Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities
Тип публикации: Journal Article
Дата публикации: 2024-12-01
SCImago Q1
WOS Q1
БС1
SJR: 0.919
CiteScore: 9.3
Impact factor: 3.8
ISSN: 08858985, 1557959X
Краткое описание
The sixth generation (6G) wireless networks aim to achieve ultra-high data transmission rates, very low latency, and enhanced energy-efficiency. To this end, terahertz (THz) band is one of the key enablers of 6G to meet such requirements. The THz-band systems are also quickly emerging as high-resolution sensing devices because of their ultra-wide bandwidth and very narrow beamwidth. As a means to efficiently utilize spectrum and thereby save cost and power, THz integrated sensing and communications (ISAC) paradigm envisages a single integrated hardware platform with a common signaling mechanism. However, ISAC at THz-band entails several design challenges, such as beam split, range-dependent bandwidth, near-field beamforming, and distinct channel model. This article examines the technologies that have the potential to bring forth ISAC and THz transmission together. In particular, it provides an overview of antenna and array design, hybrid beamforming, integration with reflecting surfaces, and data-driven techniques, such as machine learning. These systems also provide research opportunities in developing novel methodologies for channel estimation, near-field beam split, waveform design, and beam misalignment.
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ГОСТ
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Elbir A. M. et al. Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities // IEEE Aerospace and Electronic Systems Magazine. 2024. Vol. 39. No. 12. pp. 38-49.
ГОСТ со всеми авторами (до 50)
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Elbir A. M., Mishra K. V., Chatzinotas S., Bennis M. Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities // IEEE Aerospace and Electronic Systems Magazine. 2024. Vol. 39. No. 12. pp. 38-49.
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RIS
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TY - JOUR
DO - 10.1109/maes.2024.3476228
UR - https://ieeexplore.ieee.org/document/10707308/
TI - Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities
T2 - IEEE Aerospace and Electronic Systems Magazine
AU - Elbir, Ahmet M.
AU - Mishra, Kumar Vijay
AU - Chatzinotas, Symeon
AU - Bennis, Mehdi
PY - 2024
DA - 2024/12/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
SP - 38-49
IS - 12
VL - 39
SN - 0885-8985
SN - 1557-959X
ER -
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@article{2024_Elbir,
author = {Ahmet M. Elbir and Kumar Vijay Mishra and Symeon Chatzinotas and Mehdi Bennis},
title = {Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities},
journal = {IEEE Aerospace and Electronic Systems Magazine},
year = {2024},
volume = {39},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)},
month = {dec},
url = {https://ieeexplore.ieee.org/document/10707308/},
number = {12},
pages = {38--49},
doi = {10.1109/maes.2024.3476228}
}
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MLA
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Elbir, Ahmet M., et al. “Terahertz-Band Integrated Sensing and Communications: Challenges and Opportunities.” IEEE Aerospace and Electronic Systems Magazine, vol. 39, no. 12, Dec. 2024, pp. 38-49. https://ieeexplore.ieee.org/document/10707308/.
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