Package level thermal analysis of backside power delivery network (BS-PDN) configurations

Herman Oprins ¹

Jose Luis Ramirez Bohorquez ¹

Bjorn Vermeersch ¹

Geert Van der Plas ¹

Eric Beyne ¹

imec,Leuven,Belgium |

Publication type: Proceedings Article

Publication date: 2022-05-31

DOI: 10.1109/itherm54085.2022.9899603

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Microelectronics Journal	Microelectronics Journal, 2, 10.53% Microelectronics Journal 2 publications, 10.53%
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IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 5.26% IEEE Transactions on Components, Packaging and Manufacturing Technology 1 publication, 5.26%
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Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 15, 78.95% Institute of Electrical and Electronics Engineers (IEEE) 15 publications, 78.95%
Elsevier	Elsevier, 2, 10.53% Elsevier 2 publications, 10.53%
MDPI	MDPI, 1, 5.26% MDPI 1 publication, 5.26%
EDP Sciences	EDP Sciences, 1, 5.26% EDP Sciences 1 publication, 5.26%
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