Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0.
Publication type: Journal Article
Publication date: 2015-11-17
scimago Q1
wos Q1
SJR: 1.394
CiteScore: 8.7
Impact factor: 4.6
ISSN: 19487185
PubMed ID:
26562750
Physical and Theoretical Chemistry
General Materials Science
Abstract
The great interest in the photochemical reduction from CO2 to fuels and chemicals has focused attention on Cu because of its unique ability to catalyze formation of carbon-containing fuels and chemicals. A particular goal is to learn how to modify the Cu catalysts to enhance the production selectivity while reducing the energy requirements (overpotential). To enable such developments, we report here the free-energy reaction barriers and mechanistic pathways on the Cu(100) surface, which produces only CH4 (not C2H4 or CH3OH) in acid (pH 0). We predict a threshold potential for CH4 formation of -0.52 V, which compares well to experiments at low pH, -0.45 to -0.50 V. These quantum molecular dynamics simulations included ∼5 layers of explicit water at the water/electrode interface using enhanced sampling methodology to obtain the free energies. We find that that chemisorbed hydroxyl-methylene (CH-OH) is the key intermediate determining the selectivity for methane over methanol.
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Cheng T., Xiao H., Goddard W. A. I. Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0. // Journal of Physical Chemistry Letters. 2015. Vol. 6. No. 23. pp. 4767-4773.
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Cheng T., Xiao H., Goddard W. A. I. Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0. // Journal of Physical Chemistry Letters. 2015. Vol. 6. No. 23. pp. 4767-4773.
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TY - JOUR
DO - 10.1021/acs.jpclett.5b02247
UR - https://doi.org/10.1021/acs.jpclett.5b02247
TI - Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0.
T2 - Journal of Physical Chemistry Letters
AU - Cheng, Tao
AU - Xiao, Hai
AU - Goddard, William A. III
PY - 2015
DA - 2015/11/17
PB - American Chemical Society (ACS)
SP - 4767-4773
IS - 23
VL - 6
PMID - 26562750
SN - 1948-7185
ER -
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@article{2015_Cheng,
author = {Tao Cheng and Hai Xiao and William A. III Goddard},
title = {Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0.},
journal = {Journal of Physical Chemistry Letters},
year = {2015},
volume = {6},
publisher = {American Chemical Society (ACS)},
month = {nov},
url = {https://doi.org/10.1021/acs.jpclett.5b02247},
number = {23},
pages = {4767--4773},
doi = {10.1021/acs.jpclett.5b02247}
}
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Cheng, Tao, et al. “Free-Energy Barriers and Reaction Mechanisms for the Electrochemical Reduction of CO on the Cu(100) Surface, Including Multiple Layers of Explicit Solvent at pH 0..” Journal of Physical Chemistry Letters, vol. 6, no. 23, Nov. 2015, pp. 4767-4773. https://doi.org/10.1021/acs.jpclett.5b02247.