ECS Journal of Solid State Science and Technology, volume 11, issue 2, pages 24001
Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
Publication type: Journal Article
Publication date: 2022-01-28
Quartile SCImago
Q3
Quartile WOS
Q3
Impact factor: 2.2
ISSN: 21628769, 21628777
Electronic, Optical and Magnetic Materials
Abstract
This paper reviews the most significant qualification and reliability achievements obtained, over the last 6 years, by the scientific community for hybrid bonding-based interconnects (HB) also named Cu–Cu or Cu/SiO2 bonding. First, the definition of words qualification, robustness and reliability are given to avoid misunderstanding about the published results. Second, the five potential threats (moisture ingress, thermomechanical stresses, electromigration, Cu diffusion, dielectric breakdown) are presented. Finally, the publications of six industrials or Research and Technology Organizations are summarized and discussed. Most of the published data are related to qualification results (pass or fail). Few studies published in-depth studies, mainly on electromigration (Black’s parameters extraction and failure analysis) and copper diffusion (electrical and analytical characterizations). To conclude, once the manufacturing issues (surface preparation, alignment…) have been solved, this technology is robust and reliable at pitches > 1 μm as it reacts, roughly, like a conventional back-end of line (BEoL) interconnect.
Top-30
Citations by journals
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ECS Journal of Solid State Science and Technology
2 publications, 11.11%
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Chemical Engineering Science
1 publication, 5.56%
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Electronic Materials Letters
1 publication, 5.56%
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IEEE Transactions on Semiconductor Manufacturing
1 publication, 5.56%
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Advanced Materials Technologies
1 publication, 5.56%
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Applied Physics Letters
1 publication, 5.56%
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IEEE Transactions on Device and Materials Reliability
1 publication, 5.56%
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Journal of Electronic Packaging, Transactions of the ASME
1 publication, 5.56%
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Materials
1 publication, 5.56%
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IEEE Transactions on Electron Devices
1 publication, 5.56%
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Russian Chemical Reviews
1 publication, 5.56%
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Journal of Electronic Materials
1 publication, 5.56%
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Citations by publishers
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7
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IEEE
7 publications, 38.89%
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The Electrochemical Society
2 publications, 11.11%
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Elsevier
1 publication, 5.56%
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Korean Institute of Metals and Materials
1 publication, 5.56%
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Wiley
1 publication, 5.56%
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American Institute of Physics (AIP)
1 publication, 5.56%
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ASME
1 publication, 5.56%
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Multidisciplinary Digital Publishing Institute (MDPI)
1 publication, 5.56%
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Autonomous Non-profit Organization Editorial Board of the journal Uspekhi Khimii
1 publication, 5.56%
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Springer Nature
1 publication, 5.56%
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- We do not take into account publications without a DOI.
- Statistics recalculated only for publications connected to researchers, organizations and labs registered on the platform.
- Statistics recalculated weekly.
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Moreau S. et al. Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements // ECS Journal of Solid State Science and Technology. 2022. Vol. 11. No. 2. p. 24001.
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Moreau S., Jourdon J., Lhostis S., Bouchu D., Ayoub B., Arnaud L., Frémont H. Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements // ECS Journal of Solid State Science and Technology. 2022. Vol. 11. No. 2. p. 24001.
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TY - JOUR
DO - 10.1149/2162-8777/ac4ffe
UR - https://doi.org/10.1149/2162-8777/ac4ffe
TI - Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
T2 - ECS Journal of Solid State Science and Technology
AU - Moreau, S.
AU - Jourdon, J.
AU - Lhostis, Sandrine
AU - Bouchu, D.
AU - Ayoub, B.
AU - Arnaud, L.
AU - Frémont, H.
PY - 2022
DA - 2022/01/28 00:00:00
PB - The Electrochemical Society
SP - 24001
IS - 2
VL - 11
SN - 2162-8769
SN - 2162-8777
ER -
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@article{2022_Moreau,
author = {S. Moreau and J. Jourdon and Sandrine Lhostis and D. Bouchu and B. Ayoub and L. Arnaud and H. Frémont},
title = {Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements},
journal = {ECS Journal of Solid State Science and Technology},
year = {2022},
volume = {11},
publisher = {The Electrochemical Society},
month = {jan},
url = {https://doi.org/10.1149/2162-8777/ac4ffe},
number = {2},
pages = {24001},
doi = {10.1149/2162-8777/ac4ffe}
}
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MLA
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Moreau, S., et al. “Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements.” ECS Journal of Solid State Science and Technology, vol. 11, no. 2, Jan. 2022, p. 24001. https://doi.org/10.1149/2162-8777/ac4ffe.