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When Device Modeling Meets Machine Learning: Opportunities and Challenges (Invited)

Lining Zhang ¹

Baokang Peng ¹

Yu Li ¹

Hengyi Liu ¹

Wu Dai ¹

RUNSHENG WANG ²

Peking University,School of Electronic and Computer Engineering,Shenzhen,China |

Peking University,School of Integrated Circuits,Beijing,China |

Publication type: Proceedings Article

Publication date: 2024-09-09

Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/mlcad62225.2024.10740212

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Institute of Electrical and Electronics Engineers (IEEE)