Open Access

Applied Physics A: Materials Science and Processing

, том 45 , издание 2 , страницы 151-154

Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate

Тип публикации: Journal Article

Дата публикации: 1988-08-01

Springer Nature

Applied Physics A: Materials Science and Processing

SCImago Q2

WOS Q2

БС2

SJR: 0.474

CiteScore: 5.2

Impact factor: 3

ISSN: 09478396, 14320630

DOI: 10.1007/bf02565202

Скопировать DOI

General Chemistry

General Materials Science

Physics and Astronomy (miscellaneous)

General Engineering

Краткое описание

Thin copper films are produced by plasma-enhanced chemical vapour deposition (PECVD) using copper-hexafluoro-acetylacetonate (CF3-CO-CH=C(O)-CF3)2Cu in argon-hydrogen mixtures. Film qualities depend on power density, gas flow, and substrate temperature. ESCA spectra show no Cu-F bonds in the films.

Для доступа к списку цитирований публикации необходимо авторизоваться.

Войти с ORCID

Топ-30

Журналы

	1 2 3 4 5 6
MRS Proceedings	MRS Proceedings, 6, 13.95% MRS Proceedings 6 публикаций, 13.95%
Applied Physics Letters	Applied Physics Letters, 3, 6.98% Applied Physics Letters 3 публикации, 6.98%
Thin Solid Films	Thin Solid Films, 2, 4.65% Thin Solid Films 2 публикации, 4.65%
Surface and Coatings Technology	Surface and Coatings Technology, 2, 4.65% Surface and Coatings Technology 2 публикации, 4.65%
Chemical Vapor Deposition	Chemical Vapor Deposition, 2, 4.65% Chemical Vapor Deposition 2 публикации, 4.65%
Materials Chemistry and Physics	Materials Chemistry and Physics, 1, 2.33% Materials Chemistry and Physics 1 публикация, 2.33%
Journal of Applied Physics	Journal of Applied Physics, 1, 2.33% Journal of Applied Physics 1 публикация, 2.33%
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 1, 2.33% Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 1 публикация, 2.33%
Microelectronic Engineering	Microelectronic Engineering, 1, 2.33% Microelectronic Engineering 1 публикация, 2.33%
Journal of Materials Research	Journal of Materials Research, 1, 2.33% Journal of Materials Research 1 публикация, 2.33%
Journal of Electronic Materials	Journal of Electronic Materials, 1, 2.33% Journal of Electronic Materials 1 публикация, 2.33%
Coordination Chemistry Reviews	Coordination Chemistry Reviews, 1, 2.33% Coordination Chemistry Reviews 1 публикация, 2.33%
Measurement Science and Technology	Measurement Science and Technology, 1, 2.33% Measurement Science and Technology 1 публикация, 2.33%
Russian Chemical Reviews	Russian Chemical Reviews, 1, 2.33% Russian Chemical Reviews 1 публикация, 2.33%
Materials Research Bulletin	Materials Research Bulletin, 1, 2.33% Materials Research Bulletin 1 публикация, 2.33%
Polyhedron	Polyhedron, 1, 2.33% Polyhedron 1 публикация, 2.33%
Advanced Materials	Advanced Materials, 1, 2.33% Advanced Materials 1 публикация, 2.33%
Advanced Materials for Optics and Electronics	Advanced Materials for Optics and Electronics, 1, 2.33% Advanced Materials for Optics and Electronics 1 публикация, 2.33%
Chemistry - A European Journal	Chemistry - A European Journal, 1, 2.33% Chemistry - A European Journal 1 публикация, 2.33%
Plasma Processes and Polymers	Plasma Processes and Polymers, 1, 2.33% Plasma Processes and Polymers 1 публикация, 2.33%
Journal of Physical Chemistry B	Journal of Physical Chemistry B, 1, 2.33% Journal of Physical Chemistry B 1 публикация, 2.33%
Progress in Inorganic Chemistry	Progress in Inorganic Chemistry, 1, 2.33% Progress in Inorganic Chemistry 1 публикация, 2.33%
Acta Crystallographica Section E Structure Reports Online	Acta Crystallographica Section E Structure Reports Online, 1, 2.33% Acta Crystallographica Section E Structure Reports Online 1 публикация, 2.33%
Plasma Chemistry and Plasma Processing	Plasma Chemistry and Plasma Processing, 1, 2.33% Plasma Chemistry and Plasma Processing 1 публикация, 2.33%
	1 2 3 4 5 6

