Journal Physics D: Applied Physics, volume 53, issue 35, pages 355102
Three-dimensional polymer wire bonds on a chip: morphology and functionality
Zvagelsky R.D.
1
,
Chubich D.A.
1
,
Kolymagin D.A.
1
,
Korostylev E V
1
,
Kovalyuk V.V.
2
,
Prokhodtsov A I
2, 3
,
Tarasov A.V.
2
,
Gol'tsman G. N.
2, 3
,
VITUKHNOVSKY A. G.
1, 4
Publication type: Journal Article
Publication date: 2020-06-15
Journal:
Journal Physics D: Applied Physics
Quartile SCImago
Q1
Quartile WOS
Q2
Impact factor: 3.4
ISSN: 00223727, 13616463
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Acoustics and Ultrasonics
Abstract
Modern microchip-scale transceivers are capable of transmitting data at rates of the order of several terabits per second. In this regard, there is an urgent need to improve the interfaces connecting the chips and extend the bandpass of the interconnections. We use an approach combining silicon nitride nanophotonic circuits with 3D polymer waveguides fabricated by direct laser writing, which can be used as photonic interconnections or photonic wire bonds (PWB). These structures are designed, simulated, fabricated, and optimized for better light transmission at the telecommunication wavelength. An important part of this work is the study of the telecom signal transmission in a 3D polymer waveguide connecting two silicon nitride facing tapers. Two cases are considered: the tapers are one opposite the other or misaligned. Initially, the PWB shape was chosen to be Gaussian and then optimized: the top was circle-shaped and with the lower part still being Gaussian. Transmission losses were measured for both types of waveguides with different shapes. The idea of an optical multi-level crossing for photonic integrated circuits is also suggested as a solution to the problem of interconnections within a single chip.
Citations by journals
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1
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Optical Materials Express
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Optical Materials Express
1 publication, 14.29%
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Journal of Science: Advanced Materials and Devices
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Journal of Science: Advanced Materials and Devices
1 publication, 14.29%
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2022 Photonics & Electromagnetics Research Symposium (PIERS)
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2022 Photonics & Electromagnetics Research Symposium (PIERS)
1 publication, 14.29%
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European Polymer Journal
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European Polymer Journal
1 publication, 14.29%
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Advanced Materials Technologies
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Advanced Materials Technologies
1 publication, 14.29%
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Additive Manufacturing
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Additive Manufacturing
1 publication, 14.29%
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1
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Citations by publishers
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1
2
3
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Elsevier
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Elsevier
3 publications, 42.86%
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Optical Society of America
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Optical Society of America
1 publication, 14.29%
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IEEE
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IEEE
1 publication, 14.29%
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Wiley
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Wiley
1 publication, 14.29%
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1
2
3
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- We do not take into account publications that without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
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Zvagelsky R. et al. Three-dimensional polymer wire bonds on a chip: morphology and functionality // Journal Physics D: Applied Physics. 2020. Vol. 53. No. 35. p. 355102.
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Zvagelsky R., Chubich D., Kolymagin D., Korostylev E. V., Kovalyuk V., Prokhodtsov A. I., Tarasov A., Gol'tsman G. N., VITUKHNOVSKY A. G. Three-dimensional polymer wire bonds on a chip: morphology and functionality // Journal Physics D: Applied Physics. 2020. Vol. 53. No. 35. p. 355102.
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TY - JOUR
DO - 10.1088/1361-6463/ab8e7f
UR - https://doi.org/10.1088%2F1361-6463%2Fab8e7f
TI - Three-dimensional polymer wire bonds on a chip: morphology and functionality
T2 - Journal Physics D: Applied Physics
AU - Zvagelsky, R.D.
AU - Chubich, D.A.
AU - Kolymagin, D.A.
AU - Korostylev, E V
AU - Kovalyuk, V.V.
AU - Prokhodtsov, A I
AU - Tarasov, A.V.
AU - Gol'tsman, G. N.
AU - VITUKHNOVSKY, A. G.
PY - 2020
DA - 2020/06/15 00:00:00
PB - IOP Publishing
SP - 355102
IS - 35
VL - 53
SN - 0022-3727
SN - 1361-6463
ER -
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@article{2020_Zvagelsky,
author = {R.D. Zvagelsky and D.A. Chubich and D.A. Kolymagin and E V Korostylev and V.V. Kovalyuk and A I Prokhodtsov and A.V. Tarasov and G. N. Gol'tsman and A. G. VITUKHNOVSKY},
title = {Three-dimensional polymer wire bonds on a chip: morphology and functionality},
journal = {Journal Physics D: Applied Physics},
year = {2020},
volume = {53},
publisher = {IOP Publishing},
month = {jun},
url = {https://doi.org/10.1088%2F1361-6463%2Fab8e7f},
number = {35},
pages = {355102},
doi = {10.1088/1361-6463/ab8e7f}
}
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Zvagelsky, R.D., et al. “Three-dimensional polymer wire bonds on a chip: morphology and functionality.” Journal Physics D: Applied Physics, vol. 53, no. 35, Jun. 2020, p. 355102. https://doi.org/10.1088%2F1361-6463%2Fab8e7f.