IEEE Transactions on Components and Packaging Technologies

Institute of Electrical and Electronics Engineers (IEEE)
Institute of Electrical and Electronics Engineers (IEEE)
ISSN: 15213331, 15579972
Publications
1 388
Citations
31 191
h-index
75
Publications
0
Citations
8 390
Top-3 organizations
Samsung
Samsung (31 publications)
Top-3 countries
USA (570 publications)
China (142 publications)
Republic of Korea (71 publications)

Most cited in 5 years

Found 
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Publications found: 0

Top-100

Citing journals

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IEEE Transactions on Components, Packaging and Manufacturing Technology
1197 citations, 3.84%
International Journal of Heat and Mass Transfer
1050 citations, 3.37%
Microelectronics Reliability
1010 citations, 3.24%
IEEE Transactions on Components and Packaging Technologies
845 citations, 2.71%
Applied Thermal Engineering
708 citations, 2.27%
Journal of Electronic Packaging, Transactions of the ASME
625 citations, 2%
Journal of Electronic Materials
413 citations, 1.32%
Journal of Heat Transfer
281 citations, 0.9%
International Journal of Thermal Sciences
268 citations, 0.86%
Journal of Materials Science: Materials in Electronics
246 citations, 0.79%
IEEE Transactions on Power Electronics
240 citations, 0.77%
IEEE Transactions on Device and Materials Reliability
221 citations, 0.71%
Journal of Micromechanics and Microengineering
207 citations, 0.66%
IEEE Transactions on Advanced Packaging
196 citations, 0.63%
Energies
192 citations, 0.62%
Journal of Applied Physics
190 citations, 0.61%
International Communications in Heat and Mass Transfer
170 citations, 0.55%
Heat Transfer Engineering
169 citations, 0.54%
Microelectronics Journal
150 citations, 0.48%
Soldering and Surface Mount Technology
146 citations, 0.47%
IEEE Access
143 citations, 0.46%
IEEE Transactions on Electron Devices
135 citations, 0.43%
Journal of Alloys and Compounds
125 citations, 0.4%
Applied Physics Letters
125 citations, 0.4%
Sensors and Actuators, A: Physical
114 citations, 0.37%
Journal Physics D: Applied Physics
107 citations, 0.34%
Journal of Thermal Science and Engineering Applications
98 citations, 0.31%
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
97 citations, 0.31%
Energy Conversion and Management
97 citations, 0.31%
IEEE Transactions on Electronics Packaging Manufacturing
94 citations, 0.3%
SAE Technical Papers
93 citations, 0.3%
Applied Energy
91 citations, 0.29%
Journal of Microelectromechanical Systems
91 citations, 0.29%
Experimental Thermal and Fluid Science
90 citations, 0.29%
Microelectronic Engineering
88 citations, 0.28%
Heat and Mass Transfer
85 citations, 0.27%
Materials
84 citations, 0.27%
Micromachines
83 citations, 0.27%
Numerical Heat Transfer; Part A: Applications
81 citations, 0.26%
IEEE Transactions on Plasma Science
80 citations, 0.26%
Microsystem Technologies
78 citations, 0.25%
Sensors
78 citations, 0.25%
Advanced Materials Research
78 citations, 0.25%
ACS applied materials & interfaces
76 citations, 0.24%