Издатели

	2 4 6 8 10 12
Elsevier	Elsevier, 11, 25.58% Elsevier 11 публикаций, 25.58%
Springer Nature	Springer Nature, 9, 20.93% Springer Nature 9 публикаций, 20.93%
Wiley	Wiley, 8, 18.6% Wiley 8 публикаций, 18.6%
AIP Publishing	AIP Publishing, 4, 9.3% AIP Publishing 4 публикации, 9.3%
American Vacuum Society	American Vacuum Society, 1, 2.33% American Vacuum Society 1 публикация, 2.33%
IOP Publishing	IOP Publishing, 1, 2.33% IOP Publishing 1 публикация, 2.33%
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii	Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii, 1, 2.33% Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii 1 публикация, 2.33%
American Chemical Society (ACS)	American Chemical Society (ACS), 1, 2.33% American Chemical Society (ACS) 1 публикация, 2.33%
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 1, 2.33% Institute of Electrical and Electronics Engineers (IEEE) 1 публикация, 2.33%
International Union of Crystallography (IUCr)	International Union of Crystallography (IUCr), 1, 2.33% International Union of Crystallography (IUCr) 1 публикация, 2.33%
	2 4 6 8 10 12

Мы не учитываем публикации, у которых нет DOI.
Статистика публикаций обновляется еженедельно.

Вы ученый?

Создайте профиль, чтобы получать персональные рекомендации коллег, конференций и новых статей.

Войти с ORCID

PDF

Метрики

Цитировать

ГОСТ |

Цитировать

ГОСТ Скопировать

OEHR C., SUHR H. Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate // Applied Physics A: Materials Science and Processing. 1988. Vol. 45. No. 2. pp. 151-154.

ГОСТ со всеми авторами (до 50) Скопировать

OEHR C., SUHR H. Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate // Applied Physics A: Materials Science and Processing. 1988. Vol. 45. No. 2. pp. 151-154.

RIS |

Цитировать

RIS Скопировать

TY - JOUR

DO - 10.1007/bf02565202

UR - https://doi.org/10.1007/bf02565202

TI - Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate

T2 - Applied Physics A: Materials Science and Processing

AU - OEHR, C.

AU - SUHR, H.

PY - 1988

DA - 1988/08/01

PB - Springer Nature

SP - 151-154

IS - 2

VL - 45

SN - 0947-8396

SN - 1432-0630

ER -

BibTex |

Цитировать

BibTex (до 50 авторов) Скопировать

@article{1988_OEHR,

author = {C. OEHR and H. SUHR},

title = {Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate},

journal = {Applied Physics A: Materials Science and Processing},

year = {1988},

volume = {45},

publisher = {Springer Nature},

month = {aug},

url = {https://doi.org/10.1007/bf02565202},

number = {2},

pages = {151--154},

doi = {10.1007/bf02565202}

}

MLA

Цитировать

MLA Скопировать

OEHR, C., and H. SUHR. “Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate.” Applied Physics A: Materials Science and Processing, vol. 45, no. 2, Aug. 1988, pp. 151-154. https://doi.org/10.1007/bf02565202.

Издатель

Springer Nature

Журнал

Applied Physics A: Materials Science and Processing

SCImago Q2

WOS Q2

БС2

SJR

0.474

CiteScore

5.2

Impact factor