volume 141 issue 7 pages 3153-3159

Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes

Matthew Paeth 1
Sam B Tyndall 1
Liang-Yu Chen 2
Jia Cheng Hong 2
William P Carson 1
Xi Liu 3, 4
Xiaodong Sun 3, 4
Jinjia Liu 3, 4
Kundi Yang 1
Elizabeth M Hale 1
David M. Tierney 1
Bin Liu 5
Zhi Cao 3, 4
Mu-Jeng Cheng 2
Wei Liu 1
Publication typeJournal Article
Publication date2019-01-25
scimago Q1
wos Q1
SJR5.554
CiteScore22.5
Impact factor15.6
ISSN00027863, 15205126
PubMed ID:  30678456
General Chemistry
Catalysis
Biochemistry
Colloid and Surface Chemistry
Abstract
Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp3-Csp3 bonds. We report herein a general method for the synthesis of a series of [alkyl-CuIII-(CF3)3]- complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp3-CF3 bonds proceeds through a concerted transition state, with a Δ H⧧ = 20 kcal/mol barrier.
Found 
Found 

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Paeth M. et al. Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes // Journal of the American Chemical Society. 2019. Vol. 141. No. 7. pp. 3153-3159.
GOST all authors (up to 50) Copy
Paeth M., Tyndall S. B., Chen L., Hong J. C., Carson W. P., Liu X., Sun X., Liu J., Yang K., Hale E. M., Tierney D. M., Liu B., Cao Z., Cheng M., Goddard W. A. I., Liu W. Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes // Journal of the American Chemical Society. 2019. Vol. 141. No. 7. pp. 3153-3159.
RIS |
Cite this
RIS Copy
TY - JOUR
DO - 10.1021/jacs.8b12632
UR - https://doi.org/10.1021/jacs.8b12632
TI - Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes
T2 - Journal of the American Chemical Society
AU - Paeth, Matthew
AU - Tyndall, Sam B
AU - Chen, Liang-Yu
AU - Hong, Jia Cheng
AU - Carson, William P
AU - Liu, Xi
AU - Sun, Xiaodong
AU - Liu, Jinjia
AU - Yang, Kundi
AU - Hale, Elizabeth M
AU - Tierney, David M.
AU - Liu, Bin
AU - Cao, Zhi
AU - Cheng, Mu-Jeng
AU - Goddard, William A. III
AU - Liu, Wei
PY - 2019
DA - 2019/01/25
PB - American Chemical Society (ACS)
SP - 3153-3159
IS - 7
VL - 141
PMID - 30678456
SN - 0002-7863
SN - 1520-5126
ER -
BibTex |
Cite this
BibTex (up to 50 authors) Copy
@article{2019_Paeth,
author = {Matthew Paeth and Sam B Tyndall and Liang-Yu Chen and Jia Cheng Hong and William P Carson and Xi Liu and Xiaodong Sun and Jinjia Liu and Kundi Yang and Elizabeth M Hale and David M. Tierney and Bin Liu and Zhi Cao and Mu-Jeng Cheng and William A. III Goddard and Wei Liu},
title = {Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes},
journal = {Journal of the American Chemical Society},
year = {2019},
volume = {141},
publisher = {American Chemical Society (ACS)},
month = {jan},
url = {https://doi.org/10.1021/jacs.8b12632},
number = {7},
pages = {3153--3159},
doi = {10.1021/jacs.8b12632}
}
MLA
Cite this
MLA Copy
Paeth, Matthew, et al. “Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes.” Journal of the American Chemical Society, vol. 141, no. 7, Jan. 2019, pp. 3153-3159. https://doi.org/10.1021/jacs.8b12632.