IEEE Transactions on Aerospace and Electronic Systems, volume 60, issue 2, pages 1660-1678
Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves
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Nanjing research institute of electronics technology, Nanjing, China
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Publication type: Journal Article
Publication date: 2024-04-01
Q1
Q1
SJR: 1.490
CiteScore: 7.8
Impact factor: 5.1
ISSN: 00189251, 15579603, 23719877
Electrical and Electronic Engineering
Aerospace Engineering
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Institute of Electrical and Electronics Engineers (IEEE)
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Bai S., Chen Y., Zhang Y. Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves // IEEE Transactions on Aerospace and Electronic Systems. 2024. Vol. 60. No. 2. pp. 1660-1678.
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Bai S., Chen Y., Zhang Y. Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves // IEEE Transactions on Aerospace and Electronic Systems. 2024. Vol. 60. No. 2. pp. 1660-1678.
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TY - JOUR
DO - 10.1109/taes.2023.3344397
UR - https://doi.org/10.1109/taes.2023.3344397
TI - Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves
T2 - IEEE Transactions on Aerospace and Electronic Systems
AU - Bai, Shengzhou
AU - Chen, Yuhan
AU - Zhang, Yujin
PY - 2024
DA - 2024/04/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
SP - 1660-1678
IS - 2
VL - 60
SN - 0018-9251
SN - 1557-9603
SN - 2371-9877
ER -
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@article{2024_Bai,
author = {Shengzhou Bai and Yuhan Chen and Yujin Zhang},
title = {Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves},
journal = {IEEE Transactions on Aerospace and Electronic Systems},
year = {2024},
volume = {60},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)},
month = {apr},
url = {https://doi.org/10.1109/taes.2023.3344397},
number = {2},
pages = {1660--1678},
doi = {10.1109/taes.2023.3344397}
}
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MLA
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Bai, Shengzhou, et al. “Prediction Method of Agile Satellite's In-View Periods Based on Analytical Bounding Curves.” IEEE Transactions on Aerospace and Electronic Systems, vol. 60, no. 2, Apr. 2024, pp. 1660-1678. https://doi.org/10.1109/taes.2023.3344397.