ACS Nano

, volume 17 , issue 6 , pages 5211-5295

Technology Roadmap for Flexible Sensors

Yifei Luo ^{1, 2}

Mohammad Reza Abidian ³

Mohammad R. Abidian ³

Jong-Hyun Ahn ⁴

Deji Akinwande ^{5, 6}

Anne Lintzenich Andrews ⁷

Markus Antonietti ⁸

Zhenan Bao ⁹

Magnus Berggren ^{10, 11}

Christopher A Berkey ¹²

C Berkey ¹²

Christopher J. Bettinger ¹³

Jun Chen ¹⁴

Peng Chen ¹⁵

Wenlong Cheng ^{16, 17}

Xu Cheng ¹⁸

Seon Jin Choi ¹⁹

Alex Chortos ²⁰

Canan Dagdeviren ²¹

Reinhold H Dauskardt ¹²

Chong-an Di ²²

Michael D Dickey ²³

Xiangfeng Duan ²⁴

Antonio Facchetti ²⁵

Zhiyong Fan ²⁶

Yin Fang ¹⁵

Jianyou Feng ²⁷

Feng Xue ²⁸

Huajian Gao ^{29, 30}

Wei Gao ³¹

Xiwen Gong ³²

Chuan Fei Guo ³³

Xiaojun Guo ³⁴

Martin C Hartel ¹⁴

Zihan He ²²

John S. Ho ^{35, 36, 37}

Youfan Hu ³⁸

Qiyao Huang ³⁹

Yu Huang ⁴⁰

Fengwei Huo ⁴¹

Muhammad M. Hussain ⁴²

Muhammad Iqbal Hussain ⁴²

Ali Javey ^{43, 44}

Unyong Jeong ⁴⁵

Chen Jiang ⁴⁶

Xingyu Jiang ⁴⁷

Jiheong Kang ⁴⁸

Daniil Karnaushenko ⁴⁹

Dmitriy D. Karnaushenko ⁴⁹

Ali Khademhosseini ⁵⁰

Dae-Hyeong KIM ⁵¹

Il-Doo Kim ⁵²

Dmitry A Kireev ^{5, 6}

Lingxuan Kong ¹⁵

Chengkuo Lee ^{36, 53, 54, 55}

Nae-Eung Lee ⁵⁶

Pooi See Lee ^{57, 58}

Tae Woo Lee ^{59, 60, 61, 62}

Fengyu Li ⁶³

Jinxing Li ⁶⁴

Cuiyuan Liang ⁶⁵

Chwee Teck Lim ^{66, 67, 68}

Yuanjing Lin ⁶⁹

Darren Lipomi ⁷⁰

Jia Liu ⁷¹

Kai Liu ⁷²

Nan Liu ⁷³

Ren Liu ⁷¹

Yuxin Liu ^{1, 74}

Yuxuan Liu ⁷⁵

Zhiyuan Liu ⁷⁶

Zhuangjian Liu ³⁰

Xian Jun Loh ¹

Nanshu Lu ⁷⁷

Zhisheng Lv ¹

Shlomo Magdassi ⁷⁸

George G Malliaras ⁷⁹

Naoji MATSUHISA ⁸⁰

Arokia Nathan ⁸¹

Simiao Niu ⁸²

Jieming Pan ³⁶

Changhyun Pang ⁸³

Qibing Pei ⁸⁴

Huisheng Peng ²⁷

Dianpeng Qi ⁶⁵

Huaying Ren ⁸⁵

John A. Rogers ^{86, 87}

Aaron Rowe ^{88, 89}

Oliver G Schmidt ^{49, 90, 91}

Tsuyoshi Sekitani ⁹²

Dae Gyo Seo ⁵⁹

Dae‐Gyo Seo ⁵⁹

Guozhen Shen ⁹³

Xing Sheng ⁹⁴

Qiongfeng Shi ^{36, 53, 54}

Takao Someya ⁹⁵

Yanlin Song ⁹⁶

Eleni Stavrinidou ⁹⁷

Meng Su ⁹⁶

Xuemei Sun ²⁷

Kuniharu Takei ⁹⁸

Xiaoming Tao ⁹⁹

Benjamin C K Tee ^{100, 101}

Aaron Voon Yew Thean ^{36, 102}

Aaron Thean ^{36, 102}

Quang Trung Tran ⁵⁶

Tran Quang Trung ⁵⁶

Changjin Wan ¹⁰³

H C Wang ¹⁰⁴

Joseph Wang ¹⁰⁵

Ming Wang ^{106, 107}

Sihong Wang ¹⁰⁸

Ting Wang ¹⁰⁹

Zhong Lin Wang ^{110, 111}

Paul Weiss ¹¹²

Hanqi Wen ^{15, 113}

Sheng Xu ¹¹⁴

Tailin Xu ¹¹⁵

Hongping Yan ⁹

Xuzhou Yan ⁷²

Hui Yang ¹¹⁶

Le Yang ^{1, 117}

Shuaijian Yang ¹¹⁸

Lan Yin ¹¹⁹

Cunjiang Yu ¹²⁰

Guihua Yu ¹²¹

Jing Yu ⁵⁷

Shu-Hong Yu ¹²²

Xinge Yu ¹²³

Evgeny Zamburg ^{36, 102}

Haixia Zhang ¹²⁴

Xiangyu Zhang ^{36, 102}

Xiaosheng Zhang ¹²⁵

Xiao-Sheng Zhang ¹²⁵

Xue-Ji Zhang ¹²⁶

Yihui Zhang ¹²⁷

Yu Zhang ^{36, 102}

Siyuan Zhao ⁷¹

Xuanhe Zhao ¹²⁸

Yuanjin Zheng ¹²⁹

Yu Qing Zheng ¹³⁰

Zijian Zheng ¹³¹

Tao Zhou ¹³²

Bowen Zhu ¹³³

Ming Zhu ¹³⁴

Rong Zhu ¹³⁵

Yangzhi Zhu ¹³⁶

Yong Zhu ¹³⁷

Yong-Ran Zhu ¹³⁷

Guijin Zou ³⁰

Xiaoyuan Chen ^{1, 138}

Hide authors affiliations Show authors affiliations: 138 affiliations

Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore

Agency for Science, Technology and Research

Institute of Materials Research and Engineering

Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore |

Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States |

⁴

School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea |

⁵

Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States |

⁶

Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States |

⁷

Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States |

⁸

Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany |

⁹

Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States |

¹⁰

Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden |

¹¹

Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden |

¹²

Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States |

¹³

Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States |

¹⁴

Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States |

¹⁵

School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore |

¹⁶

Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800 |

¹⁷

Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800 |

¹⁸

Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China |

¹⁹

Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea |

²⁰

School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States |

²¹

Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States |

²²

Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China

Institute of Chemistry, Chinese Academy of Sciences

Beijing National Laboratory for Molecular Sciences

²³

Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States |

²⁴

Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States |

²⁵

Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States |

²⁶

Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China |

²⁷

