Development of Thick Copper Covered Wire
1
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Publication type: Journal Article
Publication date: 2023-03-31
SJR: —
CiteScore: —
Impact factor: —
ISSN: 03856917, 13481479
Abstract
The need for conductor materials such as copper alloys is increasing as the IoT of society progresses. The properties required for conductor materials are diverse, including high strength, light weight, high flexibility, and elasticity, therefore copper alloys that match the required properties are selected. However, many copper alloys have a trade- off relationship between strength and conductivity. Since conductivity has the higher priority, the strength of selected material has the tendency of being short of the required level. Among them, copper beryllium alloy is a conductive material that has both strength and conductivity, and has excellent spring properties, but there are still problems such as the possibility of adverse effects on the human body and the high cost. In this paper, we report the physical properties of TCC wire, a high-strength conductor developed to solve these problems.
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Matsuoka K. et al. Development of Thick Copper Covered Wire // Transactions of Japan Society of Spring Engineers. 2023. Vol. 2023. No. 68. pp. 17-20.
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Matsuoka K., HOSHIMA A., IZUMIDA H., Kimura M. Development of Thick Copper Covered Wire // Transactions of Japan Society of Spring Engineers. 2023. Vol. 2023. No. 68. pp. 17-20.
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TY - JOUR
DO - 10.5346/trbane.2023.17
UR - https://www.jstage.jst.go.jp/article/trbane/2023/68/2023_17/_article/-char/ja/
TI - Development of Thick Copper Covered Wire
T2 - Transactions of Japan Society of Spring Engineers
AU - Matsuoka, Kenta
AU - HOSHIMA, Akihito
AU - IZUMIDA, Hiromu
AU - Kimura, Mitsuhiro
PY - 2023
DA - 2023/03/31
PB - Japan Society of Spring Engineers
SP - 17-20
IS - 68
VL - 2023
SN - 0385-6917
SN - 1348-1479
ER -
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@article{2023_Matsuoka,
author = {Kenta Matsuoka and Akihito HOSHIMA and Hiromu IZUMIDA and Mitsuhiro Kimura},
title = {Development of Thick Copper Covered Wire},
journal = {Transactions of Japan Society of Spring Engineers},
year = {2023},
volume = {2023},
publisher = {Japan Society of Spring Engineers},
month = {mar},
url = {https://www.jstage.jst.go.jp/article/trbane/2023/68/2023_17/_article/-char/ja/},
number = {68},
pages = {17--20},
doi = {10.5346/trbane.2023.17}
}
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MLA
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Matsuoka, Kenta, et al. “Development of Thick Copper Covered Wire.” Transactions of Japan Society of Spring Engineers, vol. 2023, no. 68, Mar. 2023, pp. 17-20. https://www.jstage.jst.go.jp/article/trbane/2023/68/2023_17/_article/-char/ja/.