Journal of Physics: Conference Series
74 citations, 0.24%
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
74 citations, 0.24%
IEEE Transactions on Industrial Electronics
73 citations, 0.23%
IEEE Sensors Journal
70 citations, 0.22%
Journal of Materials Science
68 citations, 0.22%
Renewable and Sustainable Energy Reviews
68 citations, 0.22%
Electronics (Switzerland)
67 citations, 0.21%
Thermal Science and Engineering Progress
67 citations, 0.21%
Journal of Thermophysics and Heat Transfer
67 citations, 0.21%
Journal of Adhesion Science and Technology
66 citations, 0.21%
Journal of Applied Polymer Science
64 citations, 0.21%
Journal of Power Sources
62 citations, 0.2%
Applied Sciences (Switzerland)
61 citations, 0.2%
Applied Mechanics and Materials
61 citations, 0.2%
IOP Conference Series: Materials Science and Engineering
60 citations, 0.19%
IEEE Transactions on Microwave Theory and Techniques
60 citations, 0.19%
IEEE Transactions on Industry Applications
57 citations, 0.18%
Microelectronics International
56 citations, 0.18%
Journal of the Electrochemical Society
56 citations, 0.18%
Review of Scientific Instruments
55 citations, 0.18%
Carbon
52 citations, 0.17%
Energy
51 citations, 0.16%
Ceramics International
49 citations, 0.16%
IEEE Journal of Emerging and Selected Topics in Power Electronics
49 citations, 0.16%
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
49 citations, 0.16%
Tribology International
48 citations, 0.15%
Case Studies in Thermal Engineering
47 citations, 0.15%
Journal of Mechanical Science and Technology
47 citations, 0.15%
Applied Surface Science
47 citations, 0.15%
Physics of Fluids
47 citations, 0.15%
Nanotechnology
47 citations, 0.15%
Journal of Energy Storage
47 citations, 0.15%
Journal of Materials Research
46 citations, 0.15%
Journal of Thermal Analysis and Calorimetry
46 citations, 0.15%
MRS Proceedings
46 citations, 0.15%
Scientific Reports
45 citations, 0.14%
IEICE Transactions on Electronics
44 citations, 0.14%
International Journal of Advanced Manufacturing Technology
42 citations, 0.13%
RSC Advances
41 citations, 0.13%
Materials Transactions
41 citations, 0.13%
IEEE Transactions on Instrumentation and Measurement
41 citations, 0.13%
AIP Conference Proceedings
41 citations, 0.13%
AIP Advances
40 citations, 0.13%
International Journal of Adhesion and Adhesives
40 citations, 0.13%
IEEE Transactions on Reliability
40 citations, 0.13%
Thin Solid Films
39 citations, 0.13%
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
39 citations, 0.13%
Plasma Science and Technology
38 citations, 0.12%
Surface and Coatings Technology
38 citations, 0.12%
Composites Science and Technology
37 citations, 0.12%
IEEE Transactions on Magnetics
36 citations, 0.12%
Polymers
36 citations, 0.12%
Proceedings of the IEEE
36 citations, 0.12%
IEEE Transactions on Power Delivery
35 citations, 0.11%
IEEE Transactions on Dielectrics and Electrical Insulation
35 citations, 0.11%
Engineering Fracture Mechanics
35 citations, 0.11%
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Citing publishers

