Advances in Colloid and Interface Science, volume 285, pages 102271

Applying droplets and films in evaporative lithography

Kolegov K. S. ^{1, 2, 3}

Barash L. Yu. ⁴

Hide authors affiliations Show authors affiliations: 4 affiliations

Astrakhan State University, 414056 Astrakhan, Russia |

Caspian Institute of Maritime and River Transport, Volga State University of Water Transport, 414014 Astrakhan, Russia |

Landau Institute for Theoretical Physics, 142432 Chernogolovka, Russia. |

⁴

Landau Institute for Theoretical Physics, 142432 Chernogolovka, Russia |

Publication type: Journal Article

Publication date: 2020-11-01

Elsevier

Journal: Advances in Colloid and Interface Science

Quartile SCImago

Quartile WOS

Impact factor: 15.6

ISSN: 00018686

DOI: 10.1016/j.cis.2020.102271

Copy DOI

Physical and Theoretical Chemistry

Colloid and Surface Chemistry

Surfaces and Interfaces

Abstract

This review covers experimental results of evaporative lithography and analyzes existing mathematical models of this method. Evaporating droplets and films are used in different fields, such as cooling of heated surfaces of electronic devices, diagnostics in health care, creation of transparent conductive coatings on flexible substrates, and surface patterning. A method called evaporative lithography emerged after the connection between the coffee ring effect taking place in drying colloidal droplets and naturally occurring inhomogeneous vapor flux densities from liquid--vapor interfaces was established. Essential control of the colloidal particle deposit patterns is achieved in this method by producing ambient conditions that induce a nonuniform evaporation profile from the colloidal liquid surface. Evaporative lithography is part of a wider field known as "evaporative-induced self-assembly" (EISA). EISA involves methods based on contact line processes, methods employing particle interaction effects, and evaporative lithography. As a rule, evaporative lithography is a flexible and single-stage process with such advantages as simplicity, low price, and the possibility of application to almost any substrate without pretreatment. Since there is no mechanical impact on the template in evaporative lithography, the template integrity is preserved in the process. The method is also useful for creating materials with localized functions, such as slipperiness and self-healing. For these reasons, evaporative lithography attracts increasing attention and has a number of noticeable achievements at present. We also analyze limitations of the approach and ways of its further development.

By date By citations

Citations by journals

	1 2 3
Physics of Fluids	Physics of Fluids, 3, 10% Physics of Fluids 3 publications, 10%
Langmuir	Langmuir, 3, 10% Langmuir 3 publications, 10%
Journal of Physics: Conference Series	Journal of Physics: Conference Series, 2, 6.67% Journal of Physics: Conference Series 2 publications, 6.67%
International Journal of Heat and Mass Transfer	International Journal of Heat and Mass Transfer, 2, 6.67% International Journal of Heat and Mass Transfer 2 publications, 6.67%
International Communications in Heat and Mass Transfer	International Communications in Heat and Mass Transfer, 2, 6.67% International Communications in Heat and Mass Transfer 2 publications, 6.67%
Physical Review E	Physical Review E, 1, 3.33% Physical Review E 1 publication, 3.33%
Aggregate	Aggregate, 1, 3.33% Aggregate 1 publication, 3.33%
Energies	Energies, 1, 3.33% Energies 1 publication, 3.33%
Materials	Materials, 1, 3.33% Materials 1 publication, 3.33%
European Physical Journal E	European Physical Journal E, 1, 3.33% European Physical Journal E 1 publication, 3.33%
European Journal of Applied Mathematics	European Journal of Applied Mathematics, 1, 3.33% European Journal of Applied Mathematics 1 publication, 3.33%
Journal of Industrial and Engineering Chemistry	Journal of Industrial and Engineering Chemistry, 1, 3.33% Journal of Industrial and Engineering Chemistry 1 publication, 3.33%
Polymer	Polymer, 1, 3.33% Polymer 1 publication, 3.33%
Small	Small, 1, 3.33% Small 1 publication, 3.33%
Journal of Physical Chemistry Letters	Journal of Physical Chemistry Letters, 1, 3.33% Journal of Physical Chemistry Letters 1 publication, 3.33%
Annual Review of Fluid Mechanics	Annual Review of Fluid Mechanics, 1, 3.33% Annual Review of Fluid Mechanics 1 publication, 3.33%
Colloid Journal	Colloid Journal, 1, 3.33% Colloid Journal 1 publication, 3.33%
Journal of Experimental and Theoretical Physics	Journal of Experimental and Theoretical Physics, 1, 3.33% Journal of Experimental and Theoretical Physics 1 publication, 3.33%
Journal of Molecular Liquids	Journal of Molecular Liquids, 1, 3.33% Journal of Molecular Liquids 1 publication, 3.33%
Journal of Fluid Mechanics	Journal of Fluid Mechanics, 1, 3.33% Journal of Fluid Mechanics 1 publication, 3.33%
Colloids and Interfaces	Colloids and Interfaces, 1, 3.33% Colloids and Interfaces 1 publication, 3.33%
Diamond and Related Materials	Diamond and Related Materials, 1, 3.33% Diamond and Related Materials 1 publication, 3.33%
Surfaces and Interfaces	Surfaces and Interfaces, 1, 3.33% Surfaces and Interfaces 1 publication, 3.33%
	1 2 3

