Institute of Electrical and Electronics Engineers (IEEE)

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon ¹

S Lhostis ²

S. Moreau ³

J. Chossat ²

M. Arnoux ⁴

C. Sart ²

Y Henrion ²

P. Lamontagne ²

L. Arnaud ³

N Bresson ³

V. Balan ³

C Euvrard ³

Y. Exbrayat ³

D. Scevola ²

E Deloffre ²

S Mermoz ²

Andreas Martin ⁴

H Bilgen ²

F. Andre ²

Christine Charles ²

D. Bouchu ³

A. Farcy ²

S Guillaumet ²

A. Jouve ³

H. Fre´mont ¹

S Cheramy ³

Скрыть аффилиации авторов Показать аффилиации авторов: 4 аффилиации

University of Bordeaux, IMS Laboratory, Talence, France |

STmicroelectronics, Crolles, France |

CEA-Leti, Grenoble, France |

⁴

STMicroelectronics, Grenoble, France |

Тип публикации: Proceedings Article

Дата публикации: 2018-12-01

Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/IEDM.2018.8614570

Скопировать DOI

Краткое описание

Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from 8.8 μm down to 1.44 μm bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.

Найдено

1 цитирование

Попов Виктор

к.х.н.

36 публикаций, 201 цитирование

Индекс Хирша: 8

Московский физико-технический институт

Области научных интересов

Gas sensors

Наноматериалы

Полупроводники

Топ-30

Журналы

	1 2 3 4
IEEE Transactions on Components, Packaging and Manufacturing Technology	IEEE Transactions on Components, Packaging and Manufacturing Technology, 4, 5.56% IEEE Transactions on Components, Packaging and Manufacturing Technology 4 публикации, 5.56%
IEEE Transactions on Electron Devices	IEEE Transactions on Electron Devices, 3, 4.17% IEEE Transactions on Electron Devices 3 публикации, 4.17%
IEEE Electron Device Letters	IEEE Electron Device Letters, 2, 2.78% IEEE Electron Device Letters 2 публикации, 2.78%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes	Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 2, 2.78% Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes 2 публикации, 2.78%
ECS Journal of Solid State Science and Technology	ECS Journal of Solid State Science and Technology, 1, 1.39% ECS Journal of Solid State Science and Technology 1 публикация, 1.39%
ACS Materials Letters	ACS Materials Letters, 1, 1.39% ACS Materials Letters 1 публикация, 1.39%
Materials	Materials, 1, 1.39% Materials 1 публикация, 1.39%
Applied Surface Science	Applied Surface Science, 1, 1.39% Applied Surface Science 1 публикация, 1.39%
IEEE Solid-State Circuits Letters	IEEE Solid-State Circuits Letters, 1, 1.39% IEEE Solid-State Circuits Letters 1 публикация, 1.39%
Crystal Growth and Design	Crystal Growth and Design, 1, 1.39% Crystal Growth and Design 1 публикация, 1.39%
Nanomaterials	Nanomaterials, 1, 1.39% Nanomaterials 1 публикация, 1.39%
Russian Chemical Reviews	Russian Chemical Reviews, 1, 1.39% Russian Chemical Reviews 1 публикация, 1.39%
Journal of Electronic Materials	Journal of Electronic Materials, 1, 1.39% Journal of Electronic Materials 1 публикация, 1.39%
Journal of Electronic Packaging, Transactions of the ASME	Journal of Electronic Packaging, Transactions of the ASME, 1, 1.39% Journal of Electronic Packaging, Transactions of the ASME 1 публикация, 1.39%
Micromachines	Micromachines, 1, 1.39% Micromachines 1 публикация, 1.39%
Electronic Materials Letters	Electronic Materials Letters, 1, 1.39% Electronic Materials Letters 1 публикация, 1.39%
Journal of the Korean Physical Society	Journal of the Korean Physical Society, 1, 1.39% Journal of the Korean Physical Society 1 публикация, 1.39%
	1 2 3 4

Издатели

	10 20 30 40 50 60
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 57, 79.17% Institute of Electrical and Electronics Engineers (IEEE) 57 публикаций, 79.17%
MDPI	MDPI, 3, 4.17% MDPI 3 публикации, 4.17%
Springer Nature	Springer Nature, 3, 4.17% Springer Nature 3 публикации, 4.17%
American Chemical Society (ACS)	American Chemical Society (ACS), 2, 2.78% American Chemical Society (ACS) 2 публикации, 2.78%
IOP Publishing	IOP Publishing, 2, 2.78% IOP Publishing 2 публикации, 2.78%
The Electrochemical Society	The Electrochemical Society, 1, 1.39% The Electrochemical Society 1 публикация, 1.39%
Elsevier	Elsevier, 1, 1.39% Elsevier 1 публикация, 1.39%
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii	Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii, 1, 1.39% Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii 1 публикация, 1.39%
ASME International	ASME International, 1, 1.39% ASME International 1 публикация, 1.39%
	10 20 30 40 50 60

Мы не учитываем публикации, у которых нет DOI.
Статистика публикаций обновляется еженедельно.

Вы ученый?

Создайте профиль, чтобы получать персональные рекомендации коллег, конференций и новых статей.

Войти с ORCID

Метрики

Издатель

Institute of Electrical and Electronics Engineers (IEEE)