IEEE Transactions on Applied Superconductivity, volume 33, issue 5, pages 1-8
BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies
Publication type: Journal Article
Publication date: 2023-08-01
Q2
Q3
SJR: 0.500
CiteScore: 3.5
Impact factor: 1.7
ISSN: 10518223, 15582515, 23787074
Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
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Semenov V., Golden E. B., Tolpygo S. K. BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies // IEEE Transactions on Applied Superconductivity. 2023. Vol. 33. No. 5. pp. 1-8.
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Semenov V., Golden E. B., Tolpygo S. K. BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies // IEEE Transactions on Applied Superconductivity. 2023. Vol. 33. No. 5. pp. 1-8.
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TY - JOUR
DO - 10.1109/TASC.2023.3252495
UR - https://doi.org/10.1109/TASC.2023.3252495
TI - BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies
T2 - IEEE Transactions on Applied Superconductivity
AU - Semenov, V.K.
AU - Golden, Evan B.
AU - Tolpygo, Sergey K.
PY - 2023
DA - 2023/08/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
SP - 1-8
IS - 5
VL - 33
SN - 1051-8223
SN - 1558-2515
SN - 2378-7074
ER -
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@article{2023_Semenov,
author = {V.K. Semenov and Evan B. Golden and Sergey K. Tolpygo},
title = {BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies},
journal = {IEEE Transactions on Applied Superconductivity},
year = {2023},
volume = {33},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)},
month = {aug},
url = {https://doi.org/10.1109/TASC.2023.3252495},
number = {5},
pages = {1--8},
doi = {10.1109/TASC.2023.3252495}
}
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MLA
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Semenov, V.K., et al. “BioSFQ Circuit Family for Neuromorphic Computing: Bridging Digital and Analog Domains of Superconductor Technologies.” IEEE Transactions on Applied Superconductivity, vol. 33, no. 5, Aug. 2023, pp. 1-8. https://doi.org/10.1109/TASC.2023.3252495.