IEEE Spectrum, volume 57, issue 3, pages 24-29

Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town

Peter Palomaki
Sean Keuleyan
Publication typeJournal Article
Publication date2020-03-01
Journal: IEEE Spectrum
Quartile SCImago
Q3
Quartile WOS
Q2
Impact factor3.1
ISSN00189235, 19399340
Electrical and Electronic Engineering
Abstract
In the early 2000s, the commercialization of CMOS image sensors led to smaller and smaller - and cheaper and cheaper - digital cameras. Now the thinnest of mobile phones contains at least two camera modules, and all except the most dedicated photographers have stopped carrying a separate camera, concluding that the camera sensors in their phones take pictures that are good enough.

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Palomaki P., Keuleyan S. Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town // IEEE Spectrum. 2020. Vol. 57. No. 3. pp. 24-29.
GOST all authors (up to 50) Copy
Palomaki P., Keuleyan S. Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town // IEEE Spectrum. 2020. Vol. 57. No. 3. pp. 24-29.
RIS |
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RIS Copy
TY - JOUR
DO - 10.1109/mspec.2020.9014456
UR - https://doi.org/10.1109/mspec.2020.9014456
TI - Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town
T2 - IEEE Spectrum
AU - Palomaki, Peter
AU - Keuleyan, Sean
PY - 2020
DA - 2020/03/01 00:00:00
PB - IEEE
SP - 24-29
IS - 3
VL - 57
SN - 0018-9235
SN - 1939-9340
ER -
BibTex |
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BibTex Copy
@article{2020_Palomaki,
author = {Peter Palomaki and Sean Keuleyan},
title = {Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town},
journal = {IEEE Spectrum},
year = {2020},
volume = {57},
publisher = {IEEE},
month = {mar},
url = {https://doi.org/10.1109/mspec.2020.9014456},
number = {3},
pages = {24--29},
doi = {10.1109/mspec.2020.9014456}
}
MLA
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MLA Copy
Palomaki, Peter, and Sean Keuleyan. “Snapshots by quantum dots: Look out, CMOS image sensors. There's a new kid in camera-town.” IEEE Spectrum, vol. 57, no. 3, Mar. 2020, pp. 24-29. https://doi.org/10.1109/mspec.2020.9014456.
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