Institute of Electrical and Electronics Engineers (IEEE)

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

Тип публикации: Proceedings Article

Дата публикации: 2018-12-01

Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/IEDM.2018.8614570

Краткое описание

Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from 8.8 μm down to 1.44 μm bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.

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Institute of Electrical and Electronics Engineers (IEEE)