volume 71 issue 6 pages 1864-1878

A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile

Publication typeJournal Article
Publication date2024-06-01
scimago Q1
wos Q2
SJR1.113
CiteScore9.6
Impact factor4.5
ISSN00189294, 15582531
Biomedical Engineering
Abstract
Time-resolved fluorescence imaging techniques, like confocal fluorescence lifetime imaging microscopy, are powerful photonic instrumentation tools of modern science with diverse applications, including: biology, medicine, and chemistry. However, complexities of the systems, both at specimen and device levels, cause difficulties in quantifying soft biomarkers. To address the problems, we first aim to understand and model the underlying photophysics of fluorescence decay curves. For this purpose, we provide a set of mathematical functions, called "life models", fittable with the real temporal recordings of histogram of photon counts. For each model, an equivalent electrical circuit, called a "life circuit", is derived for explaining the whole process. In confocal endomicroscopy, the components of excitation laser, specimen, and fluorescence-emission signal as the histogram of photon counts are modelled by a power source, network of resistor-inductor-capacitor circuitry, and multimetre, respectively. We then design a novel pixel-level temporal classification algorithm, called a "fit-flexible approach", where qualities of "intensity", "fall-time", and "life profile" are identified for each point. A model selection mechanism is used at each pixel to flexibly choose the best representative life model based on a proposed Misfit-percent metric. A two-dimensional arrangement of the quantified information detects some kind of structural information. This approach showed a potential of separating microbeads from lung tissue, distinguishing the tri-sensing from conventional methods. We alleviated by 7% the error of the Misfit-percent for recovering the histograms on real samples than the best state-of-the-art competitor. Codes are available online.
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IEEE Open Journal of Engineering in Medicine and Biology
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Institute of Electrical and Electronics Engineers (IEEE)
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Taimori A. et al. A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile // IEEE Transactions on Biomedical Engineering. 2024. Vol. 71. No. 6. pp. 1864-1878.
GOST all authors (up to 50) Copy
Taimori A., Mills B., Gaughan E., Ali A., Dhaliwal K., Williams G. O. S., Finlayson N., Hopgood J. A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile // IEEE Transactions on Biomedical Engineering. 2024. Vol. 71. No. 6. pp. 1864-1878.
RIS |
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RIS Copy
TY - JOUR
DO - 10.1109/tbme.2024.3354856
UR - https://ieeexplore.ieee.org/document/10418522/
TI - A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile
T2 - IEEE Transactions on Biomedical Engineering
AU - Taimori, Ali
AU - Mills, Bethany
AU - Gaughan, Erin
AU - Ali, Aysha
AU - Dhaliwal, Kevin
AU - Williams, Gareth O S
AU - Finlayson, N.
AU - Hopgood, J.R.
PY - 2024
DA - 2024/06/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
SP - 1864-1878
IS - 6
VL - 71
PMID - 38300773
SN - 0018-9294
SN - 1558-2531
ER -
BibTex |
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BibTex (up to 50 authors) Copy
@article{2024_Taimori,
author = {Ali Taimori and Bethany Mills and Erin Gaughan and Aysha Ali and Kevin Dhaliwal and Gareth O S Williams and N. Finlayson and J.R. Hopgood},
title = {A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile},
journal = {IEEE Transactions on Biomedical Engineering},
year = {2024},
volume = {71},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)},
month = {jun},
url = {https://ieeexplore.ieee.org/document/10418522/},
number = {6},
pages = {1864--1878},
doi = {10.1109/tbme.2024.3354856}
}
MLA
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MLA Copy
Taimori, Ali, et al. “A Novel Fit-Flexible Fluorescence Soft Imager: Tri-Sensing of Intensity, Fall-Time, and Life Profile.” IEEE Transactions on Biomedical Engineering, vol. 71, no. 6, Jun. 2024, pp. 1864-1878. https://ieeexplore.ieee.org/document/10418522/.