Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, volume 59, issue SI, pages SIIL09
Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding
Yasuhiro KUNTANI
1
,
Daiki Goto
1
,
Kana MAEKAWA
1
,
KENTA KODAMA
1
,
Shunsuke KANETSUKI
2
,
Shugo Miyake
3
,
Takahiro Namazu
4
1
Aich Institute of Technology, Aichi 470-0392, Japan
|
2
Kobelco Research Institute, Inc., Hyogo 675-0023, Japan
|
3
Kobe City College of Technology, Hyogo 651-2194, Japan
|
Publication type: Journal Article
Publication date: 2020-04-28
Quartile SCImago
Q2
Quartile WOS
Q4
Impact factor: 1.5
ISSN: 00214922, 13474065
General Physics and Astronomy
Physics and Astronomy (miscellaneous)
General Engineering
Abstract
In this study, we describe the development of a new solder bonding technique using a Ti/Si multilayer film, which can be conducted by mechanical shock only. A Ti/Si multilayer film is a self-propagating exothermic reactive material that can be ignited by applying both mechanical and electrical shocks (e.g. a spark in the latter case). The influence of bilayer thickness on film ignition was investigated by means of mechanical impact testing. The threshold energy for the exothermic reaction gradually decreased with decreasing bilayer thickness. We demonstrate the effectiveness of reactive solder bonding for a Si wafer by applying mechanical shock to a 25 nm bilayer thick Ti/Si film using an anisotropic wet-etched Si pyramid.
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KUNTANI Y. et al. Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding // Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes. 2020. Vol. 59. No. SI. p. SIIL09.
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KUNTANI Y., Goto D., MAEKAWA K., KODAMA K., KANETSUKI S., Miyake S., Namazu T. Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding // Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes. 2020. Vol. 59. No. SI. p. SIIL09.
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TY - JOUR
DO - 10.35848/1347-4065/ab827f
UR - https://doi.org/10.35848/1347-4065/ab827f
TI - Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding
T2 - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
AU - KUNTANI, Yasuhiro
AU - Goto, Daiki
AU - MAEKAWA, Kana
AU - KODAMA, KENTA
AU - KANETSUKI, Shunsuke
AU - Miyake, Shugo
AU - Namazu, Takahiro
PY - 2020
DA - 2020/04/28
PB - Japan Society of Applied Physics
SP - SIIL09
IS - SI
VL - 59
SN - 0021-4922
SN - 1347-4065
ER -
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@article{2020_KUNTANI,
author = {Yasuhiro KUNTANI and Daiki Goto and Kana MAEKAWA and KENTA KODAMA and Shunsuke KANETSUKI and Shugo Miyake and Takahiro Namazu},
title = {Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding},
journal = {Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes},
year = {2020},
volume = {59},
publisher = {Japan Society of Applied Physics},
month = {apr},
url = {https://doi.org/10.35848/1347-4065/ab827f},
number = {SI},
pages = {SIIL09},
doi = {10.35848/1347-4065/ab827f}
}
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MLA
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KUNTANI, Yasuhiro, et al. “Mechanical shock-induced self-propagating exothermic reaction in Ti/Si multilayer nanofilms for low-power reactive bonding.” Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, vol. 59, no. SI, Apr. 2020, p. SIIL09. https://doi.org/10.35848/1347-4065/ab827f.