Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon ¹

S Lhostis ²

S. Moreau ³

J. Chossat ²

M. Arnoux ⁴

C. Sart ²

Y Henrion ²

P. Lamontagne ²

L. Arnaud ³

N Bresson ³

V. Balan ³

C Euvrard ³

Y. Exbrayat ³

D. Scevola ²

E Deloffre ²

S Mermoz ²

Andreas Martin ⁴

H Bilgen ²

F. Andre ²

Christine Charles ²

D. Bouchu ³

A. Farcy ²

S Guillaumet ²

A. Jouve ³

H. Fre´mont ¹

S Cheramy ³

Hide authors affiliations Show authors affiliations: 4 affiliations

University of Bordeaux, IMS Laboratory, Talence, France |

STmicroelectronics, Crolles, France |

CEA-Leti, Grenoble, France |

⁴

STMicroelectronics, Grenoble, France |

Publication type: Proceedings Article

Publication date: 2018-12-01

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DOI: 10.1109/IEDM.2018.8614570

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Abstract

Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from 8.8 μm down to 1.44 μm bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.

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Citations by journals

	1 2 3
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 5.45% IEEE Transactions on Components, Packaging and Manufacturing Technology 3 publications, 5.45%
IEEE Electron Device Letters	IEEE Electron Device Letters, 2, 3.64% IEEE Electron Device Letters 2 publications, 3.64%
IEEE Transactions on Electron Devices	IEEE Transactions on Electron Devices, 2, 3.64% IEEE Transactions on Electron Devices 2 publications, 3.64%
ECS Journal of Solid State Science and Technology	ECS Journal of Solid State Science and Technology, 1, 1.82% ECS Journal of Solid State Science and Technology 1 publication, 1.82%
ACS Materials Letters	ACS Materials Letters, 1, 1.82% ACS Materials Letters 1 publication, 1.82%
Materials	Materials, 1, 1.82% Materials 1 publication, 1.82%
Applied Surface Science	Applied Surface Science, 1, 1.82% Applied Surface Science 1 publication, 1.82%
IEEE Solid-State Circuits Letters	IEEE Solid-State Circuits Letters, 1, 1.82% IEEE Solid-State Circuits Letters 1 publication, 1.82%
Crystal Growth and Design	Crystal Growth and Design, 1, 1.82% Crystal Growth and Design 1 publication, 1.82%
Nanomaterials	Nanomaterials, 1, 1.82% Nanomaterials 1 publication, 1.82%
Russian Chemical Reviews	Russian Chemical Reviews, 1, 1.82% Russian Chemical Reviews 1 publication, 1.82%
Journal of Electronic Materials	Journal of Electronic Materials, 1, 1.82% Journal of Electronic Materials 1 publication, 1.82%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 1, 1.82% Journal of Electronic Packaging, Transactions of the ASME 1 publication, 1.82%
	1 2 3

Citations by publishers

	2 4 6 8 10 12 14 16 18 20
IEEE	IEEE, 19, 34.55% IEEE 19 publications, 34.55%
American Chemical Society (ACS)	American Chemical Society (ACS), 2, 3.64% American Chemical Society (ACS) 2 publications, 3.64%
Multidisciplinary Digital Publishing Institute (MDPI)	Multidisciplinary Digital Publishing Institute (MDPI), 2, 3.64% Multidisciplinary Digital Publishing Institute (MDPI) 2 publications, 3.64%
The Electrochemical Society	The Electrochemical Society, 1, 1.82% The Electrochemical Society 1 publication, 1.82%
Elsevier	Elsevier, 1, 1.82% Elsevier 1 publication, 1.82%
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii	Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii, 1, 1.82% Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii 1 publication, 1.82%
Springer Nature	Springer Nature, 1, 1.82% Springer Nature 1 publication, 1.82%
ASME	ASME, 1, 1.82% ASME 1 publication, 1.82%
	2 4 6 8 10 12 14 16 18 20

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