Institute of Electrical and Electronics Engineers (IEEE)

Evaluation of Fan-out Wafer Level Package strength by three-point bending testing

Cheng Xu ^{1, 2}

Zi-Rui Zhong ³

W. K. Choi ¹

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JCET STATS ChipPAC Pte Ltd

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore |

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore- 639798 |

Publication type: Proceedings Article

Publication date: 2016-07-01

Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/IPFA.2016.7564304

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Abstract

The Fan-out Wafer Level Package (FOWLP) becomes more attractive because of its flexibility for integration of diverse devices in a very small form factor. As the FOWLP is composed of various materials, the proper structural and material designs are important to meet reliability requirements. In this study, mechanical properties of FOWLPs with different structures were evaluated by a three-point-bending test method. It aims to understand the effect of structural factors on package strength and its reliability.

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Institute of Electrical and Electronics Engineers (IEEE)