Design of 3D optical media with periodically distributed emitting centers

S.O Klimonsky 1
, 
T Bakhia 1
, 
Nikolay Borodinov 1
, 
A. V. Knotko 1
, 
N Yu Vereschagina 2
1
 
2
 
D.I. Mendeleev Univ. of Chem. Technol. of Russia, Moscow, Russia | 
Publication type: Proceedings Article
Publication date: 2013-09-01
Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Media with periodically distributed absorbing or emitting centers open new possibilities in a design of microoptical devices. However three dimensional (3D) structures of such type have not been obtained up to now. This question is considered in the present work. A multistage approach based on the colloid crystal technique has been suggested and structures consisted of CdSe quantum dots periodically distributed in ETPTA photoresist matrix have been prepared.
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Klimonsky S. et al. Design of 3D optical media with periodically distributed emitting centers // Proceedings of the International Conference on Advanced Optoelectronics and Lasers, CAOL. 2013.
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Klimonsky S., Bakhia T., Borodinov N., Knotko A. V., Vereschagina N. Yu. Design of 3D optical media with periodically distributed emitting centers // Proceedings of the International Conference on Advanced Optoelectronics and Lasers, CAOL. 2013.
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TY - CPAPER
DO - 10.1109/CAOL.2013.6657521
UR - https://doi.org/10.1109/CAOL.2013.6657521
TI - Design of 3D optical media with periodically distributed emitting centers
T2 - Proceedings of the International Conference on Advanced Optoelectronics and Lasers, CAOL
AU - Klimonsky, S.O
AU - Bakhia, T
AU - Borodinov, Nikolay
AU - Knotko, A. V.
AU - Vereschagina, N Yu
PY - 2013
DA - 2013/09/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -
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@inproceedings{2013_Klimonsky,
author = {S.O Klimonsky and T Bakhia and Nikolay Borodinov and A. V. Knotko and N Yu Vereschagina},
title = {Design of 3D optical media with periodically distributed emitting centers},
year = {2013},
month = {sep},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)}
}
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