Open Access

Materials, volume 2, issue 4, pages 2467-2495

Thermal Conductivity of Diamond Composites

Kidalov Sergey ¹

Shakhov Fedor ¹

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Ioffe Physical-Technical Institute of the Russian Academy of Science, 26 Polytekhnicheskaya st., Saint-Petersburg, 194021, Russia |

Publication type: Journal Article

Publication date: 2009-12-21

Multidisciplinary Digital Publishing Institute (MDPI)

Journal: Materials

Quartile SCImago

Quartile WOS

Impact factor: 3.4

ISSN: 19961944

DOI: 10.3390/ma2042467

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General Materials Science

Abstract

A major problem challenging specialists in present-day materials sciences is the development of compact, cheap to fabricate heat sinks for electronic devices, primarily for computer processors, semiconductor lasers, high-power microchips, and electronics components. The materials currently used for heat sinks of such devices are aluminum and copper, with thermal conductivities of about 250 W/(m·K) and 400 W/(m·K), respectively. Significantly, the thermal expansion coefficient of metals differs markedly from those of the materials employed in semiconductor electronics (mostly silicon); one should add here the low electrical resistivity metals possess. By contrast, natural single-crystal diamond is known to feature the highest thermal conductivity of all the bulk materials studied thus far, as high as 2,200 W/(m·K). Needless to say, it cannot be applied in heat removal technology because of high cost. Recently, SiC- and AlN-based ceramics have started enjoying wide use as heat sink materials; the thermal conductivity of such composites, however, is inferior to that of metals by nearly a factor two. This prompts a challenging scientific problem to develop diamond-based composites with thermal characteristics superior to those of aluminum and copper, adjustable thermal expansion coefficient, low electrical conductivity and a moderate cost, below that of the natural single-crystal diamond. The present review addresses this problem and appraises the results reached by now in studying the possibility of developing composites in diamond-containing systems with a view of obtaining materials with a high thermal conductivity.

By date By citations

Citations by journals

	2 4 6 8 10 12
Materials	Materials, 11, 5.45% Materials 11 publications, 5.45%
Diamond and Related Materials	Diamond and Related Materials, 9, 4.46% Diamond and Related Materials 9 publications, 4.46%
Ceramics International	Ceramics International, 8, 3.96% Ceramics International 8 publications, 3.96%
Journal of Materials Science	Journal of Materials Science, 6, 2.97% Journal of Materials Science 6 publications, 2.97%
Composites - Part A: Applied Science and Manufacturing	Composites - Part A: Applied Science and Manufacturing, 6, 2.97% Composites - Part A: Applied Science and Manufacturing 6 publications, 2.97%
Journal of Alloys and Compounds	Journal of Alloys and Compounds, 6, 2.97% Journal of Alloys and Compounds 6 publications, 2.97%
Materials and Design	Materials and Design, 5, 2.48% Materials and Design 5 publications, 2.48%
Carbon	Carbon, 5, 2.48% Carbon 5 publications, 2.48%
Scientific Reports	Scientific Reports, 3, 1.49% Scientific Reports 3 publications, 1.49%
Composites Communications	Composites Communications, 3, 1.49% Composites Communications 3 publications, 1.49%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes	Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 3, 1.49% Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes 3 publications, 1.49%
Surface and Coatings Technology	Surface and Coatings Technology, 3, 1.49% Surface and Coatings Technology 3 publications, 1.49%
Open Ceramics	Open Ceramics, 3, 1.49% Open Ceramics 3 publications, 1.49%
AIP Advances	AIP Advances, 2, 0.99% AIP Advances 2 publications, 0.99%
JOM	JOM, 2, 0.99% JOM 2 publications, 0.99%
Journal of Solid State Chemistry	Journal of Solid State Chemistry, 2, 0.99% Journal of Solid State Chemistry 2 publications, 0.99%
Journal of Materials Processing Technology	Journal of Materials Processing Technology, 2, 0.99% Journal of Materials Processing Technology 2 publications, 0.99%
Composites Part B: Engineering	Composites Part B: Engineering, 2, 0.99% Composites Part B: Engineering 2 publications, 0.99%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing	Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2, 0.99% Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing 2 publications, 0.99%
Separation and Purification Technology	Separation and Purification Technology, 2, 0.99% Separation and Purification Technology 2 publications, 0.99%
Materials Science and Engineering B: Solid-State Materials for Advanced Technology	Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 2, 0.99% Materials Science and Engineering B: Solid-State Materials for Advanced Technology 2 publications, 0.99%
Advanced Engineering Materials	Advanced Engineering Materials, 2, 0.99% Advanced Engineering Materials 2 publications, 0.99%
ACS applied materials & interfaces	ACS applied materials & interfaces, 2, 0.99% ACS applied materials & interfaces 2 publications, 0.99%
ACS Applied Electronic Materials	ACS Applied Electronic Materials, 2, 0.99% ACS Applied Electronic Materials 2 publications, 0.99%
Industrial & Engineering Chemistry Research	Industrial & Engineering Chemistry Research, 2, 0.99% Industrial & Engineering Chemistry Research 2 publications, 0.99%
RSC Advances	RSC Advances, 2, 0.99% RSC Advances 2 publications, 0.99%
Physics of the Solid State	Physics of the Solid State, 2, 0.99% Physics of the Solid State 2 publications, 0.99%
Journal of Superhard Materials	Journal of Superhard Materials, 2, 0.99% Journal of Superhard Materials 2 publications, 0.99%
Journal of Applied Physics	Journal of Applied Physics, 1, 0.5% Journal of Applied Physics 1 publication, 0.5%