State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China |

²⁸

Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China |

²⁹

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore |

³⁰

Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore

Agency for Science, Technology and Research

Institute of High Performance Computing

³¹

Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States |

³²

Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States |

³³

Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China |

³⁴

National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China |

³⁵

Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore |

³⁶

Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore |

³⁷

The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore |

³⁸

School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China |

³⁹

School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China |

⁴⁰

Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States |

⁴¹

Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China |

⁴²

mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States |

⁴³

Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States |

⁴⁴

Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States |

⁴⁵

Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea |

⁴⁶

Department of Electronic Engineering, Tsinghua University, Beijing 100084, China |

⁴⁷

Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China |

⁴⁸

Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea |

⁴⁹

Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany |

⁵⁰

Terasaki Institute for Biomedical Innovation, Los Angeles, CA, USA |

⁵¹

Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea

Seoul National University

Institute for Basic Science

⁵²

Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea |

⁵³

Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore |

⁵⁴

National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China |

⁵⁵

NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore |

⁵⁶

School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea |

⁵⁷

School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore |

⁵⁸

Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore |

⁵⁹

Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea |

⁶⁰

School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea |

⁶¹

Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea |

⁶²

Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea |

⁶³

College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China |

⁶⁴

Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States |

⁶⁵

School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China |

⁶⁶

Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore |

⁶⁷

Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore |

⁶⁸

Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore |

⁶⁹

School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China |

⁷⁰

Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States |

⁷¹

John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States |

⁷²

School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China |

⁷³

Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China |

⁷⁴

Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore |

⁷⁵

Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States |

⁷⁶

Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055 |

⁷⁷

Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States |

⁷⁸

Institute of Chemistry and The Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel |

⁷⁹

Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom |

⁸⁰

Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan; |

⁸¹

Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom |

⁸²

Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States |

⁸³

School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea

Samsung

Sungkyunkwan University

⁸⁴

Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States |

⁸⁵

Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States |

⁸⁶

Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States |

⁸⁷

Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States |

⁸⁸

Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States |

⁸⁹

Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States |

⁹⁰

Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany |

⁹¹

Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany |

⁹²

The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047 |

⁹³

School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China |

⁹⁴

Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China |

⁹⁵

Department of Electrical Engineering and Information Systems, Graduate School of Engineering, the University of Tokyo, Tokyo 113-8656, Japan |