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Institute of Electrical and Electronics Engineers (IEEE)
10067 citations, 32.28%
Elsevier
7196 citations, 23.07%
Springer Nature
2249 citations, 7.21%
ASME International
1174 citations, 3.76%
Wiley
912 citations, 2.92%
MDPI
865 citations, 2.77%
IOP Publishing
796 citations, 2.55%
Taylor & Francis
760 citations, 2.44%
AIP Publishing
577 citations, 1.85%
Emerald
303 citations, 0.97%
American Chemical Society (ACS)
299 citations, 0.96%
Trans Tech Publications
252 citations, 0.81%
Royal Society of Chemistry (RSC)
193 citations, 0.62%
SAGE
173 citations, 0.55%
American Institute of Aeronautics and Astronautics (AIAA)
133 citations, 0.43%
SAE International
107 citations, 0.34%
Japan Society of Applied Physics
104 citations, 0.33%
Cambridge University Press
98 citations, 0.31%
The Electrochemical Society
96 citations, 0.31%
Optica Publishing Group
89 citations, 0.29%
Institution of Engineering and Technology (IET)
80 citations, 0.26%
Hindawi Limited
78 citations, 0.25%
SPIE-Intl Soc Optical Eng
64 citations, 0.21%
Korean Society of Mechanical Engineers
59 citations, 0.19%
World Scientific
58 citations, 0.19%
EDP Sciences
50 citations, 0.16%
American Physical Society (APS)
50 citations, 0.16%
Association for Computing Machinery (ACM)
48 citations, 0.15%
Japan Institute of Metals
43 citations, 0.14%
Walter de Gruyter
41 citations, 0.13%
Pleiades Publishing
39 citations, 0.13%
Institute of Electronics, Information and Communications Engineers (IEICE)
36 citations, 0.12%
34 citations, 0.11%
IGI Global
30 citations, 0.1%
American Vacuum Society
29 citations, 0.09%
28 citations, 0.09%
Japan Society of Mechanical Engineers
21 citations, 0.07%
The Korean Society of Precision Engineering
19 citations, 0.06%
Taiwan Institute of Chemical Engineers
19 citations, 0.06%
IntechOpen
19 citations, 0.06%
Frontiers Media S.A.
17 citations, 0.05%
National Library of Serbia
17 citations, 0.05%
Begell House
15 citations, 0.05%
Korean Institute of Metals and Materials
15 citations, 0.05%
Institute of Electrical Engineers of Japan (IEE Japan)
15 citations, 0.05%
Electromagnetics Academy
14 citations, 0.04%
American Society of Civil Engineers (ASCE)
13 citations, 0.04%
Korean Institute of Electrical Engineers
12 citations, 0.04%
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
12 citations, 0.04%
Oxford University Press
11 citations, 0.04%
American Association for the Advancement of Science (AAAS)
11 citations, 0.04%
International Microelectronics And Packaging Society
11 citations, 0.04%
IMAPS - International Microelectronics Assembly and Packaging Society
11 citations, 0.04%
Zhejiang University Press
10 citations, 0.03%
Korean Institute of Power Electronics
10 citations, 0.03%
Springer New York
10 citations, 0.03%
IOS Press
9 citations, 0.03%
Public Library of Science (PLoS)
9 citations, 0.03%
Annual Reviews
9 citations, 0.03%
Japan Institute of Electronics Packaging
9 citations, 0.03%
Social Science Electronic Publishing
8 citations, 0.03%
Federal Informational-Analytical Center of the Defense Industry
7 citations, 0.02%
China Science Publishing & Media
7 citations, 0.02%
Nonferrous Metals Society of China
6 citations, 0.02%
ASTM International
6 citations, 0.02%
ASM International
5 citations, 0.02%
Acoustical Society of America (ASA)
5 citations, 0.02%
5 citations, 0.02%
Polish Maintenance Society
5 citations, 0.02%
The Korean Institute of Electrical and Electronic Material Engineers
5 citations, 0.02%
Thomas Telford
5 citations, 0.02%
Tech Science Press
5 citations, 0.02%
Hans Publishers
5 citations, 0.02%
Japan Welding Society
5 citations, 0.02%
Bentham Science Publishers Ltd.
4 citations, 0.01%
Society for Industrial and Applied Mathematics (SIAM)
4 citations, 0.01%
Laser Institute of America
4 citations, 0.01%
4 citations, 0.01%
Society of Rheology
4 citations, 0.01%
Tsinghua University Press
4 citations, 0.01%
Beilstein-Institut
4 citations, 0.01%
The Surface Finishing Society of Japan
4 citations, 0.01%
Scientific Research Publishing
4 citations, 0.01%
The Society of Materials Science, Japan
4 citations, 0.01%
3 citations, 0.01%
The Royal Society
3 citations, 0.01%
American Institute of Mathematical Sciences (AIMS)
3 citations, 0.01%
University of Suceava
3 citations, 0.01%
American Scientific Publishers
3 citations, 0.01%
Iron and Steel Institute of Japan
3 citations, 0.01%
3 citations, 0.01%
Shanghai Jiaotong University Press
3 citations, 0.01%
Yildiz Technical University
3 citations, 0.01%
Belarusian National Technical University
3 citations, 0.01%
Materials Research Society of Korea
3 citations, 0.01%
Ain Shams University
3 citations, 0.01%
3 citations, 0.01%
Science in China Press
3 citations, 0.01%
International Academy Publishing (IAP)
3 citations, 0.01%
Research Square Platform LLC
3 citations, 0.01%
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Publishing organizations

