Journal of Micromechanics and Microengineering, volume 20, issue 6, pages 64018
Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
Bianca Boettge
1
,
Joerg Braeuer
2
,
Maik Wiemer
2
,
Matthias Petzold
1
,
Joerg Bagdahn
3
,
Thomas Gessner
2
1
2
Fraunhofer Research Institution for Electronic Nano Systems, Technologie-Campus 3, 09126 Chemnitz, Germany
|
3
FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS, Walter-Hülse-Straße 1, 06120 Halle (Saale), Germany
|
Publication type: Journal Article
Publication date: 2010-06-01
Quartile SCImago
Q2
Quartile WOS
Q3
Impact factor: 2.3
ISSN: 09601317, 13616439
Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering
Mechanical Engineering
Mechanics of Materials
Abstract
Reactive bonding is a still new low-temperature joining process that is based on reactive nanoscale multilayer systems. The heat required for the bonding process is generated by a self-propagating exothermic reaction within the multilayer system while the adhesive interconnect is supported by solder films. For microsystem applications, the approach is particularly useful if temperature-sensitive components and materials with high differences in coefficient of thermal expansion have to be joined. In this paper, this is successfully demonstrated for bonding a quartz strain gauge onto a stainless steel membrane and an IR-emitter onto a covar socket by using commercially available nickel/aluminum NanoFoils©. The quality of the bond interface of both demonstrators was investigated by scanning electron microscopy and the strength was determined by a tensile test. On the other hand, integrated microsystem applications beyond die attachment require patterned bond structures, e.g. to form bond frames. Thus, alternative materials were additionally considered that can be directly deposited on silicon substrates by magnetron sputtering, such as aluminum/titanium as well as titanium/amorphous silicon (Ti/a-Si) bilayer systems. The properties of these basic multilayer systems and their reaction products were characterized by differential scanning calorimetry and high-resolution electron microscopy. It is shown that specifically the Ti/a-Si system has substantial potential for direct microsystem technology integration provided the remaining open technological issues can be addressed during future research. In general, the results obtained in this study demonstrate the high potential of the reactive bonding process as a new advantageous assembly technology for the fabrication of future microsystems.
Top-30
Journals
1
2
3
4
5
|
|
Advanced Engineering Materials
5 publications, 7.94%
|
|
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
4 publications, 6.35%
|
|
IOP Conference Series: Materials Science and Engineering
3 publications, 4.76%
|
|
Propellants, Explosives, Pyrotechnics
2 publications, 3.17%
|
|
Journal of Applied Physics
2 publications, 3.17%
|
|
Journal of Electronic Materials
2 publications, 3.17%
|
|
Materials and Design
2 publications, 3.17%
|
|
Thin Solid Films
2 publications, 3.17%
|
|
Journal of Alloys and Compounds
2 publications, 3.17%
|
|
Journal of Electronic Packaging, Transactions of the ASME
1 publication, 1.59%
|
|
E3S Web of Conferences
1 publication, 1.59%
|
|
Applied Sciences (Switzerland)
1 publication, 1.59%
|
|
Micromachines
1 publication, 1.59%
|
|
MRS Proceedings
1 publication, 1.59%
|
|
Journal of Materials Science
1 publication, 1.59%
|
|
Journal of Materials Engineering and Performance
1 publication, 1.59%
|
|
Journal of Manufacturing Processes
1 publication, 1.59%
|
|
Materialia
1 publication, 1.59%
|
|
Laser Physics
1 publication, 1.59%
|
|
Journal of Micromechanics and Microengineering
1 publication, 1.59%
|
|
Advanced Powder Technology
1 publication, 1.59%
|
|
Combustion and Flame
1 publication, 1.59%
|
|
Intermetallics
1 publication, 1.59%
|
|
Acta Materialia
1 publication, 1.59%
|
|
Microelectronic Engineering
1 publication, 1.59%
|
|
Physica Status Solidi (A) Applications and Materials Science
1 publication, 1.59%
|
|
ACS applied materials & interfaces
1 publication, 1.59%
|
|
Advances in Science and Technology
1 publication, 1.59%
|
|
Journal of Microelectromechanical Systems
1 publication, 1.59%
|
|
1
2
3
4
5
|
Publishers
2
4
6
8
10
12
14
|
|
Elsevier
14 publications, 22.22%
|
|
Wiley
10 publications, 15.87%
|
|
Institute of Electrical and Electronics Engineers (IEEE)
8 publications, 12.7%
|
|
Springer Nature
5 publications, 7.94%
|
|
IOP Publishing
5 publications, 7.94%
|
|
Japan Society of Applied Physics
4 publications, 6.35%
|
|
AIP Publishing
2 publications, 3.17%
|
|
MDPI
2 publications, 3.17%
|
|
American Chemical Society (ACS)
2 publications, 3.17%
|
|
ASME International
1 publication, 1.59%
|
|
EDP Sciences
1 publication, 1.59%
|
|
1 publication, 1.59%
|
|
Trans Tech Publications
1 publication, 1.59%
|
|
Oxford University Press
1 publication, 1.59%
|
|
Annual Reviews
1 publication, 1.59%
|
|
Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii
1 publication, 1.59%
|
|
2
4
6
8
10
12
14
|
- We do not take into account publications without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
Are you a researcher?
Create a profile to get free access to personal recommendations for colleagues and new articles.
Metrics
Cite this
GOST |
RIS |
BibTex |
MLA
Cite this
GOST
Copy
Boettge B. et al. Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology // Journal of Micromechanics and Microengineering. 2010. Vol. 20. No. 6. p. 64018.
GOST all authors (up to 50)
Copy
Boettge B., Braeuer J., Wiemer M., Petzold M., Bagdahn J., Gessner T. Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology // Journal of Micromechanics and Microengineering. 2010. Vol. 20. No. 6. p. 64018.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1088/0960-1317/20/6/064018
UR - https://doi.org/10.1088/0960-1317/20/6/064018
TI - Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology
T2 - Journal of Micromechanics and Microengineering
AU - Boettge, Bianca
AU - Braeuer, Joerg
AU - Wiemer, Maik
AU - Petzold, Matthias
AU - Bagdahn, Joerg
AU - Gessner, Thomas
PY - 2010
DA - 2010/06/01
PB - IOP Publishing
SP - 64018
IS - 6
VL - 20
SN - 0960-1317
SN - 1361-6439
ER -
Cite this
BibTex
Copy
@article{2010_Boettge,
author = {Bianca Boettge and Joerg Braeuer and Maik Wiemer and Matthias Petzold and Joerg Bagdahn and Thomas Gessner},
title = {Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology},
journal = {Journal of Micromechanics and Microengineering},
year = {2010},
volume = {20},
publisher = {IOP Publishing},
month = {jun},
url = {https://doi.org/10.1088/0960-1317/20/6/064018},
number = {6},
pages = {64018},
doi = {10.1088/0960-1317/20/6/064018}
}
Cite this
MLA
Copy
Boettge, Bianca, et al. “Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology.” Journal of Micromechanics and Microengineering, vol. 20, no. 6, Jun. 2010, p. 64018. https://doi.org/10.1088/0960-1317/20/6/064018.