The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

Y KAGAWA ¹

S Hida ¹

Yuka Kobayashi ¹

K. Takahashi ¹

S Miyanomae ¹

M. Kawamura ¹

H. Kawashima ²

H Yamagishi ²

Takaya Hirano ²

K. Tatani ²

Hiroki Nakayama ¹

K. Ohno ²

H. Iwamoto ²

S. Kadomura ¹

Hide authors affiliations Show authors affiliations: 2 affiliations

Sony Semiconductor Manufacturing Corporation, Japan |

Sony Semiconductor Solutions Corporation, Japan |

Publication type: Proceedings Article

Publication date: 2019-03-01

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DOI: 10.1109/EDTM.2019.8731186

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Abstract

We have successfully improved the scaling of Cu-Cu hybrid bonding. In this study, 3 um-pitch and 3M Cu-Cu connections with sufficient electrical properties and reliabilities were achieved. The ultra-fine pitch Cu-Cu connections correspond to the 0.75x scaling of conventional Cu-Cu hybrid bonding that we previously reported. Our high density 3D chip stacking technology is expected to enhance not only the function of back-illuminated CMOS image sensors (BI-CIS) but also that of coming 3D stacked semiconductor devices.

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Citations by journals

	1 2
IEEE Transactions on Electron Devices	IEEE Transactions on Electron Devices, 2, 9.52% IEEE Transactions on Electron Devices 2 publications, 9.52%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 2, 9.52% Journal of Electronic Packaging, Transactions of the ASME 2 publications, 9.52%
Journal of the Indian Institute of Science	Journal of the Indian Institute of Science, 1, 4.76% Journal of the Indian Institute of Science 1 publication, 4.76%
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 4.76% IEEE Transactions on Components, Packaging and Manufacturing Technology 1 publication, 4.76%
IEICE ESS FUNDAMENTALS REVIEW	IEICE ESS FUNDAMENTALS REVIEW, 1, 4.76% IEICE ESS FUNDAMENTALS REVIEW 1 publication, 4.76%
Materials	Materials, 1, 4.76% Materials 1 publication, 4.76%
Nanomaterials	Nanomaterials, 1, 4.76% Nanomaterials 1 publication, 4.76%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1, 4.76% IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 1 publication, 4.76%
Russian Chemical Reviews	Russian Chemical Reviews, 1, 4.76% Russian Chemical Reviews 1 publication, 4.76%
	1 2

Citations by publishers

	1 2 3 4 5 6 7 8 9
IEEE	IEEE, 9, 42.86% IEEE 9 publications, 42.86%
Multidisciplinary Digital Publishing Institute (MDPI)	Multidisciplinary Digital Publishing Institute (MDPI), 2, 9.52% Multidisciplinary Digital Publishing Institute (MDPI) 2 publications, 9.52%
ASME	ASME, 2, 9.52% ASME 2 publications, 9.52%
Springer Nature	Springer Nature, 1, 4.76% Springer Nature 1 publication, 4.76%
Institute of Electronics, Information and Communications Engineers (IEICE)	Institute of Electronics, Information and Communications Engineers (IEICE), 1, 4.76% Institute of Electronics, Information and Communications Engineers (IEICE) 1 publication, 4.76%
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii	Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii, 1, 4.76% Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii 1 publication, 4.76%
	1 2 3 4 5 6 7 8 9

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