⁹⁶

Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China |

⁹⁷

Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden |

⁹⁸

Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan |

⁹⁹

Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China |

¹⁰⁰

Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore |

¹⁰¹

iHealthtech, National University of Singapore, Singapore 119276, Singapore |

¹⁰²

Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore |

¹⁰³

School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China |

¹⁰⁴

Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States |

¹⁰⁵

Department of Nanoengineering, University of California, San Diego, California 92093, United States |

¹⁰⁶

Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China |

¹⁰⁷

the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China |

¹⁰⁸

Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States |

¹⁰⁹

State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China |

¹¹⁰

Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China |

¹¹¹

Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States |

¹¹²

California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States |

¹¹³

Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000 |

¹¹⁴

Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States |

¹¹⁵

School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China |

¹¹⁶

Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072 |

¹¹⁷

Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore |

¹¹⁸

School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom |

¹¹⁹

School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China |

¹²⁰

Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States |

¹²¹

Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States |

¹²²

Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China |

¹²³

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China |

¹²⁴

National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China |

¹²⁵

School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China |

¹²⁶

School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China |

¹²⁷

Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China |

¹²⁸

Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States |

¹²⁹

Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore |

¹³⁰

National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China |

¹³¹

Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China |

¹³²

Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States |

¹³³

Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China |

¹³⁴

Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore |

¹³⁵

Department of precision instrument, Tsinghua University, Beijing 100084, China |

¹³⁶

Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States |

¹³⁷

Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States |

¹³⁸

Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore |

Publication type: Journal Article

Publication date: 2023-03-09

American Chemical Society (ACS)

ACS Nano

scimago Q1

wos Q1

SJR: 4.497

CiteScore: 24.2

Impact factor: 16.0

ISSN: 19360851, 1936086X

DOI: 10.1021/acsnano.2c12606

Copy DOI

PubMed ID: 36892156

General Physics and Astronomy

General Materials Science

General Engineering

Abstract

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.

Found

1 citation

Tumkin Ilya

🥼 🤝

PhD in Chemistry

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Saint Petersburg State University

1 citation

Sengupta Joydip

🥼 🤝

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University of Calcutta

Research interests

Graphene

Zinc Oxide

1 citation

Gehring Pascal

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Université Catholique de Louvain

University of Oxford

Interuniversity Microelectronics Centre

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Gerega Vasilisa

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Herzen State Pedagogical University of Russia

Kirensky Institute of Physics of the Siberian Branch of the Russian Academy of Sciences

1 citation

Hossain M.

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282 publications, 12 086 citations, 628 reviews

h-index: 59

Bangladesh Atomic Energy Commission

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Qiaoling Huang

40 publications, 1 236 citations, 20 reviews

h-index: 19

Xiamen University

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IEEE Sensors Journal	IEEE Sensors Journal, 7, 0.72% IEEE Sensors Journal 7 publications, 0.72%
	5 10 15 20 25 30 35 40 45 50

