Open Access
Open access
Reviews on Advanced Materials Science, volume 62, issue 1

Optimizing the ECAP processing parameters of pure Cu through experimental, finite element, and response surface approaches

Abdulrahman I Alateyah 1
Mahmoud El-Shenawy 2
Ahmed Nassef 2
Medhat El Hadek 2, 3
Mohamed M. Z. Ahmed 4, 5
Hanan Kouta 2
Samar El Sanabary 2
Waleed H El Garaihy 1, 6
Publication typeJournal Article
Publication date2023-01-01
scimago Q2
SJR0.572
CiteScore5.1
Impact factor3.6
ISSN16065131, 16058127
Condensed Matter Physics
General Materials Science
Abstract

The main aim of the current work is to investigate the effect of equal channel angular pressing (ECAP) processing parameters, namely, number of passes, ECAP die angle, route type, and processing temperature on the mechanical and electrical properties of pure copper (Cu). The finite element method was used to simulate the homogeneity of stress and plastic strain distribution during ECAP processing. The response surface methodology (RSM) was used to identify the optimum ECAP processing parameters by analyzing the impact of ECAP conditions on responses. A second-order regression model and analysis of variance were created to analyze the ECAP condition of optimum responses. A genetic algorithm (GA) was also applied to optimize the ECAP condition. Finally, a hybrid RSM–GA was created to improve the optimization of ECAP responses and corresponding conditions evaluated using GA. The developed models were validated and compared with the experimental findings to prove that they are reliable as predictive tools. The optimization findings revealed that route Bc was more effective in improving the hardness, yield stress, ductility, and impact energy whereas route A was more effective in improving the ultimate tensile strength and the electrical conductivity of the Cu billets. Furthermore, the optimum die angle, number of passes, and processing temperature for the mechanical and electrical properties were also identified individually.

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