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University of Maryland, College Park
88 publications, 6.34%
Georgia Institute of technology
83 publications, 5.98%
Samsung
31 publications, 2.23%
Nanyang Technological University
27 publications, 1.95%
Purdue University
25 publications, 1.8%
Binghamton University
23 publications, 1.66%
University of Southampton
20 publications, 1.44%
National Tsing Hua University
18 publications, 1.3%
Royal Philips
18 publications, 1.3%
National Cheng Kung University
17 publications, 1.22%
Korea Advanced Institute of Science and Technology
16 publications, 1.15%
Hong Kong University of Science and Technology
16 publications, 1.15%
University of California, Irvine
13 publications, 0.94%
Virginia Tech
12 publications, 0.86%
National University of Singapore
11 publications, 0.79%
Industrial Technology Research Institute
11 publications, 0.79%
University of California, Santa Cruz
10 publications, 0.72%
University of Waterloo
10 publications, 0.72%
KTH Royal Institute of Technology
9 publications, 0.65%
Polytechnic University of Milan
9 publications, 0.65%
Osaka University
9 publications, 0.65%
Katholieke Universiteit Leuven
8 publications, 0.58%
Feng Chia University
8 publications, 0.58%
Mid Sweden University
7 publications, 0.5%
Aalto University
7 publications, 0.5%
Carnegie Mellon University
7 publications, 0.5%
Interuniversity Microelectronics Centre
7 publications, 0.5%
California Institute of Technology
7 publications, 0.5%
Jet Propulsion Laboratory
7 publications, 0.5%
University of Minnesota
7 publications, 0.5%
Xi'an Jiaotong University
6 publications, 0.43%
Chalmers University of Technology
6 publications, 0.43%
University of Edinburgh
6 publications, 0.43%
Chang Gung University
6 publications, 0.43%
Cornell University
6 publications, 0.43%
Korea University
6 publications, 0.43%
Korea Institute of Science and Technology
6 publications, 0.43%
City University of Hong Kong
6 publications, 0.43%
University of California, Berkeley
6 publications, 0.43%
Southern Methodist University
6 publications, 0.43%
Rensselaer Polytechnic Institute
6 publications, 0.43%
Infineon Technologies AG
6 publications, 0.43%
Loughborough University
5 publications, 0.36%
National Yang Ming Chiao Tung University
5 publications, 0.36%
Yonsei University
5 publications, 0.36%
Arizona State University
5 publications, 0.36%
University of Michigan
5 publications, 0.36%
Texas Instruments
5 publications, 0.36%
University of Colorado Boulder
5 publications, 0.36%
Sandia National Laboratories
5 publications, 0.36%
Indian Institute of Science
4 publications, 0.29%
South China University of Technology
4 publications, 0.29%
Kuwait University
4 publications, 0.29%
University of Gävle
4 publications, 0.29%
Tianjin University
4 publications, 0.29%
Massachusetts Institute of Technology
4 publications, 0.29%
National Taiwan University
4 publications, 0.29%
Pennsylvania State University
4 publications, 0.29%
Royal Melbourne Institute of Technology
4 publications, 0.29%
Sungkyunkwan University
4 publications, 0.29%
Budapest University of Technology and Economics
4 publications, 0.29%
Vanderbilt University
4 publications, 0.29%
Trinity College Dublin
4 publications, 0.29%
Agency for Science, Technology and Research
4 publications, 0.29%
Fraunhofer Institute for Reliability and Microintegration
4 publications, 0.29%
National University of Sciences & Technology
3 publications, 0.22%
Tsinghua University
3 publications, 0.22%
Ghent University
3 publications, 0.22%
University of Bordeaux
3 publications, 0.22%
Tampere University
3 publications, 0.22%
Beijing University of Technology
3 publications, 0.22%
National Sun Yat-sen University
3 publications, 0.22%
Shanghai University
3 publications, 0.22%
Northwestern University
3 publications, 0.22%
University of California, Los Angeles
3 publications, 0.22%
University of Arizona
3 publications, 0.22%
University at Buffalo, State University of New York
3 publications, 0.22%
Keio University
3 publications, 0.22%
Wayne State University
3 publications, 0.22%
Purdue University Northwest
3 publications, 0.22%
Fujitsu Limited
3 publications, 0.22%
Mitsubishi Electric Corporation
3 publications, 0.22%
Toshiba Corporation
3 publications, 0.22%
University of Sheffield
3 publications, 0.22%
Lehigh University
3 publications, 0.22%
University of Navarra
3 publications, 0.22%
Carleton University
3 publications, 0.22%
University of Texas at Arlington
3 publications, 0.22%
CentraleSupélec
3 publications, 0.22%
Middle East Technical University
2 publications, 0.14%
Indian Institute of Technology Bombay
2 publications, 0.14%
Shanghai Jiao Tong University
2 publications, 0.14%
Beihang University
2 publications, 0.14%
University of Technology, Malaysia
2 publications, 0.14%
École Polytechnique Fédérale de Lausanne
2 publications, 0.14%
Linköping University
2 publications, 0.14%
Nanjing University of Science and Technology
2 publications, 0.14%
Southeast University
2 publications, 0.14%
University of Oulu
2 publications, 0.14%
Guangzhou University
2 publications, 0.14%
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Publishing countries

