Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components and Packaging Technologies

, volume 33 , issue 4 , pages 754-760

UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

Wim Christiaens ¹

Erwin Bosman ¹

Jan Vanfleteren ¹

Hide authors affiliations Show authors affiliations: 1 affiliation

Center of Microsystems Technology (CMST), Department of Electronics and Information Systems, Ghent University, Ghent, Belgium |

Publication type: Journal Article

Publication date: 2010-12-01

Institute of Electrical and Electronics Engineers (IEEE)

IEEE Transactions on Components and Packaging Technologies

SJR: —

CiteScore: —

Impact factor: —

ISSN: 15213331, 15579972

DOI: 10.1109/tcapt.2010.2060198

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Electronic, Optical and Magnetic Materials

Electrical and Electronic Engineering

Abstract

Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.

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Christiaens W., Bosman E., Vanfleteren J. UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology // IEEE Transactions on Components and Packaging Technologies. 2010. Vol. 33. No. 4. pp. 754-760.

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RIS |

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RIS Copy

TY - JOUR

DO - 10.1109/tcapt.2010.2060198

UR - https://doi.org/10.1109/tcapt.2010.2060198

TI - UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

T2 - IEEE Transactions on Components and Packaging Technologies

AU - Christiaens, Wim

AU - Bosman, Erwin

AU - Vanfleteren, Jan

PY - 2010

DA - 2010/12/01

PB - Institute of Electrical and Electronics Engineers (IEEE)

SP - 754-760

IS - 4

VL - 33

SN - 1521-3331

SN - 1557-9972

ER -

BibTex |

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@article{2010_Christiaens,

author = {Wim Christiaens and Erwin Bosman and Jan Vanfleteren},

title = {UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology},

journal = {IEEE Transactions on Components and Packaging Technologies},

year = {2010},

volume = {33},

publisher = {Institute of Electrical and Electronics Engineers (IEEE)},

month = {dec},

url = {https://doi.org/10.1109/tcapt.2010.2060198},

number = {4},

pages = {754--760},

doi = {10.1109/tcapt.2010.2060198}

}

MLA

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MLA Copy

Christiaens, Wim, et al. “UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology.” IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 4, Dec. 2010, pp. 754-760. https://doi.org/10.1109/tcapt.2010.2060198.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Journal

IEEE Transactions on Components and Packaging Technologies

SJR

—

CiteScore

—

Impact factor

—

ISSN

15213331 (Print)

15579972 (Electronic)