Citations by publishers

	1 2 3 4 5 6 7 8
Elsevier	Elsevier, 8, 26.67% Elsevier 8 publications, 26.67%
American Chemical Society (ACS)	American Chemical Society (ACS), 4, 13.33% American Chemical Society (ACS) 4 publications, 13.33%
American Institute of Physics (AIP)	American Institute of Physics (AIP), 3, 10% American Institute of Physics (AIP) 3 publications, 10%
Multidisciplinary Digital Publishing Institute (MDPI)	Multidisciplinary Digital Publishing Institute (MDPI), 3, 10% Multidisciplinary Digital Publishing Institute (MDPI) 3 publications, 10%
IOP Publishing	IOP Publishing, 2, 6.67% IOP Publishing 2 publications, 6.67%
Wiley	Wiley, 2, 6.67% Wiley 2 publications, 6.67%
Cambridge University Press	Cambridge University Press, 2, 6.67% Cambridge University Press 2 publications, 6.67%
Pleiades Publishing	Pleiades Publishing, 2, 6.67% Pleiades Publishing 2 publications, 6.67%
American Physical Society (APS)	American Physical Society (APS), 1, 3.33% American Physical Society (APS) 1 publication, 3.33%
Springer Nature	Springer Nature, 1, 3.33% Springer Nature 1 publication, 3.33%
Korean Society of Industrial Engineering Chemistry	Korean Society of Industrial Engineering Chemistry, 1, 3.33% Korean Society of Industrial Engineering Chemistry 1 publication, 3.33%
Annual Reviews	Annual Reviews, 1, 3.33% Annual Reviews 1 publication, 3.33%
	1 2 3 4 5 6 7 8

We do not take into account publications that without a DOI.
Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
Statistics recalculated weekly.