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USA, 570, 41.07%
USA
570 publications, 41.07%
China, 142, 10.23%
China
142 publications, 10.23%
Republic of Korea, 71, 5.12%
Republic of Korea
71 publications, 5.12%
Japan, 58, 4.18%
Japan
58 publications, 4.18%
United Kingdom, 47, 3.39%
United Kingdom
47 publications, 3.39%
Singapore, 47, 3.39%
Singapore
47 publications, 3.39%
Canada, 41, 2.95%
Canada
41 publications, 2.95%
France, 33, 2.38%
France
33 publications, 2.38%
Germany, 32, 2.31%
Germany
32 publications, 2.31%
Netherlands, 26, 1.87%
Netherlands
26 publications, 1.87%
Sweden, 23, 1.66%
Sweden
23 publications, 1.66%
Finland, 22, 1.59%
Finland
22 publications, 1.59%
Belgium, 17, 1.22%
Belgium
17 publications, 1.22%
Ireland, 17, 1.22%
Ireland
17 publications, 1.22%
Italy, 14, 1.01%
Italy
14 publications, 1.01%
Hungary, 13, 0.94%
Hungary
13 publications, 0.94%
India, 12, 0.86%
India
12 publications, 0.86%
Switzerland, 10, 0.72%
Switzerland
10 publications, 0.72%
Austria, 9, 0.65%
Austria
9 publications, 0.65%
Spain, 9, 0.65%
Spain
9 publications, 0.65%
Poland, 8, 0.58%
Poland
8 publications, 0.58%
Australia, 7, 0.5%
Australia
7 publications, 0.5%
Egypt, 5, 0.36%
Egypt
5 publications, 0.36%
Russia, 4, 0.29%
Russia
4 publications, 0.29%
Kuwait, 4, 0.29%
Kuwait
4 publications, 0.29%
Turkey, 4, 0.29%
Turkey
4 publications, 0.29%
Malaysia, 3, 0.22%
Malaysia
3 publications, 0.22%
Pakistan, 3, 0.22%
Pakistan
3 publications, 0.22%
Greece, 2, 0.14%
Greece
2 publications, 0.14%
Israel, 2, 0.14%
Israel
2 publications, 0.14%
Norway, 2, 0.14%
Norway
2 publications, 0.14%
Serbia, 2, 0.14%
Serbia
2 publications, 0.14%
Slovenia, 2, 0.14%
Slovenia
2 publications, 0.14%
Philippines, 2, 0.14%
Philippines
2 publications, 0.14%
Czech Republic, 2, 0.14%
Czech Republic
2 publications, 0.14%
South Africa, 2, 0.14%
South Africa
2 publications, 0.14%
Portugal, 1, 0.07%
Portugal
1 publication, 0.07%
Brazil, 1, 0.07%
Brazil
1 publication, 0.07%
Iran, 1, 0.07%
Iran
1 publication, 0.07%
Morocco, 1, 0.07%
Morocco
1 publication, 0.07%
Mexico, 1, 0.07%
Mexico
1 publication, 0.07%
Thailand, 1, 0.07%
Thailand
1 publication, 0.07%
Yugoslavia, 1, 0.07%
Yugoslavia
1 publication, 0.07%
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