IEEE Design and Test, volume 33, issue 3, pages 8-20

The 3-D Interconnect Technology Landscape

Eric Beyne ¹

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IMEC, Leuven, Belgium |

Publication type: Journal Article

Publication date: 2016-06-01

Institute of Electrical and Electronics Engineers (IEEE)

Journal: IEEE Design and Test

scimago Q2

SJR: 0.489

CiteScore: 3.8

Impact factor: 1.9

ISSN: 21682356, 21682364

DOI: 10.1109/mdat.2016.2544837

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Electrical and Electronic Engineering

Hardware and Architecture

Software

Abstract

This overview article sheds light into the diverse notions and terms associated with 3-D circuits. It categorizes and classifies the various technologies/techniques and helps the experienced researcher as well as a newcomer to find an orientation in the complex 3-D landscape.

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GOST |

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GOST Copy

Beyne E. The 3-D Interconnect Technology Landscape // IEEE Design and Test. 2016. Vol. 33. No. 3. pp. 8-20.

GOST all authors (up to 50) Copy

Beyne E. The 3-D Interconnect Technology Landscape // IEEE Design and Test. 2016. Vol. 33. No. 3. pp. 8-20.

RIS |

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RIS Copy

TY - JOUR

DO - 10.1109/mdat.2016.2544837

UR - https://doi.org/10.1109/mdat.2016.2544837

TI - The 3-D Interconnect Technology Landscape

T2 - IEEE Design and Test

AU - Beyne, Eric

PY - 2016

DA - 2016/06/01

PB - Institute of Electrical and Electronics Engineers (IEEE)

SP - 8-20

IS - 3

VL - 33

SN - 2168-2356

SN - 2168-2364

ER -

BibTex |

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BibTex (up to 50 authors) Copy

@article{2016_Beyne,

author = {Eric Beyne},

title = {The 3-D Interconnect Technology Landscape},

journal = {IEEE Design and Test},

year = {2016},

volume = {33},

publisher = {Institute of Electrical and Electronics Engineers (IEEE)},

month = {jun},

url = {https://doi.org/10.1109/mdat.2016.2544837},

number = {3},

pages = {8--20},

doi = {10.1109/mdat.2016.2544837}

}

MLA

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MLA Copy

Beyne, Eric. “The 3-D Interconnect Technology Landscape.” IEEE Design and Test, vol. 33, no. 3, Jun. 2016, pp. 8-20. https://doi.org/10.1109/mdat.2016.2544837.

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Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Journal

IEEE Design and Test

scimago Q2

SJR

0.489

CiteScore

3.8

Impact factor

1.9

ISSN

21682356 (Print)

21682364 (Electronic)