High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer
S. Manda
1
,
R. Matsumoto
1
,
S. SAITO
1
,
S. Maruyama
1
,
H. Minari
1
,
T. Takachi
1
,
N. fujii
1
,
Y. Yamamoto
1
,
Y. Zaizen
1
,
T. Hirano
1
,
H. Iwamoto
1
1
Sony Semiconductor Solutions Corporation
Publication type: Proceedings Article
Publication date: 2019-12-01
—
Abstract
We developed a back-illuminated InGaAs image sensor with 1280x1040 pixels at 5-um pitch by using Cu-Cu hybridization connecting different materials, a III-V InGaAs/InP of photodiode array (PDA), and a silicon readout integrated circuit (ROIC). A new process architecture using an InGaAs/InP dies-to-silicon wafer and Cu-Cu bonding was established for high productivity and pixel-pitch scaling. We achieved low dark current and high sensitivity for wavelengths ranging from visible to short-wavelength infrared (SWIR).
Top-30
Citations by journals
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3
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IEEE Transactions on Electron Devices
3 publications, 7.69%
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Electronics (Switzerland)
2 publications, 5.13%
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Nature Electronics
2 publications, 5.13%
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IEEE Transactions on Circuits and Systems I: Regular Papers
2 publications, 5.13%
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Sensors
2 publications, 5.13%
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Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
2 publications, 5.13%
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Coatings
1 publication, 2.56%
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Materials
1 publication, 2.56%
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Information Display
1 publication, 2.56%
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Journal of the Society for Information Display
1 publication, 2.56%
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ACS Applied Electronic Materials
1 publication, 2.56%
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Crystal Growth and Design
1 publication, 2.56%
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IEEE Electron Device Letters
1 publication, 2.56%
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IEEE Journal of Selected Topics in Quantum Electronics
1 publication, 2.56%
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IEEE Sensors Journal
1 publication, 2.56%
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SID Symposium Digest of Technical Papers
1 publication, 2.56%
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Nature Communications
1 publication, 2.56%
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IEEE Transactions on Nanotechnology
1 publication, 2.56%
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Physica Status Solidi (A) Applications and Materials Science
1 publication, 2.56%
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Russian Chemical Reviews
1 publication, 2.56%
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Integration, the VLSI Journal
1 publication, 2.56%
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Citations by publishers
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12
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IEEE
11 publications, 28.21%
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Multidisciplinary Digital Publishing Institute (MDPI)
6 publications, 15.38%
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Wiley
4 publications, 10.26%
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Springer Nature
3 publications, 7.69%
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American Chemical Society (ACS)
2 publications, 5.13%
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Elsevier
2 publications, 5.13%
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IOP Publishing
2 publications, 5.13%
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Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii
1 publication, 2.56%
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- We do not take into account publications without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
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