{"yearsCitations":{"type":"bar","data":{"show":true,"labels":[2021,2022,2023,2024],"ids":[0,0,0,0],"codes":[0,0,0,0],"imageUrls":["","","",""],"datasets":[{"label":"Citations number","data":[7,8,13,2],"backgroundColor":["#3B82F6","#3B82F6","#3B82F6","#3B82F6"],"percentage":["23.33","26.67","43.33","6.67"],"barThickness":null}]},"options":{"indexAxis":"x","maintainAspectRatio":true,"scales":{"y":{"ticks":{"precision":0,"autoSkip":false,"font":{"family":"Montserrat"},"color":"#000000"}},"x":{"ticks":{"stepSize":1,"precision":0,"font":{"family":"Montserrat"},"color":"#000000"}}},"plugins":{"legend":{"position":"top","labels":{"font":{"family":"Montserrat"},"color":"#000000"}},"title":{"display":true,"text":"Citations per year","font":{"size":24,"family":"Montserrat","weight":600},"color":"#000000"}}}},"journals":{"type":"bar","data":{"show":true,"labels":["Physics of Fluids","Langmuir","Journal of Physics: Conference Series","International Journal of Heat and Mass Transfer","International Communications in Heat and Mass Transfer","Physical Review E","Aggregate","Energies","Materials","European Physical Journal E","European Journal of Applied Mathematics","Journal of Industrial and Engineering Chemistry","Polymer","Small","Journal of Physical Chemistry Letters","Annual Review of Fluid Mechanics","Colloid Journal","Journal of Experimental and Theoretical Physics","Journal of Molecular Liquids","Journal of Fluid Mechanics","Colloids and Interfaces","Diamond and Related Materials","Surfaces and Interfaces"],"ids":[14994,19601,3333,16023,6329,12743,28057,23828,25198,10807,15493,1786,19955,9872,21963,12146,3923,14872,13597,17564,27017,14497,608],"codes":[0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0,0],"imageUrls":["\/storage\/images\/resized\/ARM4e6URKRsbRZvIF0vFis9DjxGloBjnBYJXbHmZ_medium.webp","\/storage\/images\/resized\/iLiQsFqFaSEx6chlGQ5fbAwF6VYU3WWa08hkss0g_medium.webp","\/storage\/images\/resized\/LsKy6OnmmmRGcAU6CZgWQvNiP1polbaSLNrN7zqj_medium.webp","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/nrK64iXHTzj43wMrfN1ZoUQ0vanswGzWPN45K3jA_medium.webp","\/storage\/images\/resized\/bRyGpdm98BkAUYiK1YFNpl5Z7hPu6Gd87gbIeuG3_medium.webp","\/storage\/images\/resized\/MjH1ITP7lMYGxeqUZfkt2BnVLgjkk413jwBV97XX_medium.webp","\/storage\/images\/resized\/MjH1ITP7lMYGxeqUZfkt2BnVLgjkk413jwBV97XX_medium.webp","\/storage\/images\/resized\/voXLqlsvTwv5p3iMQ8Dhs95nqB4AXOG7Taj7G4ra_medium.webp","\/storage\/images\/resized\/cF81zWlLdkmYekymGuDcSdvgBGNKaIDoMoeJtHS1_medium.webp","","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/bRyGpdm98BkAUYiK1YFNpl5Z7hPu6Gd87gbIeuG3_medium.webp","\/storage\/images\/resized\/iLiQsFqFaSEx6chlGQ5fbAwF6VYU3WWa08hkss0g_medium.webp","\/storage\/images\/resized\/A7oGMwx1m3fFJlKJvQUVra8h0itmEa7JZW0q3Q0b_medium.webp","\/storage\/images\/resized\/oZgeErrVFhuDksyqFURLvYS1wtVSBWczh001igGo_medium.webp","\/storage\/images\/resized\/oZgeErrVFhuDksyqFURLvYS1wtVSBWczh001igGo_medium.webp","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/cF81zWlLdkmYekymGuDcSdvgBGNKaIDoMoeJtHS1_medium.webp","\/storage\/images\/resized\/MjH1ITP7lMYGxeqUZfkt2BnVLgjkk413jwBV97XX_medium.webp","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp"],"datasets":[{"label":"","data":[3,3,2,2,2,1,1,1,1,1,1,1,1,1,1,1,1,1,1,1,1,1,1],"backgroundColor":["#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6"],"percentage":[10,10,6.67,6.67,6.67,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33,3.33],"barThickness":13}]},"options":{"indexAxis":"y","maintainAspectRatio":false,"scales":{"y":{"ticks":{"precision":0,"autoSkip":false,"font":{"family":"Montserrat"},"color":"#000000"}},"x":{"ticks":{"stepSize":null,"precision":0,"font":{"family":"Montserrat"},"color":"#000000"}}},"plugins":{"legend":{"position":"top","labels":{"font":{"family":"Montserrat"},"color":"#000000"}},"title":{"display":true,"text":"Journals","font":{"size":24,"family":"Montserrat","weight":600},"color":"#000000"}}}},"publishers":{"type":"bar","data":{"show":true,"labels":["Elsevier","American Chemical Society (ACS)","American Institute of Physics (AIP)","Multidisciplinary Digital Publishing Institute (MDPI)","IOP Publishing","Wiley","Cambridge University Press","Pleiades Publishing","American Physical Society (APS)","Springer Nature","Korean Society of Industrial Engineering Chemistry","Annual Reviews"],"ids":[17,40,250,202,2075,11,1,101,1539,8,709,6941],"codes":[0,0,0,0,0,0,0,0,0,0,0,0],"imageUrls":["\/storage\/images\/resized\/GDnYOu1UpMMfMMRV6Aqle4H0YLLsraeD9IP9qScG_medium.webp","\/storage\/images\/resized\/iLiQsFqFaSEx6chlGQ5fbAwF6VYU3WWa08hkss0g_medium.webp","\/storage\/images\/resized\/ARM4e6URKRsbRZvIF0vFis9DjxGloBjnBYJXbHmZ_medium.webp","\/storage\/images\/resized\/MjH1ITP7lMYGxeqUZfkt2BnVLgjkk413jwBV97XX_medium.webp","\/storage\/images\/resized\/LsKy6OnmmmRGcAU6CZgWQvNiP1polbaSLNrN7zqj_medium.webp","\/storage\/images\/resized\/bRyGpdm98BkAUYiK1YFNpl5Z7hPu6Gd87gbIeuG3_medium.webp","\/storage\/images\/resized\/cF81zWlLdkmYekymGuDcSdvgBGNKaIDoMoeJtHS1_medium.webp","\/storage\/images\/resized\/oZgeErrVFhuDksyqFURLvYS1wtVSBWczh001igGo_medium.webp","\/storage\/images\/resized\/nrK64iXHTzj43wMrfN1ZoUQ0vanswGzWPN45K3jA_medium.webp","\/storage\/images\/resized\/voXLqlsvTwv5p3iMQ8Dhs95nqB4AXOG7Taj7G4ra_medium.webp","","\/storage\/images\/resized\/A7oGMwx1m3fFJlKJvQUVra8h0itmEa7JZW0q3Q0b_medium.webp"],"datasets":[{"label":"","data":[8,4,3,3,2,2,2,2,1,1,1,1],"backgroundColor":["#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6","#3B82F6"],"percentage":[26.67,13.33,10,10,6.67,6.67,6.67,6.67,3.33,3.33,3.33,3.33],"barThickness":13}]},"options":{"indexAxis":"y","maintainAspectRatio":false,"scales":{"y":{"ticks":{"precision":0,"autoSkip":false,"font":{"family":"Montserrat"},"color":"#000000"}},"x":{"ticks":{"stepSize":null,"precision":0,"font":{"family":"Montserrat"},"color":"#000000"}}},"plugins":{"legend":{"position":"top","labels":{"font":{"family":"Montserrat"},"color":"#000000"}},"title":{"display":true,"text":"Publishers","font":{"size":24,"family":"Montserrat","weight":600},"color":"#000000"}}}}}

