IEEE Transactions on Components and Packaging Technologies

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 15213331, 15579972

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journal names
IEEE Transactions on Components and Packaging Technologies
Publications
1 388
Citations
31 373
h-index
75
Top-3 organizations
Samsung
Samsung (31 publications)
Top-3 countries
USA (570 publications)
China (142 publications)
Republic of Korea (71 publications)

Most cited in 5 years

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Publications found: 0

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Publishing countries

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USA, 570, 41.07%
China, 142, 10.23%
Republic of Korea, 71, 5.12%
Japan, 58, 4.18%
United Kingdom, 47, 3.39%
Singapore, 47, 3.39%
Canada, 41, 2.95%
France, 33, 2.38%
Germany, 32, 2.31%
Netherlands, 26, 1.87%
Sweden, 23, 1.66%
Finland, 22, 1.59%
Belgium, 17, 1.22%
Ireland, 17, 1.22%
Italy, 14, 1.01%
Hungary, 13, 0.94%
India, 12, 0.86%
Switzerland, 10, 0.72%
Austria, 9, 0.65%
Spain, 9, 0.65%
Poland, 8, 0.58%
Australia, 7, 0.5%
Egypt, 5, 0.36%
Russia, 4, 0.29%
Kuwait, 4, 0.29%
Turkey, 4, 0.29%
Malaysia, 3, 0.22%
Pakistan, 3, 0.22%
Greece, 2, 0.14%
Israel, 2, 0.14%
Norway, 2, 0.14%
Serbia, 2, 0.14%
Slovenia, 2, 0.14%
Philippines, 2, 0.14%
Czech Republic, 2, 0.14%
South Africa, 2, 0.14%
Portugal, 1, 0.07%
Brazil, 1, 0.07%
Iran, 1, 0.07%
Morocco, 1, 0.07%
Mexico, 1, 0.07%
Thailand, 1, 0.07%
Yugoslavia, 1, 0.07%
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