3D Packaging for Heterogeneous Integration
Rahul Agarwal
1
,
Patrick Cheng
2
,
Priyal Shah
3
,
Brett Wilkerson
4
,
Swaminathan Raja
4
,
John Wuu
5
,
Chandrasekhar Mandalapu
4
1
AMD: Advance Packaging,Santa Clara,USA
|
2
AMD: Advance Packaging,Hsinchu,Taiwan
|
3
AMD: Advance Packaging,Bangalore,India
|
4
AMD: Advance Packaging,Austin,TX
|
5
AMD: Silicon Design Engineering,Fort Collings,CO
Publication type: Proceedings Article
Publication date: 2022-05-01
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