3D Packaging for Heterogeneous Integration

Rahul Agarwal 1
Patrick Cheng 2
Priyal Shah 3
Brett Wilkerson 4
Swaminathan Raja 4
John Wuu 5
Chandrasekhar Mandalapu 4
1
 
AMD: Advance Packaging,Santa Clara,USA
2
 
AMD: Advance Packaging,Hsinchu,Taiwan
3
 
AMD: Advance Packaging,Bangalore,India
4
 
AMD: Advance Packaging,Austin,TX
5
 
AMD: Silicon Design Engineering,Fort Collings,CO
Publication typeProceedings Article
Publication date2022-05-01
Found 
Found 

Top-30

Journals

1
2
3
4
5
6
1
2
3
4
5
6

Publishers

5
10
15
20
25
30
35
40
5
10
15
20
25
30
35
40
  • We do not take into account publications without a DOI.
  • Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
  • Statistics recalculated weekly.

Are you a researcher?

Create a profile to get free access to personal recommendations for colleagues and new articles.
Metrics
Share
Found error?