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volume 12 issue 9 pages 2144

TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy

Publication typeJournal Article
Publication date2023-05-08
scimago Q2
wos Q2
SJR0.615
CiteScore6.1
Impact factor2.6
ISSN20799292
Electrical and Electronic Engineering
Hardware and Architecture
Computer Networks and Communications
Control and Systems Engineering
Signal Processing
Abstract

We fabricated superconducting and ferromagnetic nanostructures, which are intended for applications in transmission electron microscopy (TEM), in a commercial sample holder that can be cooled using liquid helium. Nanoscale superconducting quantum-interference devices (nanoSQUIDs) with sub-100 nm nanobridge Josephson junctions (nJJs) were prepared at a distance of ~300 nm from the edges of a 2 mm × 2 mm × 0.05 mm substrate. Thin-film TiN-NbN-TiN heterostructures were used to optimize the superconducting parameters and enhance the oxidation and corrosion resistance of nJJs and nanoSQUIDs. Non-hysteretic I(V) characteristics of nJJs, as well as peak-to-peak quantum oscillations in the V(B) characteristics of the nanoSQUIDs with an amplitude of up to ~20 µV, were obtained at a temperature ~5 K, which is suitable for operation in TEM. Electron-beam lithography, high-selectivity reactive ion etching with pure SF6 gas, and a naturally created undercut in the Si substrate were used to prepare nanoSQUIDs on a SiN membrane within ~500 nm from the edge of the substrate. Permalloy nanodots with diameters down to ~100 nm were prepared on SiN membranes using three nanofabrication methods. High-resolution TEM revealed that permalloy films on a SiN buffer have a polycrystalline structure with an average grain dimension of approximately 5 nm and a lattice constant of ~0.36 nm. The M(H) dependences of the permalloy films were measured and revealed coercive fields of 2 and 10 G at 300 and 5 K, respectively. These technologies are promising for the fabrication of superconducting electronics based on nJJs and ferromagnetic nanostructures for operation in TEM.

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Faley M. et al. TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy // Electronics (Switzerland). 2023. Vol. 12. No. 9. p. 2144.
GOST all authors (up to 50) Copy
Faley M., Williams J., Lu P., Dunin-Borkowski R. TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy // Electronics (Switzerland). 2023. Vol. 12. No. 9. p. 2144.
RIS |
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RIS Copy
TY - JOUR
DO - 10.3390/electronics12092144
UR - https://doi.org/10.3390/electronics12092144
TI - TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy
T2 - Electronics (Switzerland)
AU - Faley, M.I.
AU - Williams, Joshua
AU - Lu, Penghan
AU - Dunin-Borkowski, Rafal
PY - 2023
DA - 2023/05/08
PB - MDPI
SP - 2144
IS - 9
VL - 12
SN - 2079-9292
ER -
BibTex |
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BibTex (up to 50 authors) Copy
@article{2023_Faley,
author = {M.I. Faley and Joshua Williams and Penghan Lu and Rafal Dunin-Borkowski},
title = {TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy},
journal = {Electronics (Switzerland)},
year = {2023},
volume = {12},
publisher = {MDPI},
month = {may},
url = {https://doi.org/10.3390/electronics12092144},
number = {9},
pages = {2144},
doi = {10.3390/electronics12092144}
}
MLA
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MLA Copy
Faley, M.I., et al. “TiN-NbN-TiN and Permalloy Nanostructures for Applications in Transmission Electron Microscopy.” Electronics (Switzerland), vol. 12, no. 9, May. 2023, p. 2144. https://doi.org/10.3390/electronics12092144.