Open Access
Open access
Micromachines, volume 9, issue 3, pages 138

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Publication type: Journal Article
Publication date: 2018-03-20
Journal: Micromachines
scimago Q2
SJR: 0.549
CiteScore: 5.2
Impact factor: 3
ISSN: 2072666X
DOI:  10.3390/mi9030138
PubMed ID:  30424072
Electrical and Electronic Engineering
Mechanical Engineering
Control and Systems Engineering
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