Metrics

Cite this

GOST |

Cite this

GOST Copy

Kolegov K. S. et al. Applying droplets and films in evaporative lithography // Advances in Colloid and Interface Science. 2020. Vol. 285. p. 102271.

GOST all authors (up to 50) Copy

Kolegov K. S., Barash L. Y. Applying droplets and films in evaporative lithography // Advances in Colloid and Interface Science. 2020. Vol. 285. p. 102271.

RIS |

Cite this

RIS Copy

TY - JOUR

DO - 10.1016/j.cis.2020.102271

UR - https://doi.org/10.1016%2Fj.cis.2020.102271

TI - Applying droplets and films in evaporative lithography

T2 - Advances in Colloid and Interface Science

AU - Kolegov, K. S.

AU - Barash, L. Yu.

PY - 2020

DA - 2020/11/01 00:00:00

PB - Elsevier

SP - 102271

VL - 285

SN - 0001-8686

ER -

BibTex

Cite this

BibTex Copy

@article{2020_Kolegov,

author = {K. S. Kolegov and L. Yu. Barash},

title = {Applying droplets and films in evaporative lithography},

journal = {Advances in Colloid and Interface Science},

year = {2020},

volume = {285},

publisher = {Elsevier},

month = {nov},

url = {https://doi.org/10.1016%2Fj.cis.2020.102271},

pages = {102271},

doi = {10.1016/j.cis.2020.102271}

}

Found error?

Publisher

Elsevier

Journal

Advances in Colloid and Interface Science

Quartile SCImago

Quartile WOS

Impact factor

15.6

ISSN

00018686 (Print)

Labs

Mathematical modeling and information technologies in science and education

Profiles

Kolegov, Konstantin Sergeevich