Publishers

	50 100 150 200 250
Elsevier	Elsevier, 222, 22.89% Elsevier 222 publications, 22.89%
Wiley	Wiley, 220, 22.68% Wiley 220 publications, 22.68%
American Chemical Society (ACS)	American Chemical Society (ACS), 168, 17.32% American Chemical Society (ACS) 168 publications, 17.32%
Springer Nature	Springer Nature, 107, 11.03% Springer Nature 107 publications, 11.03%
MDPI	MDPI, 71, 7.32% MDPI 71 publications, 7.32%
Institute of Electrical and Electronics Engineers (IEEE)	Institute of Electrical and Electronics Engineers (IEEE), 49, 5.05% Institute of Electrical and Electronics Engineers (IEEE) 49 publications, 5.05%
Royal Society of Chemistry (RSC)	Royal Society of Chemistry (RSC), 46, 4.74% Royal Society of Chemistry (RSC) 46 publications, 4.74%
American Association for the Advancement of Science (AAAS)	American Association for the Advancement of Science (AAAS), 22, 2.27% American Association for the Advancement of Science (AAAS) 22 publications, 2.27%
IOP Publishing	IOP Publishing, 16, 1.65% IOP Publishing 16 publications, 1.65%
OAE Publishing Inc.	OAE Publishing Inc., 8, 0.82% OAE Publishing Inc. 8 publications, 0.82%
Taylor & Francis	Taylor & Francis, 6, 0.62% Taylor & Francis 6 publications, 0.62%
AIP Publishing	AIP Publishing, 4, 0.41% AIP Publishing 4 publications, 0.41%
Science in China Press	Science in China Press, 4, 0.41% Science in China Press 4 publications, 0.41%
Cold Spring Harbor Laboratory	Cold Spring Harbor Laboratory, 3, 0.31% Cold Spring Harbor Laboratory 3 publications, 0.31%
Oxford University Press	Oxford University Press, 3, 0.31% Oxford University Press 3 publications, 0.31%
Tsinghua University Press	Tsinghua University Press, 3, 0.31% Tsinghua University Press 3 publications, 0.31%
Proceedings of the National Academy of Sciences (PNAS)	Proceedings of the National Academy of Sciences (PNAS), 2, 0.21% Proceedings of the National Academy of Sciences (PNAS) 2 publications, 0.21%
Optical Society of India	Optical Society of India, 1, 0.1% Optical Society of India 1 publication, 0.1%
Cambridge University Press	Cambridge University Press, 1, 0.1% Cambridge University Press 1 publication, 0.1%
American Physical Society (APS)	American Physical Society (APS), 1, 0.1% American Physical Society (APS) 1 publication, 0.1%
Frontiers Media S.A.	Frontiers Media S.A., 1, 0.1% Frontiers Media S.A. 1 publication, 0.1%
Mary Ann Liebert	Mary Ann Liebert, 1, 0.1% Mary Ann Liebert 1 publication, 0.1%
IGI Global	IGI Global, 1, 0.1% IGI Global 1 publication, 0.1%
Emerald	Emerald, 1, 0.1% Emerald 1 publication, 0.1%
Public Library of Science (PLoS)	Public Library of Science (PLoS), 1, 0.1% Public Library of Science (PLoS) 1 publication, 0.1%
Association for Computing Machinery (ACM)	Association for Computing Machinery (ACM), 1, 0.1% Association for Computing Machinery (ACM) 1 publication, 0.1%
Asian Journal of Chemistry	Asian Journal of Chemistry, 1, 0.1% Asian Journal of Chemistry 1 publication, 0.1%
Bentham Science Publishers Ltd.	Bentham Science Publishers Ltd., 1, 0.1% Bentham Science Publishers Ltd. 1 publication, 0.1%
The University of Jordan	The University of Jordan, 1, 0.1% The University of Jordan 1 publication, 0.1%
Publishing House Helvetica (Publications)	Publishing House Helvetica (Publications), 1, 0.1% Publishing House Helvetica (Publications) 1 publication, 0.1%
	50 100 150 200 250

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971

Cite this

GOST |

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GOST Copy

Luo Y. et al. Technology Roadmap for Flexible Sensors // ACS Nano. 2023. Vol. 17. No. 6. pp. 5211-5295.

GOST all authors (up to 50) Copy

Luo Y. et al. Technology Roadmap for Flexible Sensors // ACS Nano. 2023. Vol. 17. No. 6. pp. 5211-5295.

RIS |

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RIS

BibTex |

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BibTex (up to 50 authors) Copy

@article{2023_Luo,

author = {Yifei Luo and Mohammad Reza Abidian and Mohammad R. Abidian and Jong-Hyun Ahn and Deji Akinwande and Anne Lintzenich Andrews and Markus Antonietti and Zhenan Bao and Magnus Berggren and Christopher A Berkey and C Berkey and Christopher J. Bettinger and Jun Chen and Peng Chen and Wenlong Cheng and Xu Cheng and Seon Jin Choi and Alex Chortos and Canan Dagdeviren and Reinhold H Dauskardt and Chong-an Di and Michael D Dickey and Xiangfeng Duan and Antonio Facchetti and Zhiyong Fan and Yin Fang and Jianyou Feng and Feng Xue and Huajian Gao and Wei Gao and Xiwen Gong and Chuan Fei Guo and Xiaojun Guo and Martin C Hartel and Zihan He and John S. Ho and Youfan Hu and Qiyao Huang and Yu Huang and Fengwei Huo and Muhammad M. Hussain and Muhammad Iqbal Hussain and Ali Javey and Unyong Jeong and Chen Jiang and Xingyu Jiang and Jiheong Kang and Daniil Karnaushenko and Dmitriy D. Karnaushenko and Ali Khademhosseini and others},

title = {Technology Roadmap for Flexible Sensors},

journal = {ACS Nano},

year = {2023},

volume = {17},

publisher = {American Chemical Society (ACS)},

month = {mar},

url = {https://pubs.acs.org/doi/10.1021/acsnano.2c12606},

number = {6},

pages = {5211--5295},

doi = {10.1021/acsnano.2c12606}

}

MLA

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MLA Copy

Luo, Yifei, et al. “Technology Roadmap for Flexible Sensors.” ACS Nano, vol. 17, no. 6, Mar. 2023, pp. 5211-5295. https://pubs.acs.org/doi/10.1021/acsnano.2c12606.

Publisher

American Chemical Society (ACS)

Journal

ACS Nano

scimago Q1

wos Q1

SJR

4.497

CiteScore

24.2

Impact factor

16.0

ISSN

19360851 (Print)

1936086X (Electronic)

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