Physics of the Solid State, volume 64, issue 2, pages 33-37
Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films
Publication type: Journal Article
Publication date: 2022-02-01
Journal:
Physics of the Solid State
Quartile SCImago
Q4
Quartile WOS
Q4
Impact factor: 0.6
ISSN: 10637834, 10906460, 17267498
Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Abstract
The formation of the Cu6Sn5 intermetallic in Sn(55nm)/Cu(30nm) thin-film bilayers has been studied upon heating the film sample from room temperature to 300°C directly in a column of a transmission electron microscope in the electron diffraction mode with recording electron diffraction patterns. The thin films synthesized by the solid-state reaction have been found to be single-phase and consist of the η-Cu6Sn5 hexagonal phase (95‒260°C). It has been suggested basing on the effective interdiffusion coefficient (5 × 10‒16 m2/s) estimated in the course of the reaction that the main mechanism of the formation of the Cu6Sn5 thin films is diffusion along grain boundaries and dislocations.
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Bykova L. et al. Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films // Physics of the Solid State. 2022. Vol. 64. No. 2. pp. 33-37.
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Bykova L., Zharkov S. M., Myagkov V. G., Balashov Yu. Yu., Patrin G. S. Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films // Physics of the Solid State. 2022. Vol. 64. No. 2. pp. 33-37.
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TY - JOUR
DO - 10.1134/s1063783422010048
UR - https://doi.org/10.1134/s1063783422010048
TI - Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films
T2 - Physics of the Solid State
AU - Bykova, L.E.
AU - Zharkov, S M
AU - Myagkov, V G
AU - Balashov, Yu Yu
AU - Patrin, G S
PY - 2022
DA - 2022/02/01
PB - Pleiades Publishing
SP - 33-37
IS - 2
VL - 64
SN - 1063-7834
SN - 1090-6460
SN - 1726-7498
ER -
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@article{2022_Bykova,
author = {L.E. Bykova and S M Zharkov and V G Myagkov and Yu Yu Balashov and G S Patrin},
title = {Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films},
journal = {Physics of the Solid State},
year = {2022},
volume = {64},
publisher = {Pleiades Publishing},
month = {feb},
url = {https://doi.org/10.1134/s1063783422010048},
number = {2},
pages = {33--37},
doi = {10.1134/s1063783422010048}
}
Cite this
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Bykova, L.E., et al. “Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films.” Physics of the Solid State, vol. 64, no. 2, Feb. 2022, pp. 33-37. https://doi.org/10.1134/s1063783422010048.