ECS Journal of Solid State Science and Technology, volume 7, issue 2, pages P55-P59

Comparison of the Etch Mask Selectivity of Nickel and Copper for a Deep, Anisotropic Plasma Etching Process of Silicon Carbide (SiC)

Mehmet Ozgur 1
, 
Michael Pedersen 1
, 
Michael Huff 1
1
 
MEMS and Nanotechnology Exchange, Corporation for National Research Initiatives, Reston, Virginia 20191, USA | 
Publication type: Journal Article
Publication date: 2018-01-17
scimago Q3
SJR: 0.416
CiteScore: 4.5
Impact factor: 1.8
ISSN: 21628769, 21628777
Electronic, Optical and Magnetic Materials
Found 
Found 

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