,
volume 18
,
issue 1
,
pages 122-126
Thermostable trilayer resist for niobium lift-off
2
France Telecom, C.N.E.T. - Grenoble, DTM/TFM, F-38243 Meylan Cedex, France
|
Publication type: Journal Article
Publication date: 2000-01-01
SJR: —
CiteScore: —
Impact factor: —
ISSN: 0734211X, 23279877
DOI:
10.1116/1.591162
General Engineering
Abstract
We have developed a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature Tg=235 °C and an excellent chemical stability. The superconducting critical temperature of 150-nm-wide niobium lines is above 7 K. An example of shadow evaporation of a Nb-Cu submicron hybrid structure is given. A potential application of this process is the fabrication of very small single electron devices using refractory metals.
Found
Nothing found, try to update filter.
Found
Nothing found, try to update filter.
Top-30
Journals
|
1
2
3
4
5
6
7
8
|
|
|
Applied Physics Letters
8 publications, 25.81%
|
|
|
Physical Review Letters
6 publications, 19.35%
|
|
|
Superconductor Science and Technology
4 publications, 12.9%
|
|
|
Physical Review B
3 publications, 9.68%
|
|
|
Journal of Applied Physics
2 publications, 6.45%
|
|
|
Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
2 publications, 6.45%
|
|
|
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena
1 publication, 3.23%
|
|
|
Physica E: Low-Dimensional Systems and Nanostructures
1 publication, 3.23%
|
|
|
Modern Physics Letters B
1 publication, 3.23%
|
|
|
Applied Physics Express
1 publication, 3.23%
|
|
|
Nanotechnology
1 publication, 3.23%
|
|
|
1
2
3
4
5
6
7
8
|
Publishers
|
2
4
6
8
10
|
|
|
AIP Publishing
10 publications, 32.26%
|
|
|
American Physical Society (APS)
9 publications, 29.03%
|
|
|
IOP Publishing
5 publications, 16.13%
|
|
|
American Vacuum Society
3 publications, 9.68%
|
|
|
Elsevier
1 publication, 3.23%
|
|
|
World Scientific
1 publication, 3.23%
|
|
|
Japan Society of Applied Physics
1 publication, 3.23%
|
|
|
2
4
6
8
10
|
- We do not take into account publications without a DOI.
- Statistics recalculated weekly.
Are you a researcher?
Create a profile to get free access to personal recommendations for colleagues and new articles.
Metrics
31
Total citations:
31
Citations from 2024:
0
Cite this
GOST |
RIS |
BibTex |
MLA
Cite this
GOST
Copy
Dubos P. et al. Thermostable trilayer resist for niobium lift-off // Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena. 2000. Vol. 18. No. 1. pp. 122-126.
GOST all authors (up to 50)
Copy
Dubos P., Charlat P., Crozes T., Paniez P., Pannetier B. Thermostable trilayer resist for niobium lift-off // Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena. 2000. Vol. 18. No. 1. pp. 122-126.
Cite this
RIS
Copy
TY - JOUR
DO - 10.1116/1.591162
UR - https://pubs.aip.org/jvb/article/18/1/122/470188/Thermostable-trilayer-resist-for-niobium-lift-off
TI - Thermostable trilayer resist for niobium lift-off
T2 - Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
AU - Dubos, P
AU - Charlat, P.
AU - Crozes, Th.
AU - Paniez, P.
AU - Pannetier, B.
PY - 2000
DA - 2000/01/01
PB - American Vacuum Society
SP - 122-126
IS - 1
VL - 18
SN - 0734-211X
SN - 2327-9877
ER -
Cite this
BibTex (up to 50 authors)
Copy
@article{2000_Dubos,
author = {P Dubos and P. Charlat and Th. Crozes and P. Paniez and B. Pannetier},
title = {Thermostable trilayer resist for niobium lift-off},
journal = {Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena},
year = {2000},
volume = {18},
publisher = {American Vacuum Society},
month = {jan},
url = {https://pubs.aip.org/jvb/article/18/1/122/470188/Thermostable-trilayer-resist-for-niobium-lift-off},
number = {1},
pages = {122--126},
doi = {10.1116/1.591162}
}
Cite this
MLA
Copy
Dubos, P., et al. “Thermostable trilayer resist for niobium lift-off.” Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, vol. 18, no. 1, Jan. 2000, pp. 122-126. https://pubs.aip.org/jvb/article/18/1/122/470188/Thermostable-trilayer-resist-for-niobium-lift-off.