Open Access
Sensors and Materials, volume 31, issue 3, pages 729
Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint
Publication type: Journal Article
Publication date: 2019-03-08
Journal:
Sensors and Materials
Quartile SCImago
Q3
Quartile WOS
Q4
Impact factor: 1.2
ISSN: 09144935, 24350869
General Materials Science
Instrumentation
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Kanetsuki S., Miyake S., Namazu T. Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint // Sensors and Materials. 2019. Vol. 31. No. 3. p. 729.
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Kanetsuki S., Miyake S., Namazu T. Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint // Sensors and Materials. 2019. Vol. 31. No. 3. p. 729.
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TY - JOUR
DO - 10.18494/SAM.2019.2076
UR - https://doi.org/10.18494/SAM.2019.2076
TI - Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint
T2 - Sensors and Materials
AU - Kanetsuki, S
AU - Miyake, S
AU - Namazu, T
PY - 2019
DA - 2019/03/08
PB - M Y U Scientific Publishing Division
SP - 729
IS - 3
VL - 31
SN - 0914-4935
SN - 2435-0869
ER -
Cite this
BibTex
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@article{2019,
author = {S Kanetsuki and S Miyake and T Namazu},
title = {Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint},
journal = {Sensors and Materials},
year = {2019},
volume = {31},
publisher = {M Y U Scientific Publishing Division},
month = {mar},
url = {https://doi.org/10.18494/SAM.2019.2076},
number = {3},
pages = {729},
doi = {10.18494/SAM.2019.2076}
}