https://doi.org/10.1088/1757-899X/781/1/012021.