Open Access
Modelling of wafer heating during rapid thermal processing
Тип публикации: Journal Article
Дата публикации: 1990-02-01
SCImago Q2
WOS Q2
БС2
SJR: 0.474
CiteScore: 5.2
Impact factor: 3
ISSN: 09478396, 14320630
General Chemistry
General Materials Science
Physics and Astronomy (miscellaneous)
General Engineering
Краткое описание
A theory of wafer heating during rapid thermal processing is presented. It is demonstrated that temperature uniformity is not only limited by radiation loss at the wafer edge in the stationary state but also influenced by transient effects during temperature ramping. Whereas a compensation of edge losses call for enhanced illumination intensities at the wafer periphery, the avoidance of transient temperature gradients would require uniform illumination. Calculations for various system configurations lead to optimized processing cycles and suggest possible improvements of RTP equipment.
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ГОСТ
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Kakoschke R., Bumann E., Fll H. Modelling of wafer heating during rapid thermal processing // Applied Physics A: Materials Science and Processing. 1990. Vol. 50. No. 2. pp. 141-150.
ГОСТ со всеми авторами (до 50)
Скопировать
Kakoschke R., Bumann E., Fll H. Modelling of wafer heating during rapid thermal processing // Applied Physics A: Materials Science and Processing. 1990. Vol. 50. No. 2. pp. 141-150.
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RIS
Скопировать
TY - JOUR
DO - 10.1007/bf00343409
UR - https://doi.org/10.1007/bf00343409
TI - Modelling of wafer heating during rapid thermal processing
T2 - Applied Physics A: Materials Science and Processing
AU - Kakoschke, R.
AU - Bumann, E.
AU - Fll, H
PY - 1990
DA - 1990/02/01
PB - Springer Nature
SP - 141-150
IS - 2
VL - 50
SN - 0947-8396
SN - 1432-0630
ER -
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BibTex (до 50 авторов)
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@article{1990_Kakoschke,
author = {R. Kakoschke and E. Bumann and H Fll},
title = {Modelling of wafer heating during rapid thermal processing},
journal = {Applied Physics A: Materials Science and Processing},
year = {1990},
volume = {50},
publisher = {Springer Nature},
month = {feb},
url = {https://doi.org/10.1007/bf00343409},
number = {2},
pages = {141--150},
doi = {10.1007/bf00343409}
}
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MLA
Скопировать
Kakoschke, R., et al. “Modelling of wafer heating during rapid thermal processing.” Applied Physics A: Materials Science and Processing, vol. 50, no. 2, Feb. 1990, pp. 141-150. https://doi.org/10.1007/bf00343409.
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