	2 4 6 8 10 12

Citations by publishers

	10 20 30 40 50 60 70 80
Elsevier	Elsevier, 80, 39.6% Elsevier 80 publications, 39.6%
Springer Nature	Springer Nature, 22, 10.89% Springer Nature 22 publications, 10.89%
Multidisciplinary Digital Publishing Institute (MDPI)	Multidisciplinary Digital Publishing Institute (MDPI), 16, 7.92% Multidisciplinary Digital Publishing Institute (MDPI) 16 publications, 7.92%
American Chemical Society (ACS)	American Chemical Society (ACS), 12, 5.94% American Chemical Society (ACS) 12 publications, 5.94%
Wiley	Wiley, 10, 4.95% Wiley 10 publications, 4.95%
IOP Publishing	IOP Publishing, 6, 2.97% IOP Publishing 6 publications, 2.97%
Pleiades Publishing	Pleiades Publishing, 6, 2.97% Pleiades Publishing 6 publications, 2.97%
American Institute of Physics (AIP)	American Institute of Physics (AIP), 5, 2.48% American Institute of Physics (AIP) 5 publications, 2.48%
Royal Society of Chemistry (RSC)	Royal Society of Chemistry (RSC), 5, 2.48% Royal Society of Chemistry (RSC) 5 publications, 2.48%
IEEE	IEEE, 5, 2.48% IEEE 5 publications, 2.48%
American Physical Society (APS)	American Physical Society (APS), 3, 1.49% American Physical Society (APS) 3 publications, 1.49%
Japan Society of Applied Physics	Japan Society of Applied Physics, 3, 1.49% Japan Society of Applied Physics 3 publications, 1.49%
Taylor & Francis	Taylor & Francis, 2, 0.99% Taylor & Francis 2 publications, 0.99%
ASME	ASME, 1, 0.5% ASME 1 publication, 0.5%
World Scientific	World Scientific, 1, 0.5% World Scientific 1 publication, 0.5%
SAGE	SAGE, 1, 0.5% SAGE 1 publication, 0.5%
Nonferrous Metals Society of China	Nonferrous Metals Society of China, 1, 0.5% Nonferrous Metals Society of China 1 publication, 0.5%
ASM International	ASM International, 1, 0.5% ASM International 1 publication, 0.5%
SPIE	SPIE, 1, 0.5% SPIE 1 publication, 0.5%
Oxford University Press	Oxford University Press, 1, 0.5% Oxford University Press 1 publication, 0.5%
Hindawi Limited	Hindawi Limited, 1, 0.5% Hindawi Limited 1 publication, 0.5%
Trans Tech Publications	Trans Tech Publications, 1, 0.5% Trans Tech Publications 1 publication, 0.5%
Proceedings of the National Academy of Sciences (PNAS)	Proceedings of the National Academy of Sciences (PNAS), 1, 0.5% Proceedings of the National Academy of Sciences (PNAS) 1 publication, 0.5%
American Institute of Mathematical Sciences (AIMS)	American Institute of Mathematical Sciences (AIMS), 1, 0.5% American Institute of Mathematical Sciences (AIMS) 1 publication, 0.5%
Altai State University	Altai State University, 1, 0.5% Altai State University 1 publication, 0.5%
Chinese Physical Society	Chinese Physical Society, 1, 0.5% Chinese Physical Society 1 publication, 0.5%
SAE International	SAE International, 1, 0.5% SAE International 1 publication, 0.5%
Walter de Gruyter	Walter de Gruyter, 1, 0.5% Walter de Gruyter 1 publication, 0.5%

	10 20 30 40 50 60 70 80

We do not take into account publications that without a DOI.
Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
Statistics recalculated weekly.

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Kidalov S., Shakhov F. Thermal Conductivity of Diamond Composites // Materials. 2009. Vol. 2. No. 4. pp. 2467-2495.

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Kidalov S., Shakhov F. Thermal Conductivity of Diamond Composites // Materials. 2009. Vol. 2. No. 4. pp. 2467-2495.

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TY - JOUR

DO - 10.3390/ma2042467

UR - https://doi.org/10.3390%2Fma2042467

TI - Thermal Conductivity of Diamond Composites

T2 - Materials

AU - Kidalov, Sergey

AU - Shakhov, Fedor

PY - 2009

DA - 2009/12/21 00:00:00

PB - Multidisciplinary Digital Publishing Institute (MDPI)

SP - 2467-2495

IS - 4

VL - 2

SN - 1996-1944

ER -

BibTex |

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@article{2009_Kidalov,

author = {Sergey Kidalov and Fedor Shakhov},

title = {Thermal Conductivity of Diamond Composites},

journal = {Materials},

year = {2009},

volume = {2},

publisher = {Multidisciplinary Digital Publishing Institute (MDPI)},

month = {dec},

url = {https://doi.org/10.3390%2Fma2042467},

number = {4},

pages = {2467--2495},

doi = {10.3390/ma2042467}

}

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Kidalov, Sergey, and Fedor Shakhov. “Thermal Conductivity of Diamond Composites.” Materials, vol. 2, no. 4, Dec. 2009, pp. 2467-2495. https://doi.org/10.3390%2Fma2042467.

Found error?

Publisher

Multidisciplinary Digital Publishing Institute (MDPI)

Journal

Materials

Quartile SCImago

Quartile WOS

Impact factor

3.4

ISSN

19961944 (Print)

Labs

Laboratory of Physics of Cluster Structures