The Power of Packing: Metallization of an Organic Semiconductor
Aaron Mailman
1
,
Alicea A. Leitch
1
,
Wenjun Yong
2
,
Eden Steven
3
,
STEPHEN M. WINTER
1
,
Robert C M Claridge
1
,
Abdeljalil Assoud
1
,
JOHN S. TSE
4
,
Serge Desgreniers
5
,
Richard A. Secco
2
,
Richard Oakley
1
Publication type: Journal Article
Publication date: 2017-01-31
scimago Q1
wos Q1
SJR: 5.554
CiteScore: 22.5
Impact factor: 15.6
ISSN: 00027863, 15205126
PubMed ID:
28140576
General Chemistry
Catalysis
Biochemistry
Colloid and Surface Chemistry
Abstract
Benzoquino-bis-1,2,3-dithiazole 5 is a closed shell, antiaromatic 16π-electron zwitterion with a small HOMO-LUMO gap. Its crystal structure consists of planar ribbon-like molecular arrays packed into offset layers to generate a "brick-wall" motif with strong 2D interlayer electronic interactions. The spread of the valence and conduction bands, coupled with the narrow HOMO-LUMO gap, affords a small band gap semiconductor with σRT = 1 × 10-3 S cm-1 and Eact = 0.14 eV for transport within the brick-wall arrays. Closure of the band gap to form an all-organic molecular metal with σRT > 101 S cm-1 can be achieved by the application of pressure to 8 GPa.
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57
Total citations:
57
Citations from 2024:
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(15%)
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GOST
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Mailman A. et al. The Power of Packing: Metallization of an Organic Semiconductor // Journal of the American Chemical Society. 2017. Vol. 139. No. 6. pp. 2180-2183.
GOST all authors (up to 50)
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Mailman A., Leitch A. A., Yong W., Steven E., WINTER S. M., Claridge R. C. M., Assoud A., TSE J. S., Desgreniers S., Secco R. A., Oakley R. The Power of Packing: Metallization of an Organic Semiconductor // Journal of the American Chemical Society. 2017. Vol. 139. No. 6. pp. 2180-2183.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1021/jacs.6b12814
UR - https://doi.org/10.1021/jacs.6b12814
TI - The Power of Packing: Metallization of an Organic Semiconductor
T2 - Journal of the American Chemical Society
AU - Mailman, Aaron
AU - Leitch, Alicea A.
AU - Yong, Wenjun
AU - Steven, Eden
AU - WINTER, STEPHEN M.
AU - Claridge, Robert C M
AU - Assoud, Abdeljalil
AU - TSE, JOHN S.
AU - Desgreniers, Serge
AU - Secco, Richard A.
AU - Oakley, Richard
PY - 2017
DA - 2017/01/31
PB - American Chemical Society (ACS)
SP - 2180-2183
IS - 6
VL - 139
PMID - 28140576
SN - 0002-7863
SN - 1520-5126
ER -
Cite this
BibTex (up to 50 authors)
Copy
@article{2017_Mailman,
author = {Aaron Mailman and Alicea A. Leitch and Wenjun Yong and Eden Steven and STEPHEN M. WINTER and Robert C M Claridge and Abdeljalil Assoud and JOHN S. TSE and Serge Desgreniers and Richard A. Secco and Richard Oakley},
title = {The Power of Packing: Metallization of an Organic Semiconductor},
journal = {Journal of the American Chemical Society},
year = {2017},
volume = {139},
publisher = {American Chemical Society (ACS)},
month = {jan},
url = {https://doi.org/10.1021/jacs.6b12814},
number = {6},
pages = {2180--2183},
doi = {10.1021/jacs.6b12814}
}
Cite this
MLA
Copy
Mailman, Aaron, et al. “The Power of Packing: Metallization of an Organic Semiconductor.” Journal of the American Chemical Society, vol. 139, no. 6, Jan. 2017, pp. 2180-2183. https://doi.org/10.1021/jacs.6b12814.