2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Institute of Electrical and Electronics Engineers (IEEE)
ISSN:
10879870
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journal names
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Top-3 citing journals

Applied Thermal Engineering
(37 citations)

International Journal of Heat and Mass Transfer
(35 citations)

Journal of Electronic Packaging, Transactions of the ASME
(29 citations)
Most cited in 5 years
Top-100
Citing journals
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Applied Thermal Engineering
37 citations, 3.93%
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International Journal of Heat and Mass Transfer
35 citations, 3.72%
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Journal of Electronic Packaging, Transactions of the ASME
29 citations, 3.08%
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IEEE Transactions on Components, Packaging and Manufacturing Technology
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Renewable and Sustainable Energy Reviews
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Journal of Heat Transfer
8 citations, 0.85%
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Experimental Thermal and Fluid Science
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Journal of Thermal Science and Engineering Applications
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Heat and Mass Transfer
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Energy Conversion and Management
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IEEE Sensors Journal
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International Journal of Thermal Sciences
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Heat Transfer Engineering
5 citations, 0.53%
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IEEE Transactions on Components and Packaging Technologies
5 citations, 0.53%
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International Journal of Heat and Fluid Flow
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Energy
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Numerical Heat Transfer; Part A: Applications
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1 citation, 0.11%
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Citing publishers
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Institute of Electrical and Electronics Engineers (IEEE)
338 citations, 35.88%
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Elsevier
207 citations, 21.97%
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Springer Nature
71 citations, 7.54%
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ASME International
46 citations, 4.88%
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Association for Computing Machinery (ACM)
23 citations, 2.44%
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15 citations, 1.59%
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Wiley
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IntechOpen
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